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Flat plate heat pipe cooling system for electronic equipment enclosure 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28D-015/00
출원번호 US-0061016 (1998-04-15)
발명자 / 주소
  • Li Hsi-Shang,TWX
  • Hsiao Chen-Ang,TWX
출원인 / 주소
  • Scientech Corporation, TWX
대리인 / 주소
    Bedell
인용정보 피인용 횟수 : 68  인용 특허 : 18

초록

A cooling system for an electronic equipment enclosure employs a flat plate heat pipe to deliver heat from the interior of the enclosure through a connector to a removable external heat sink. The heat pipe includes a metallic bottom plate having a depression therein containing a set of rods evenly s

대표청구항

[ What is claimed is:] [8.] A cooling system for a computer of the type having an enclosure having an interior containing heat-generating electronic components and having a cover rotatively attached by a hinge to the enclosure, the cover having a front side and a back side, the front side containing

이 특허에 인용된 특허 (18)

  1. Haley Kevin (San Jose CA) Aghazadeh Mostafa (Chandler AZ) Xie Hong (Chandler AZ), Apparatus for dissipating heat in a hinged computing device.
  2. Marcus Bruce D. (Los Angeles CA) Fleischman George L. (Inglewood CA), Flat-plate heat pipe.
  3. Mecredy ; III Henry E., Heat dissipating lid hinge structure with laterally offset heat pipe end portions.
  4. Bhatia Rakesh, Heat exchanger system for cooling a hinged computing device.
  5. Mochizuki Masataka (Tokyo JPX) Ono Motoyuki (Tokyo JPX) Mashiko Koichi (Tokyo JPX) Saito Yuji (Tokyo JPX) Hasegawa Masashi (Tokyo JPX) Nagata Masakatsu (Tokyo JPX), Heat pipe and process for manufacturing the same.
  6. Bhatia Rakesh (Sunnyvale CA) Haley Kevin (San Jose CA), Heat pipe exchanger system for cooling a hinged computing device.
  7. Garner Scott D. ; Meyer ; IV George A. ; Toth Jerome E. ; Longsderff Richard W., Heat pipes inserted into first and second parallel holes in a block for transferring heat between hinged devices.
  8. Ishida Yoshio (Osaka JPX), Heat radiating apparatus.
  9. Sun Jyi-Yu (Hsinchu TWX) Chian Tao (Hsinchu TWX) Shih Di-Kon (Hsinchu TWX) Wang Chih-Yao (Hsinchu TWX), High-efficiency isothermal heat pipe.
  10. Cipolla Thomas Mario ; Coteus Paul William ; Mok Lawrence Shungwei, Hinge incorporating a helically coiled heat pipe for a laptop computer.
  11. Meyer ; IV George A. ; Toth Jerome E., Integrated circuit with taped heat pipe.
  12. Carlsten Ronald W. (Tucson AZ) Kim Sung J. (Tucson AZ) Murphy Alan L. (Tucson AZ), Integrated heat pipe and circuit board structure.
  13. Giammaruti Robert J. (North Canton OH), Passive cooling of enclosures using heat pipes.
  14. Akachi Hisateru (Sagamihara JPX), Ribbon-like plate heat pipes.
  15. Lowry David A. ; Novin Eugene, Rotatable heat transfer coupling.
  16. Mok Lawrence Shungwei, Rotational joint for hinged heat pipe cooling of a computer.
  17. Progl Curtis L. ; Tracy Mark S. ; Moore David A., System and method for transferring heat between movable portions of a computer.
  18. Akachi Hisateru (No. 6-5-603 ; Kamitsuruma 5-chome Sagamihara City ; Kanagawa Perfecture JPX), Tunnel-plate type heat pipe.

이 특허를 인용한 특허 (68)

  1. Rosenfeld,John H.; Minnerly,Kenneth G., Brazed wick for a heat transfer device.
  2. Rosenfeld,John H.; Minnerly,Kenneth G., Brazed wick for a heat transfer device.
  3. Rosenfeld,John H.; Minnerly,Kenneth G., Brazed wick for a heat transfer device and method of making same.
  4. Li, Jia Hao, Bubble cycling heat exchanger.
  5. Chauhan, Shakti Singh; Connolly, Stuart; Shah, Binoy Milan; Hoden, Brian; Kim, Joo Han, Circuit card assembly and method of manufacturing thereof.
  6. Parish, IV,Overton L.; DeVilbiss,Roger S., Cooling apparatus having low profile extrusion.
  7. Parish, IV, Overton L.; DeVilbiss, Roger S., Cooling apparatus having low profile extrusion and method of manufacture therefor.
  8. Parish, IV, Overton L.; DeVilbiss, Roger S., Cooling apparatus having low profile extrusion and method of manufacture therefor.
  9. Parish, IV, Overton L.; DeVilbiss, Roger S., Cooling apparatus having low profile extrusion and method of manufacture therefor.
  10. Parish, IV,Overton L.; DeVilbiss,Roger S., Cooling apparatus having low profile extrusion and method of manufacture therefor.
  11. Parish, IV,Overton L.; DeVilbiss,Roger S., Cooling apparatus having low profile extrusion and method of manufacture therefor.
  12. Saito,Tomonori, Cooling system and projection-type image display apparatus using the same.
  13. Sarraf, David B.; DeHoff, Robert E.; Hartenstine, John; Todd, Jr., John J., Cooling system for electronics with improved thermal interface.
  14. Kim, Jung Kyun; Kim, Sung Ki; Kim, Sru; Cho, Jin Hyun, Display apparatus.
  15. Hata,Yukihiko; Tomioka,Kentaro; Tanimoto,Mitsuyoshi; Kusaka,Hiroyuki, Electronic apparatus having a heat-radiating unit for radiating heat of heat-generating components.
  16. Farner, Rachel; Trotman, Kenneth J.; Kokas, Jay W.; Querns, Kerry R., Electronic component cooling hood and heat pipe.
  17. MacDonald, Mark; Nishi, Yoshifumi Yoshi, Electronic device having a passive heat exchange device.
  18. Nishi, Yoshifumi; MacDonald, Mark; Heymann, Douglas, Electronic device having passive cooling.
  19. Ghosh, Prosenjit, Enhanced space utilization for enclosures enclosing heat management components.
  20. Babin, Bruce R., Externally accessible thermal ground plane for tactical missiles.
  21. Mitchell, Nathan A., Flexible heat pipe structure and associated methods for dissipating heat in electronic apparatus.
  22. Parish, Overton L.; Quisenberry, Tony; Havis, Clark R., Geometrically reoriented low-profile phase plane heat pipes.
  23. Xia,Wan Lin; Li,Tao; Xiao,Min Qi; Zhang,Jun; Qin,Ji Yun, Heat dissipation device.
  24. Slippey, Andrew J.; Ellis, Michael C., Heat management for electronic enclosures.
  25. Huang, Shih-Lin; Chen, Chiu-Kung; Wu, Sien; Wang, Ti-Jun, Heat pipe.
  26. Quisenberry,Tony; Havis,Clark R., Heat pipe connection system and method.
  27. Gunawardana, Ruvinda, Heat pipe cooling system.
  28. Zuo, Jon; Ernst, Donald M., Heat pipe having a wick structure containing phase change materials.
  29. Wu, Chun-Ming, Heat pipe structure.
  30. Lai, Chi-Yuan; Zhou, Zhi-Yong; Lai, Cheng-Tien, Heat sink with heat pipes.
  31. Xia,Wan Lin; Li,Tao; Xiao,Min Qi, Heat sink with heat pipes.
  32. Kawabata, Kenya; Oomi, Masaru; Ohno, Ryoji, Heat sink with heat pipes and method for manufacturing the same.
  33. Kawabata, Kenya; Oomi, Masaru; Ohno, Ryoji, Heat sink with heat pipes and method for manufacturing the same.
  34. Zhang, Heng Yun; Pinjala, Damaruganath; Hayashi, Hidetaka; Chan, Poh Keong, Heat transfer apparatus.
  35. Rosenfeld,John H.; Ernst,Donald M., Heat transfer device and method of making same.
  36. Jacqu?,Bernard; Texier,Emmanuel; Cluzet,G?rard; Tjiptahardja,Tisna; Amidieu,Marcel, Heat transfer system for a satellite including an evaporator.
  37. Son, Sang-young; Choi, Mun-cheol; Hong, Young-ki; Cho, Hye-jung; Ha, Byeoung Ju, Heat transferring device having adiabatic unit.
  38. Hata, Yukihiko; Tomioka, Kentaro, Heat-Receiving apparatus and electronic equipment.
  39. Lee Sui Yung,TWX ; Hsu Chien-hung,TWX, Heat-radiating structure.
  40. Dussinger, Peter M.; Myers, Thomas L.; Rosenfeld, John H.; Minnerly, Kenneth L., Integrated circuit heat pipe heat spreader with through mounting holes.
  41. McCullough, Kevin; Miller, James; Sagal, E. Mikhail, Light-emitting diode reflector assembly having a heat pipe.
  42. Yazawa, Kazuaki; Bar-Cohen, Avram, Method and apparatus for converting dissipated heat to work energy.
  43. Haws,James L.; Short, Jr.,Byron Elliott, Method and apparatus for cooling with a phase change material and heat pipes.
  44. Quisenberry, Tony, Method and system for automotive battery cooling.
  45. Noel,Thomas P., Method and thermally active multi-phase heat transfer apparatus and method for abstracting heat using liquid bi-phase heat exchanging composition.
  46. Quisenberry, Tony, Method for automotive battery cooling.
  47. Parish, Overton L.; Quisenberry, Tony; Havis, Clark R., Method of removing heat utilizing geometrically reoriented low-profile phase plane heat pipes.
  48. Batty, J. Clair; Jensen, Scott M., Minimal-temperature-differential, omni-directional-reflux, heat exchanger.
  49. Lin, Lanchao; Leland, John E., Passive thermal spreader and method.
  50. Nakamura, Yoshio; Niekawa, Jun; Enomoto, Hisao; Kojima, Yasushi; Yamazaki, Naoya; Mogi, Masahiro, Plate type heat pipe.
  51. Tomioka,Kentaro; Hata,Yukihiko, Pump and electronic device having the pump.
  52. Hata,Yukihiko; Tomioka,Kentaro, Pump, electronic apparatus, and cooling system.
  53. Niwatsukino, Kyo; Urano, Seiji; Narakino, Shigeru; Hirakawa, Fuminori; Matsuda, Toshihiko; Koga, Shinya; Aizono, Yoshimitsu; Sakai, Toshisuke; Kubota, Toshiyuki; Nishida, Makoto, Radiator.
  54. Niwatsukino, Kyo; Urano, Seiji; Narakino, Shigeru; Hirakawa, Fuminori; Matsuda, Toshihiko; Koga, Shinya; Aizono, Yoshimitsu; Sakai, Toshisuke; Kubota, Toshiyuki; Nishida, Makoto, Radiator.
  55. Niwatsukino, Kyo; Urano, Seiji; Narakino, Shigeru; Hirakawa, Fuminori; Matsuda, Toshihiko; Koga, Shinya; Aizono, Yoshimitsu; Sakai, Toshisuke; Kubota, Toshiyuki; Nishida, Makoto, Radiator.
  56. Lu, Qiao; Godecker, William, Refrigeration systems and methods for connection with a vehicle's liquid cooling system.
  57. Garner, Scott D.; Lindemuth, James E.; Toth, Jerome E.; Rosenfeld, John H.; Minnerly, Kenneth G., Sintered grooved wick with particle web.
  58. Garner,Scott D.; Lindemuth,James E.; Toth,Jerome E.; Rosenfeld,John H.; Minnerly,Kenneth G., Sintered grooved wick with particle web.
  59. Parish, IV,Overton L.; Quisenberry,Tony, Stacked low profile cooling system and method for making same.
  60. Parish, IV,Overton L.; Quisenberry,Tony, Stacked low profile cooling system and method for making same.
  61. Parish, Overton L.; DeVilbiss, Roger S., Stacked low profile cooling system and method for making same.
  62. Wolfe, Mark; Partridge, Julian, System, apparatus and method for cooling electronic components.
  63. Wilson, James S., Thermal management system and method for thin membrane type antennas.
  64. Sasaki,Yasumi; Ooi,Yasuyuki, Thin sheet type heat pipe.
  65. Quisenberry,Tony; Hester,Darren C.; Parish,Overton L., Toroidal low-profile extrusion cooling system and method thereof.
  66. Garner, Scott D.; Lindemuth, James E.; Toth, Jerome E.; Rosenfeld, John H.; Minnerly, Kenneth G., Tower heat sink with sintered grooved wick.
  67. Lindemuth, James E.; Rosenfeld, John H., Vapor chamber with sintered grooved wick.
  68. Lindemuth,James E.; Rosenfeld,John H., Vapor chamber with sintered grooved wick.
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