초록 ▼

The method (400, 500) and device (200) for reworkable direct chip attachment include a thermal-mechanical and mechanical stable solder joint for arranging connection pads on a top surface of the circuit board to facilitate connection for electronic elements, and affixing a reinforcement having apert

The method (400, 500) and device (200) for reworkable direct chip attachment include a thermal-mechanical and mechanical stable solder joint for arranging connection pads on a top surface of the circuit board to facilitate connection for electronic elements, and affixing a reinforcement having apertures to accommodate solder joints to the top surface of the circuit board to facilitate solder attachment of the connection pads to the electronic elements wherein the reinforcement constrains deformation of the circuit board to provide reliable solder joints and facilitates attachment and removal of electronic elements from the circuit board.

대표청구항 ▼

[ We claim:] [1.] An electronic device having a reinforcement to provide efficient electronic element replacement and to enhance solder joint reliability, the electronic device being situated on a circuit board comprising:A) connection pads on a top surface of the circuit board, arranged to facilita

[ We claim:] [1.] An electronic device having a reinforcement to provide efficient electronic element replacement and to enhance solder joint reliability, the electronic device being situated on a circuit board comprising:A) connection pads on a top surface of the circuit board, arranged to facilitate connection to connection pads for electronic elements, andB) a reinforcement having apertures to accommodate solder joints, the reinforcement being affixed on the top surface of the circuit board and arranged to facilitate solder attachment of the connection pads of the circuit board to the connection pads of the electronic elements;C) a frame/collar arranged around the electronic elements and affixed to the circuit board for providing local reinforcement of the circuit board with respect to the electronic elements;wherein the reinforcement constrains deformation of the circuit board to provide reliable solder joints and facilitates attachment and removal of electronic elements from the circuit board.