초록 ▼

The present invention discloses a method for manufacturing a surface mount resistance-temperature-detector (RTD) on a substrate. The manufacture method includes the steps of (a) depositing a resistive thin film on a top surface of the substrate having a substantially linear temperature resistance co

The present invention discloses a method for manufacturing a surface mount resistance-temperature-detector (RTD) on a substrate. The manufacture method includes the steps of (a) depositing a resistive thin film on a top surface of the substrate having a substantially linear temperature resistance coefficient (TCR) over a predetermined temperature range for temperature measurement; (b) patterning the resistive film into a plurality of resistive strips and a plurality of top terminals near two opposite edges on the top surface of the substrate with each resistive strip connected between two top terminals; (c) forming a bottom electrode on a bottom surface of the substrate underneath each of the top terminals; (d) depositing two edge conductive plates on edge surfaces of the substrate for connecting one of the top terminals to a bottom terminal thereunder; and (e) forming two surface mount solder electrodes with a conductive layer overlying the top terminal, the edge conductive plate and the bottom terminal provided for performing a surface-mount soldering operation thereon.

대표청구항 ▼

[ What is claimed is:] [1.] A method for manufacturing a surface mount resistance-temperature-detector (RTD) on a substrate, comprising:depositing a resistive thin film on a top surface of said substrate having a substantially linear temperature resistance coefficient (TCR) over a predetermined temp

[ What is claimed is:] [1.] A method for manufacturing a surface mount resistance-temperature-detector (RTD) on a substrate, comprising:depositing a resistive thin film on a top surface of said substrate having a substantially linear temperature resistance coefficient (TCR) over a predetermined temperature range for temperature measurement;patterning said resistive film into a plurality of resistive strips and a plurality of top terminals at both ends of said resistive strips on said top surface of said substrate with each resistive strip connected between two top terminals;forming a plurality of bottom terminals each disposed on a bottom surface of said substrate underneath each of said top terminals followed by scribing along scribing lines substantially perpendicular to said resistive strips and extended between said plurality of top terminals with every two adjacent scribing lines defining two elongated edges of a plurality of elongated substrate sticks and breaking said substrate along said scribing lines into a plurality of said elongated substrate sticks, with each of said top terminals and bottom terminals disposed on said elongated edges of said elongate substrate sticks;depositing two edge conductive plates on edge surfaces along said elongated edges of said substrate sticks for connecting each of said top terminals to each of a corresponding bottom terminals thereunder followed by scribing and breaking said substrate sticks into a plurality of RTD chips; andforming two surface mount solder electrodes with a conductive layer overlying said top terminal, said edge conductive plate and said bottom terminal provided for performing a surface-mount soldering operation thereon.