초록 ▼

Chip carrier packages, integrated circuits, wiring boards, and assemblies in computer systems are made having conductive adhesive interconnections. Electrically conductive polymer paste with metal particles and powders are used with photoimagable polymer films to form the interconnection structure.

Chip carrier packages, integrated circuits, wiring boards, and assemblies in computer systems are made having conductive adhesive interconnections. Electrically conductive polymer paste with metal particles and powders are used with photoimagable polymer films to form the interconnection structure. These articles are produced with screening and printing processes using a screening head and printing machine.

대표청구항 ▼

[ What is claimed is:] [1.] A component carrier having raised bonding sites of connected joining material, comprising:a substrate having one or more electrically conductive wiring layers, said layers having conductive lines terminating in connecting pad areas;a first layer of cured electrically cond

[ What is claimed is:] [1.] A component carrier having raised bonding sites of connected joining material, comprising:a substrate having one or more electrically conductive wiring layers, said layers having conductive lines terminating in connecting pad areas;a first layer of cured electrically conductive adhesive material positioned over at least part of at least one of said connecting pad areas, providing electrical connection to said connecting pad areas; anda second layer of uncured electrically conductive adhesive material positioned over at least parts of said first layer of cured electrically conductive adhesive material, forming a connected joining material structure, thereby providing raised bonding sites on said component carrier.