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Thin planar heat spreader 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28D-015/00
출원번호 US-0992889 (1997-12-18)
발명자 / 주소
  • Thomas Daniel Lee
출원인 / 주소
  • Novel Concepts, Inc.
대리인 / 주소
    Galliani
인용정보 피인용 횟수 : 68  인용 특허 : 19

초록

A heat spreading apparatus includes a body with an interior surface defining a void. The interior surface includes randomly configured high aspect ratio micro surface capillaries. Preferably, the micro surface capillaries are intergranular and intragranular capillaries that are less than 200 microns

대표청구항

[ What is claimed is:] [1.] A heat spreading apparatus, comprising:a body with an interior surface defining a void, said interior surface including random micro surface capillaries chemically formed within said body to transport a condensed working fluid from a cool region to a hot region where said

이 특허에 인용된 특허 (19)

  1. Swanson Theodore D. ; Wren ; deceased Paul, Capillary pumped loop body heat exchanger.
  2. Conte Alfred S. (Hollister CA), Cooling multi-chip modules using embedded heat pipes.
  3. Marcus Bruce D. (Los Angeles CA) Fleischman George L. (Inglewood CA), Flat-plate heat pipe.
  4. Schladitz Hermann J. (74 Plaentschweg Munich DT), Heat pipe.
  5. Del Bagno Anthony C. (12 Cedar St. Newton NJ 07860) Giordano Richard R. (12 Cedar St. Newton NJ 07860) Rose Frederick (12 Cedar St. Newton NJ 07860), Heat pipe having multiple integral wick structures.
  6. Nelson ; Lloyd A. ; Sekhon ; Kalwant S., Heat pipe thermal mounting plate for cooling electronic circuit cards.
  7. Tanaka Suemi (Yokohama JPX) Sotani Junji (Yokohama JPX) Nanba Kenichi (Tokyo JPX), Heat pipe type radiation for electronic apparatus.
  8. Iriarte Wilfrido R. (Long Beach CA), Heat pipe with capillary groove and floating artery.
  9. Sliwa ; Jr. John W. (Stanford CA), Integrated circuit micropackaging.
  10. Carlsten Ronald W. (Tucson AZ) Kim Sung J. (Tucson AZ) Murphy Alan L. (Tucson AZ), Integrated heat pipe and circuit board structure.
  11. Hardee Kenneth L. (Middlefield OH) Ernes Lynne M. (Willoughby OH) Carlson Richard C. (Euclid OH) Thomas David E. (Northbridge MA), Metal substrate of improved surface morphology.
  12. Lomolino ; Sr. Paul A. (Danville CA) Lomolino ; Jr. Paul A. (Tracy CA) Lean Grace A. (Livermore CA) Burns Patricia L. (San Jose CA), Method and apparatus for a self contained heat exchanger.
  13. Larson Ralph I. (Bolton MA) Phillips Richard J. (Alachua FL), Method of making a two-phase thermal bag component cooler.
  14. Hardee Kenneth L. (Middlefield OH) Ernes Lynne M. (Willoughby OH) Carlson Richard C. (Euclid OH) Thomas David E. (Northbridge MA), Method of preparing a metal substrate of improved surface morphology.
  15. Hardee Kenneth L. (Middlefield OH) Ernes Lynne M. (Willoughby OH) Carlson Richard C. (Euclid OH), Method of using a metal substrate of improved surface morphology.
  16. Hardee Kenneth L. (Middlefield OH) Ernes Lynne M. (Willoughby OH) Carlson Richard C. (Euclid OH) Thomas David E. (Northbridge MA), Method of using a metal substrate of improved surface morphology.
  17. Akachi Hisateru (Sagamihara JPX), Ribbon-like plate heat pipes.
  18. Andres, Rudolf; Grantz, Helmut; Muenzel, Wolf-Dietrich; Odebrecht, Wolfgang, Surface heating body for vehicles.
  19. Sekhon Kalwant S. (Fullerton CA) Nelson Lloyd A. (Villa Park CA) Fritz ; Jr. John E. (Anaheim CA), Transistor cooling by heat pipes having a wick of dielectric powder.

이 특허를 인용한 특허 (68)

  1. Schlie, LaVerne Arthur; Ma, Hongbin, Active cooling of high speed seeker missile domes and radomes.
  2. Doll, Wade J.; Kelley, Douglas P., Air conditioning systems for computer systems and associated methods.
  3. Chu, Yuan-Fa; Jiang, Wen-Jang, Anti-icing outdoor lamp.
  4. Yatskov,Alexander I., Apparatuses and methods for cooling electronic devices in computer systems.
  5. Yatskov,Alexander I., Assemblies for holding heat sinks and other structures in contact with electronic devices and other apparatuses.
  6. Yatskov,Alexander I.; Hellriegel,Stephen V. R., Assemblies for holding heat sinks and other structures in contact with electronic devices and other apparatuses.
  7. Yatskov,Alexander I.; Hellriegel,Stephen V.R., Assemblies for mounting electronic devices and associated heat sinks to computer modules and other structures.
  8. Rosenfeld,John H.; Minnerly,Kenneth G., Brazed wick for a heat transfer device.
  9. Rosenfeld,John H.; Minnerly,Kenneth G., Brazed wick for a heat transfer device.
  10. Doll, Wade J., Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use.
  11. Doll, Wade J., Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use.
  12. Borror, Steven A.; DiPaolo, Franklin E.; Harvey, Thomas E.; Madara, Steven M.; Mam, Reasey J.; Sillato, Stephen C., Cooling system for high density heat load.
  13. Borror, Steven A.; DiPaolo, Franklin E.; Harvey, Thomas E.; Madara, Steven M.; Mam, Reasey J.; Sillato, Stephen C., Cooling system for high density heat load.
  14. Borror, Steven A.; Dipaolo, Franklin E.; Harvey, Thomas E.; Madara, Steven M.; Mam, Reasey J.; Sillato, Stephen C., Cooling system for high density heat load.
  15. Borror, Steven A; DiPaolo, Franklin E; Harvey, Thomas E; Madara, Steven M; Mam, Reasey J; Sillato, Stephen C, Cooling system for high density heat load.
  16. Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
  17. Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
  18. Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
  19. Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
  20. Madara, Steven M.; Sillato, Steve; Harvey, Thomas E.; Dukes, David A., Electronic equipment cabinet with integrated, high capacity, cooling system, and backup ventilation.
  21. Kroliczek, Edward J.; Wrenn, Kimberly R.; Wolf, Sr., David A., Evaporators including a capillary wick and a plurality of vapor grooves and two-phase heat transfer systems including such evaporators.
  22. Kroliczek, Edward J.; Wrenn, Kimberly R.; Wolf, Sr., David A., Evaporators including a capillary wick and a plurality of vapor grooves and two-phase heat transfer systems including such evaporators.
  23. Monson, Robert James; Arndt, Allen L., Flat fan device.
  24. Luo, Chin-Kuang, Heat dissipating device.
  25. Kwak, Jin Woo; Song, Kyong Hwa; Kim, Gyung Bok; Chu, In Chang, Heat dissipation device for electronic controllers.
  26. Pinneo, John Michael, Heat pipe.
  27. Zhao, Yuan; Chen, Chunglung, Heat pipe dissipating system and method.
  28. Ikeda, Masami; Kimura, Yuichi, Heat sink.
  29. Lankston, II, Robert J.; Malone, Christopher G.; Cromwell, Stephen D., Heat sink with surface-formed vapor chamber base.
  30. Tsoi, Vadim; Henningsson, Uno; Hong, Yuping; Peng, Feng; Yang, Hua; Li, Haipeng, Heat spreading device and method with sectioning forming multiple chambers.
  31. Rosenfeld,John H.; Ernst,Donald M., Heat transfer device and method of making same.
  32. Makino,Takuya; Mochizuki,Takashi; Hori,Kazuhito; Kiga,Kazuyoshi; Sakata,Noriaki, Heat transport device and electronic apparatus.
  33. Chang, Shyy-Woei; Chiang, Kuei-Feng, Heat-dissipating assembly.
  34. Win-Haw, Chen; Mao-Ching, Lin, Heat-dissipating device.
  35. Doll,Wade J., Heat-spreading devices for cooling computer systems and associated methods of use.
  36. Michael, Mihalis, High-performance heat sink for printed circuit boards.
  37. Kelley,Douglas P.; Yatskov,Alexander I., Inlet flow conditioners for computer cabinet air conditioning systems.
  38. Dussinger, Peter M.; Myers, Thomas L.; Rosenfeld, John H.; Minnerly, Kenneth L., Integrated circuit heat pipe heat spreader with through mounting holes.
  39. Madara,Steven; Sillato,Stephen; Harvey,Thomas; Baer,Daniel, Integrated heat exchangers in a rack for vertical board style computer systems.
  40. Baer, Daniel B, Method and apparatus for cooling electronic enclosures.
  41. Yeh,Lan Kai; Lin,Che Wei; Chen,Shao Wen; Shyu,Jin Cherng; Tsai,Ming Jye, Method for enhancing mobility of working fluid in liquid/gas phase heat dissipating device.
  42. Tsao, Pei-Haw; Wang, Jones; Chen, Ken, Method of fabricating as grooved heat spreader for stress reduction in an IC package.
  43. Houle,Sabina; Matayabas, Jr.,James C., Methods for fabricating thermal management systems for micro-components.
  44. Doll, Wade J., Multi-stage air movers for cooling computer systems and for other uses.
  45. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Parallel thermoelectric heat exchange systems.
  46. Rightley, Michael J.; Adkins, Douglas R.; Mulhall, James J.; Robino, Charles V.; Reece, Mark; Smith, Paul M.; Tigges, Chris P., Parallel-plate heat pipe apparatus having a shaped wick structure.
  47. Michel, Bruno; Brunschwiler, Thomas J.; Rothuizen, Hugo E.; Kloter, Urs, Patterned structure for a thermal interface.
  48. Edwards, Jesse W.; Therrien, Robert Joseph; June, M. Sean, Physically separated hot side and cold side heat sinks in a thermoelectric refrigeration system.
  49. Honmura, Osamu; Kojima, Nobuyuki; Sakuma, Naoto, Sheet-type heat pipe and mobile terminal using the same.
  50. Garner, Scott D.; Lindemuth, James E.; Toth, Jerome E.; Rosenfeld, John H.; Minnerly, Kenneth G., Sintered grooved wick with particle web.
  51. Garner,Scott D.; Lindemuth,James E.; Toth,Jerome E.; Rosenfeld,John H.; Minnerly,Kenneth G., Sintered grooved wick with particle web.
  52. Kelley, Douglas P.; Doll, Wade J.; Yatskov, Alexander I., Systems and associated methods for controllably cooling computer components.
  53. Kelley, Douglas P.; Doll, Wade J.; Yatskov, Alexander I., Systems and associated methods for controllably cooling computer components.
  54. Hellriegel,Stephen V. R.; Yatskov,Alexander I.; Kelley,Douglas P., Systems and methods for cooling computer modules in computer cabinets.
  55. Stanley, Marshall; Barus, Daniel, Systems and methods for operating a thermoelectric module to increase efficiency.
  56. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Systems and methods to mitigate heat leak back in a thermoelectric refrigeration system.
  57. Oyamada,Takashi, Telecommunication device including a housing having improved heat conductivity.
  58. Ghioni, Lincoln Matthew; Luo, Shi, Thermal management devices, systems and methods.
  59. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Thermoelectric heat exchange system comprising cascaded cold side heat sinks.
  60. June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek; Edwards, Jesse W., Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance.
  61. Edwards, Jesse W.; Therrien, Robert Joseph; June, M. Sean, Thermoelectric refrigeration system control scheme for high efficiency performance.
  62. Schlie, LaVerne Arthur; Ma, Hongbin; Smith, Douglas E.; Gruzdev, Vitaly, Thin disk laser operations with unique thermal management.
  63. Garner, Scott D.; Lindemuth, James E.; Toth, Jerome E.; Rosenfeld, John H.; Minnerly, Kenneth G., Tower heat sink with sintered grooved wick.
  64. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Two-phase heat exchanger mounting.
  65. Siu, Wing Ming, Vapor augmented heatsink with multi-wick structure.
  66. Lindemuth, James E.; Rosenfeld, John H., Vapor chamber with sintered grooved wick.
  67. Lindemuth,James E.; Rosenfeld,John H., Vapor chamber with sintered grooved wick.
  68. Kroliczek, Edward J.; Wrenn, Kimberly R.; Wolf, Sr., David A., Wick having liquid superheat tolerance and being resistant to back-conduction, evaporator employing a liquid superheat tolerant wick, and loop heat pipe incorporating same.
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