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Method and system for on-line monitoring plasma chamber condition by comparing intensity of certain wavelength

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G06F-019/00
출원번호 US-0031654 (1998-02-27)
발명자 / 주소
  • Hwang Yuan-Ko,TWX
  • Cho Ching-Wen,TWX
출원인 / 주소
  • Taiwan Semiconductor Manufacturing Company, TWX
대리인 / 주소
    Saile
인용정보 피인용 횟수 : 39  인용 특허 : 10

초록

A method for operating a plasma processing system comprises the following steps. Produce a plasma in a plasma processing chamber operating upon a selected workpiece. Perform in situ detection of electromagnetic radiation of a certain wavelength generated in the plasma in the plasma processing chambe

대표청구항

[ Having thus described the invention, what is claimed as new and desirable to be secured by Letters Patent is as follows:] [1.] A method for operating a plasma processing system comprising:production of a plasma in a plasma processing chamber operating upon a selected workpiece,in situ detecting el

이 특허에 인용된 특허 (10)

  1. Savage Richard N. (Livermore CA), Apparatus and method for automatically identifying chemical species within a plasma reactor environment.
  2. Flinchbaugh Bruce E. (Dallas TX) Dolins Steven B. (Dallas TX) Srivastava Aditya (Richardson TX) Reese Jon (Waxahachie TX), Apparatus and method for production process diagnosis using dynamic time warping.
  3. Gifford George G. (Bethel CT) Osborn Brock E. (Hyde Park NY), Method and system employing optical emission spectroscopy for monitoring and controlling semiconductor fabrication.
  4. Gifford George G. (Poughkeepsie NY) Osborn Brock E. (Hyde Park NY), Method and system for analyzing plasma data.
  5. Niinomi Masahiro (Yokohama JPX) Yanagihara Kenji (Atsugi JPX), Method for controlling plasma chemical reactions.
  6. Mozumder Purnendu Kanti (Plano TX) Barna Gabe G. (Richardson TX), Method for controlling semiconductor wafer processing.
  7. Imatake Mitsuko,JPX ; Sasaki Ichiro,JPX ; Otsubo Toru,JPX ; Tamura Hitoshi,JPX ; Kamimura Takashi,JPX, Plasma processing apparatus and processing method.
  8. Dolins Steven B. (Dallas TX) Srivastava Aditya (Richardson TX) Flinchbaugh Bruce E. (Dallas TX) Gunturi Sarma S. (Richardson TX) Lassiter Thomas W. (Garland TX) Love Robert L. (McKinney TX), Process and apparatus for detecting aberrations in production process operations.
  9. Dimitrelis Dimitrios (Palo Alto CA) Gabriel Calvin T. (Cupertino CA) Dunton Samuel V. (San Jose CA), System and method for plasma etching endpoint detection.
  10. Jahns Gary L., System for indirectly monitoring and controlling a process with particular application to plasma processes.

이 특허를 인용한 특허 (39)

  1. Valcore, Jr., John C.; Lyndaker, Bradford J., Adjustment of power and frequency based on three or more states.
  2. Valcore, Jr., John C.; Povolny, Henry S., Arrangement for plasma processing system control based on RF voltage.
  3. Howald, Arthur M.; Valcore, Jr., John C., Cable power loss determination for virtual metrology.
  4. Albarede, Luc, Chamber matching for power control mode.
  5. Huang, Chung-Ho; Jea, Hae-Pyng; Hsu, Tung; Seto, Jackie, Component-tracking system and methods therefor.
  6. Fong, Andrew S.; Valcore, Jr., John C., Computation of statistics for statistical data decimation.
  7. Sogan,Gloria; Bounouar,Julien; Desbiolles,Jean Pierre; Gaurand,Isabelle, Detecting gaseous species by light-emission spectrometry with spectrum processing.
  8. Sogan,Gloria; Bounouar,Julien; Desbiolles,Jean Pierre; Gaurand,Isabelle, Detecting minority gaseous species by light-emission spectroscopy.
  9. Valcore, Jr., John C.; Lyndaker, Bradford J.; Sato, Arthur, Determining a malfunctioning device in a plasma system.
  10. Valcore, Jr., John C.; Lyndaker, Bradford J., Determining a value of a variable on an RF transmission model.
  11. Huang, Chung-Ho; Jea, Hae-Pyng; Hsu, Tung; Seto, Jackie, Dynamic component-tracking system and methods therefor.
  12. Valcore, Jr., John C.; Singh, Harmeet; Povolny, Henry, Etch rate modeling and use thereof with multiple parameters for in-chamber and chamber-to-chamber matching.
  13. Valcore, Jr., John C.; Lyndaker, Bradford J., Impedance-based adjustment of power and frequency.
  14. Ni, Tuqiang; Ngo, Tuan; Huang, Chung-Ho; Lui, Andrew; Kaveh, Farro, Integrated full wavelength spectrometer for wafer processing.
  15. Wang, Shiang-Bau; Lu, Victor Y., Intelligent metrology based on module knowledge.
  16. Marakhtanov, Alexei; Chen, Zhigang; Holland, John Patrick, Ion energy control by RF pulse shape.
  17. Oluseyi, Hakeem; Sarfaty, Moshe, Method and apparatus employing optical emission spectroscopy to detect a fault in process conditions of a semiconductor processing system.
  18. Kim, KeeChan; Kim, Yunsang; Bailey, III, Andrew D., Method and apparatus for detecting plasma unconfinement.
  19. Chen,Yi Ling, Method for in situ monitoring of chamber peeling.
  20. Valcore, Jr., John C.; Lyndaker, Bradford J., Methods and apparatus for controlling plasma in a plasma processing system.
  21. Valcore, Jr., John C.; Lyndaker, Bradford J.; Singh, Harmeet, Methods and apparatus for synchronizing RF pulses in a plasma processing system.
  22. Huang, Chung-Ho; Lui, Andrew, Methods for performing data management for a recipe-and-component control module.
  23. Kim,Yong Jin; Kang,Hyun Kyu; Son,Seung Young; Min,Gyung Jin, Methods of determining an etching end point based on compensation for etching disturbances.
  24. Lee, Sang Hun; Kim, Jay Joongsoo, Microwave plasma nozzle with enhanced plume stability and heating efficiency.
  25. Oluseyi, Hakeem; Sarfaty, Moshe, Monitoring of film characteristics during plasma-based semi-conductor processing using optical emission spectroscopy.
  26. Matsuuchi, Hidetaka; Iwasaki, Ryuichi; Mankawa, Hirofumi; Masuda, Shigeru; Hayashi, Hirofumi; Mike, Masaaki, Plasma generation apparatus and work processing apparatus.
  27. Tanaka, Junichi; Kitsunai, Hiroyuki; Nishio, Ryoji; Kanno, Seiichiro; Yamamoto, Hideyuki, Plasma processing apparatus and method.
  28. Tanaka, Junichi; Kitsunai, Hiroyuki; Nishio, Ryoji; Kanno, Seiichiro; Yamamoto, Hideyuki, Plasma processing apparatus and method.
  29. Huang,Chung Ho; Lui,Andrew; Hemker,David J., Plug and play sensor integration for a process module.
  30. Valcore, Jr., John C.; Rogers, James Hugh; Webb, Nicholas Edward; Muraoka, Peter T., RF impedance model based fault detection.
  31. Huang, Chung-Ho; Lui, Andrew, Recipe-and-component control module and methods thereof.
  32. Valcore, Jr., John C.; Howald, Arthur M., Segmenting a model within a plasma system.
  33. Valcore, Jr., John C., Soft pulsing.
  34. Valcore, Jr., John C.; Lyndaker, Bradford J., State-based adjustment of power and frequency.
  35. Valcore, Jr., John C.; Singh, Harmeet; Lyndaker, Bradford J., Sub-pulsing during a state.
  36. Huang, Chung Ho; Fan, Shih Jeun, Targeted data collection architecture.
  37. Valcore, Jr., John C.; Lyndaker, Bradford J., Tuning a parameter associated with plasma impedance.
  38. Valcore, Jr., John C.; Lyndaker, Bradford J., Using modeling to determine ion energy associated with a plasma system.
  39. Valcore, Jr., John C.; Lyndaker, Bradford J., Using modeling to determine wafer bias associated with a plasma system.
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