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An organic positive temperature coefficient thermistor comprising a thermoplastic polymer matrix, a low-molecular organic compound having a melting point that is equal to or greater than 40.degree. C. and less than 100.degree. C. and conductive particles, each having spiky protuberances, is obtained

An organic positive temperature coefficient thermistor comprising a thermoplastic polymer matrix, a low-molecular organic compound having a melting point that is equal to or greater than 40.degree. C. and less than 100.degree. C. and conductive particles, each having spiky protuberances, is obtained by crosslinking a milled mixture of these components with a silane coupling agent comprising a vinyl group or a (meth)acryloyl group and an alkoxy group. This organic positive temperature coefficient thermistor has sufficiently low resistance at room temperature and a large rate of resistance change between an operating state and a non-operating state, and can be operated at less than 100.degree. C. with a reduced temperature vs. resistance curve hysteresis, ease of control of operating temperature, and high performance stability.

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[ What we claims is:] [1.] An organic positive temperature coefficient thermistor comprising a thermoplastic polymer matrix, a low-molecular organic compound having a melting point that is equal to or greater than 40.degree. C. and less than 100.degree. C. and conductive particles, each having spiky

[ What we claims is:] [1.] An organic positive temperature coefficient thermistor comprising a thermoplastic polymer matrix, a low-molecular organic compound having a melting point that is equal to or greater than 40.degree. C. and less than 100.degree. C. and conductive particles, each having spiky protuberances, wherein:a mixture of said thermoplastic polymer matrix, said low-molecular organic compound and said conductive particles is crosslinked with a silane coupling agent comprising a vinyl group or a (meth)acryloyl group and an alkoxy group.