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Semiconductor workpiece cleaning method and apparatus 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B08B-007/04
출원번호 US-0857364 (1997-05-15)
우선권정보 JP0299097 (1996-11-11)
발명자 / 주소
  • Konishi Toko,JPX
  • Ban Cozy,JPX
출원인 / 주소
  • Mitsubishi Denki Kabushiki Kaisha, JPX
대리인 / 주소
    Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
인용정보 피인용 횟수 : 43  인용 특허 : 13

초록

A semiconductor workpiece cleaning apparatus includes a cleaning arrangement that cleans a semiconductor workpiece by use of a cleaning liquid, a charging arrangement that brings into a chamber a drying liquid, and a discharging arrangement that discharges the cleaning liquid. The cleaning arrangeme

대표청구항

[ What is claimed is:] [1.] A semiconductor workpiece cleaning apparatus comprising:a chamber for processing a semiconductor workpiece;a support apparatus for supporting the semiconductor workpiece in said chamber;a cleaning apparatus for cleaning the semiconductor workpiece in said chamber by spray

이 특허에 인용된 특허 (13)

  1. Ogawa Mitsuhiro (Yao JPX) Ouno Toshiki (Fukuoka JPX) Ejima Taizou (Fukuoka JPX) Kotou Satoru (Amagasaki JPX), Apparatus and method for cleaning semiconductor wafers.
  2. Kamikawa Yuuji (Kumamoto JPX), Apparatus and method for drying substrates.
  3. Akatsu Hiroyuki ; Ramachandran Ravikumar, Apparatus and method for improved washing and drying of semiconductor wafers.
  4. McConnell Christopher F. (West Chester PA) Walter Alan E. (Exton PA), Apparatus for rinsing and drying surfaces.
  5. Thompson Raymon F. (137 Sherry La. Kalispell MT 59901), Centrifugal wafer processor.
  6. Fujikawa Kazonori (Shiga JPX) Tanaka Masato (Shiga JPX) Muraoka Yusuke (Kyoto JPX), Device for rinsing and drying substrate.
  7. Pierson Eric D. (Lincoln NE), Method and apparatus for cleaning disks.
  8. Mohindra Raj (Los Altos Hills CA) Bhushan Abhay (Palo Alto CA) Bhushan Rajiv (Mountain View CA) Puri Suraj (Los Altos CA) Anderson John H. (Milpitas CA) Nowell Jeffrey (San Francisco CA), Method for cleaning and drying a semiconductor wafer.
  9. Shindo Naoki,JPX ; Kitahara Shigenori,JPX ; Toshima Takayuki,JPX ; Yokomizo Kenji, Method for washing substrates.
  10. Thietje Jerry (2223 Bruynswick Rd. Wallkill NY 12589), Semiconductor wafer cleaning system.
  11. Bran Mario E. (Garden Grove CA), Single wafer megasonic semiconductor wafer processing system.
  12. Yokomizo Kenji (Onojo JPX) Tanaka Hiroshi (Kurume JPX) Mokuo Shori (Saga-ken JPX) Minami Teruomi (Kurume JPX), Substrate drying apparatus and substrate drying method.
  13. Han Suk Bin,KRX, Wafer wet treating apparatus.

이 특허를 인용한 특허 (43)

  1. Wen-Jang Lu TW; Yi-Ta Tsou TW; Hui-Xiu Tang TW, Apparatus and method for cleaning wafer.
  2. Yokomizo,Kenji, Apparatus and method of securing a workpiece during high-pressure processing.
  3. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Apparatus for supercritical processing of a workpiece.
  4. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Apparatus for supercritical processing of multiple workpieces.
  5. Wada Yutaka,JPX ; Hiyama Hirokuni,JPX ; Kimura Norio,JPX, Cleaning method and polishing apparatus employing such cleaning method.
  6. Wada, Yutaka; Hiyama, Hirokuni; Kimura, Norio, Cleaning method and polishing apparatus employing such cleaning method.
  7. Wada,Yutaka; Hiyama,Hirokuni; Kimura,Norio, Cleaning method and polishing apparatus employing such cleaning method.
  8. Jones,William Dale, Control of fluid flow in the processing of an object with a fluid.
  9. Torek, Kevin J.; Morgan, Jonathan C.; Morgan, Paul A., Delivery of dissolved ozone.
  10. Schenkl, Manfred; Pesce, Robert; Oshinowo, John; Muller, Uwe, Device and method for the treatment of semiconductor wafers.
  11. Hajime Onoda JP; Kazutoshi Watanabe JP; Hiroki Takahashi JP, Drying apparatus and drying method.
  12. Sheydayi,Alexei; Sutton,Thomas, Gate valve for plus-atmospheric pressure semiconductor process vessels.
  13. Sutton, Thomas R.; Biberger, Maximilan A., High pressure compatible vacuum chuck for semiconductor wafer including lift mechanism.
  14. Jones, William D., High pressure fourier transform infrared cell.
  15. Biberger, Maximilian A.; Layman, Frederick Paul; Sutton, Thomas Robert, High pressure processing chamber for semiconductor substrate.
  16. Biberger,Maximilian A.; Layman,Frederick Paul; Sutton,Thomas Robert, High pressure processing chamber for semiconductor substrate.
  17. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.
  18. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.
  19. Tretner, Jens; Patzig, Frank, Method and a processing device for processing at least one carrier.
  20. Thomas R. Sutton ; Robert Koch, Method and apparatus for agitation of workpiece in high pressure environment.
  21. Sheydayi,Alexei, Method and apparatus for clamping a substrate in a high pressure processing system.
  22. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method and apparatus for supercritical processing of multiple workpieces.
  23. Parent,Wayne M.; Goshi,Gentaro, Method and system for cooling a pump.
  24. Parent,Wayne M., Method and system for determining flow conditions in a high pressure processing system.
  25. Parent, Wayne M.; Geshell, Dan R., Method and system for passivating a processing chamber.
  26. Hansen,Brandon; Lowe,Marie, Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid.
  27. Kawamura,Kohei; Asano,Akira; Miyatani,Koutarou; Hillman,Joseph T.; Palmer,Bentley, Method for supercritical carbon dioxide processing of fluoro-carbon films.
  28. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method for supercritical processing of multiple workpieces.
  29. Chiou, Jiann-Jen, Method of rinsing residual etching reactants/products on a semiconductor wafer.
  30. Biberger,Maximilian Albert; Layman,Frederick Paul; Sutton,Thomas Robert, Method of supercritical processing of a workpiece.
  31. Sheydayi,Alexei, Non-contact shuttle valve for flow diversion in high pressure systems.
  32. Sheydayi,Alexei, Pressure energized pressure vessel opening and closing device and method of providing therefor.
  33. Wuester,Christopher D., Process flow thermocouple.
  34. Okorn-Schmidt, Harald; Frank, Dieter; Kumnig, Franz, Process for treating a semiconductor wafer.
  35. Mullee, William H., Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process.
  36. Liu Yu-tsai,TWX, Single chamber processing apparatus having multi-chamber functions.
  37. Masahiro Kimura JP; Hiroyuki Araki JP, Substrate drying apparatus and substrate processing apparatus.
  38. Sato, Hideaki, Substrate liquid processing apparatus, substrate liquid processing method and storage medium.
  39. Yoshida, Takushi; Washio, Masaya, Substrate treating system, substrate treating device, program, and recording medium.
  40. Gale,Glenn; Hillman,Joseph T.; Jacobson,Gunilla; Palmer,Bentley, System and method for processing a substrate using supercritical carbon dioxide processing.
  41. Jacobson,Gunilla; Yellowaga,Deborah, Treatment of a dielectric layer using supercritical CO.
  42. Kevwitch, Robert, Treatment of substrate using functionalizing agent in supercritical carbon dioxide.
  43. Sheydayi,Alexei, Vacuum chuck utilizing sintered material and method of providing thereof.
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