초록 ▼

A lead insertion machine includes a substrate supply, a conductive lead supply, and an lead insertion mechanism. The conductive leads are inserted into lead passages formed in side walls of the substrate. Also disclosed is a method of manufacturing a semiconductor die carrier including the steps of

A lead insertion machine includes a substrate supply, a conductive lead supply, and an lead insertion mechanism. The conductive leads are inserted into lead passages formed in side walls of the substrate. Also disclosed is a method of manufacturing a semiconductor die carrier including the steps of forming a plurality of conductive leads, forming a substrate for holding a semiconductor die, the substrate having a plurality of insulative side walls defining an exterior surface of said substrate, each of the side walls having a plurality of lead passages formed therethrough, and simultaneously inserting at least one of the conductive leads into the lead passage of one of the side walls for retention therein and at least one other of the conductive leads into the lead passage of another of the side walls for retention therein.

대표청구항 ▼

[ We claim:] [1.] A method of manufacturing a semiconductor die carrier including a substrate having a plurality of side walls, comprising the step of:simultaneously inserting at least one conductive lead into a lead passage through one of the side walls of the substrate for retention therein and at

[ We claim:] [1.] A method of manufacturing a semiconductor die carrier including a substrate having a plurality of side walls, comprising the step of:simultaneously inserting at least one conductive lead into a lead passage through one of the side walls of the substrate for retention therein and at least one conductive lead into a lead passage through another of the side walls of the substrate for retention therein.