초록 ▼

The reliability of a plasma processing chamber has been increased using a heat moderating material to facilitate controlling heat removal from dielectric parts of the plasma chamber. The heat moderating material performs at least one of the functions: moderating heat transfer rate and functioning as

The reliability of a plasma processing chamber has been increased using a heat moderating material to facilitate controlling heat removal from dielectric parts of the plasma chamber. The heat moderating material performs at least one of the functions: moderating heat transfer rate and functioning as a heat spreader. The heat moderating material allows removal of heat from the dielectric so that the dielectric maintains temperatures that result in negligible corrosion to the dielectric and the dielectric maintains temperature gradients that minimize thermal stress induced breakage of the dielectric.

대표청구항 ▼

[ What is claimed is:] [1.] A method of plasma processing comprising the steps of:providing a plasma in a plasma chamber, the plasma chamber including a dielectric exposed to heat generated by the plasma, the dielectric having a surface;providing a cooling surface to remove heat from the dielectric

[ What is claimed is:] [1.] A method of plasma processing comprising the steps of:providing a plasma in a plasma chamber, the plasma chamber including a dielectric exposed to heat generated by the plasma, the dielectric having a surface;providing a cooling surface to remove heat from the dielectric surface; andproviding a heat moderating material contacting the dielectric surface and contacting the cooling surface, the heat moderating material having thermal conductivities and thicknesses so as to perform at least one function of:a) producing a substantial temperature difference between the dielectric surface and the cooling surface and preventing direct contact between the dielectric surface and the cooling surface; andb) functioning as a heat spreader.