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Packaging of hot melt adhesives 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B65B-063/08
출원번호 US-0432700 (1999-11-02)
발명자 / 주소
  • Jain Surendra
대리인 / 주소
    Hardaway/Mann IP Group
인용정보 피인용 횟수 : 14  인용 특허 : 15

초록

The present invention relates to the packaging of a hot melt adhesive in a plastic film to prevent the adhesive from blocking during shipping and storage. The hot melt adhesives of the present invention may be thermoplastic or thermosetting in nature. The films used to wrap the adhesive are flexible

대표청구항

[ What is claimed is:] [1.] A process for the continuous production of an enrobed hot melt adhesive cartridge comprising:a) passing a plastic film across a table having a channel formed therein;b) depositing a bead of molten hot melt adhesive onto said plastic film above said channel;c) directing sa

이 특허에 인용된 특허 (15)

  1. Bozich Frank (Clarendon Hills IL) King Charles J. (Stickney IL), Hot-melt pressure sensitive adhesive packaging, preform, and method.
  2. Stahl Margarete (Rheinweg 105 D-53 Bonn DT), Method and apparatus for packaging smeltable or fluid material.
  3. Viel Gerard H. (Crepy En Valois FRX), Method for conditioning a permanent adhesive composition in the form of blocks or sections.
  4. Viel Gerard H. (Crepy en Valois FRX), Method for conditioning in a well plate in a permanent adhesive composition.
  5. Reynolds H. Neel ; McInerney Kevin, Method for forming a package of adhesive material in a non-tacky mold.
  6. Franke Willard A. (St. Paul MN), Method for forming hot melt adhesives into a readily packageable form.
  7. Taylor Malcolm ; Bateson George ; Posner Brian ; Heuer Glenn, Method for packaging thermoplastic compositions using a thermally conductive rigid mold.
  8. Hull Mark (Marine On The St. Croix MN), Method for tackless packaging of hot melt adhesive.
  9. Hatfield Stephen (Somerville NJ) Gore Shelley (Neshanic Station NJ) Fame David (Newtown PA) Rindone Anthony (Flemington NJ), Method for tackless packaging of hot melt adhesives.
  10. Bozich Frank ; King Charles James, Method for the tack-free packaging of a hot-melt pressure sensitive adhesive.
  11. Rouyer Alain (Le Mesnil Fouque ; Fresne-le-Plan F-76520 Boos FRX) Pariente Emmanuelle (22 A ; rue Malatire F-76000 Rouen FRX) Yeboa-Kodie Peter (Teilfeld 4 D-2120 Lneburg DEX), Method of packaging an adhesive composition and corresponding packaged article.
  12. Rizzieri Giorgio,ITX, Process and packaging plant for packaging sticky substances in the fluid state.
  13. Fayolle Jean,FRX ; Grandin Daniel,FRX ; Niethen Heinrich,FRX ; Pierron Michel,FRX ; Prevot Jean-Louis,FRX, Process for continuous abherent treatment of a surface adherent holt-melt adhesive.
  14. Levy Giorgio (Viale Coni Zugna 43 ; Milan ITX), System for metering and film packaging of bitumen and like materials.
  15. Christ Dennis L. ; Bredahl Timothy D. ; Giefer Michael A. ; Hamann Robert D. ; Peacock Donald R. ; Walker Timothy J., Wrapped material, and method and apparatus for wrapping and unwrapping such material.

이 특허를 인용한 특허 (14)

  1. Ogura,Kazuhiro; Yoshikawa,Yoshio, Adhesive solid having anti-mutual adhesion, method of producing the same and method of packaging the same.
  2. Hashiba, Yoshitugi; Takahashi, Hitoshi; Takahashi, Eisaku, Apparatus and method for packaging granular object having adsorption ability, and method for producing package thereof.
  3. Alper,Mark; Mehta,Atul, Apparatus for packaging hot melt adhesives using a mold and carrier.
  4. Burriez,Herv?; Grover,Paul, Device and method for packaging in block form a sheathed hot-melt adhesive product.
  5. Peter Remmers DE; Joachim Baumung DE; Michelle M. Chanak ; Kevin W. McKay ; Thomas Wittkopf DE, Method of packaging a thermoplastic composition with a film having a low complex viscosity and corresponding packaged article.
  6. Zeiler, Bernhard; Buis, Charles D.; Burgess, Neal; Renninger, James A.; Manly, Jr., John B., Packaging machine and packages made therewith.
  7. Zeiler, Bernhard; Buis, Charles D.; Burgess, Neal; Renninger, James A.; Manly, Jr., John B., Packaging machine and packages made therewith.
  8. Le Clerc, Stephane; Bin Jaafar, Mohd Yazid; Roovers, Antonius Adrianus Maria; Teh, Jason Boon Eong, Paraffin wax composition.
  9. Mehta, Atul; Neperud, Michael A.; Sajot, Nicolas E.; Chiarabini, Dominique; Morel Fourrier, Chrisophe, Process for packaging plastic materials like hot melt adhesives.
  10. Mehta,Atul; Neperud,Michael A.; Sajot,Nicolas E.; Chiarabini,Dominique; Morel Fourrier,Chrisophe, Process for packaging plastic materials like hot melt adhesives.
  11. Guymon, Michael P.; Maxwell, Ted E.; Maxwell, Ken W., Systems and methods for providing a thermoplastic product that includes packaging therefor.
  12. Guymon, Michael P.; Maxwell, Ted E.; Maxwell, Ken W., Systems and methods for providing a thermoplastic product that includes packaging therefor.
  13. Guymon, Michael P.; Maxwell, Ted E.; Maxwell, Ken W., Systems and methods for providing a thermoplastic product that includes packaging therefor.
  14. Guymon, Michael P.; Maxwell, Ted E.; Maxwell, Ken W., Systems and methods for providing a thermoplastic product that includes packaging therefor.
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