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Semiconductor memory device having a first source line arranged between a memory cell string and bit lines in the direction crossing the bit lines and a second source line arranged in parallel to the 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-029/76
  • H01L-029/94
출원번호 US-0017803 (1998-02-03)
우선권정보 JP0026458 (1997-02-10)
발명자 / 주소
  • Shimizu Kazuhiro,JPX
  • Watanabe Hiroshi,JPX
  • Takeuchi Yuji,JPX
  • Aritome Seiichi,JPX
  • Watanabe Toshiharu,JPX
출원인 / 주소
  • Kabushiki Kaisha Toshiba, JPX
대리인 / 주소
    Banner & Witcoff, Ltd.
인용정보 피인용 횟수 : 66  인용 특허 : 8

초록

A semiconductor device comprises select gates and control gates of a plurality of memory cells therebetween so that gate members on upper portions of stacked gates may cross element regions. A metal interconnection is disposed parallel to an upper layer of the element region. A source line SL is arr

대표청구항

[ What is claimed is:] [1.] A semiconductor device comprising:a semiconductor substrate of a first conductivity type;a first element separating region including a first trench formed on said semiconductor substrate and a first insulation layer buried in said first trench;a second element separating

이 특허에 인용된 특허 (8)

  1. Onuma Makoto (Osaka JPX), MIS type semiconductor ROM programmed by conductive interconnects.
  2. Bohr Mark T. ; Greason Jeffrey K., Memory cell design with vertically stacked crossovers.
  3. Doan Trung T. (Boise ID), Method of making self-aligned contacts and vertical interconnects to integrated circuits.
  4. Fukazawa Yuji (Yokohama JPX), Semiconductor device having a multilayered wiring structure with dummy wiring.
  5. Nakamura Masayuki (Nagoya JPX) Miyazawa Kazuyuki (Hidaka JPX) Iwai Hidetoshi (Ohme JPX), Semiconductor integrated circuit device.
  6. Hayashi Yoshihiro,JPX ; Onodera Takahiro,JPX, Semiconductor integrated circuit device having minature multi-level wiring structure low in parasitic capacitance.
  7. Mizushima Kazuyuki,JPX, Semiconductor integrated circuit device having multi-level wiring structure without dot pattern.
  8. Chu Sam (San Jose CA), Structure and method for improved memory arrays and improved electrical contacts in semiconductor devices.

이 특허를 인용한 특허 (66)

  1. Miyata, Masanori; Usami, Taro; Sogawa, Koichi; Nishihara, Kenji; Uehara, Tadao; Chin, Shisyo; Teratani, Hiroaki; Suzuki, Akinori; Kohno, Yuuichi; Okada, Tetsuya; Haruki, Tohru, Chemical mechanical polishing method and chemical mechanical polishing device.
  2. Yamada, Shigekazu, Circuits, systems and methods for driving high and low voltages on bit lines in non-volatile memory.
  3. Yamada, Shigekazu, Circuits, systems and methods for driving high and low voltages on bit lines in non-volatile memory.
  4. Yamada, Shigekazu, Circuits, systems and methods for driving high and low voltages on bit lines in non-volatile memory.
  5. Yamada, Shigekazu, Circuits, systems, and methods for driving high and low voltages on bit lines in non-volatile memory.
  6. Kurashina,Hisaki; Takahara,Kenichi; Kawata,Hidenori, Electro-optical device providing enhanced TFT life.
  7. Chuang, Harry-Hak-Lay; Wu, Wei Cheng, Embedded flash memory device with floating gate embedded in a substrate.
  8. Fazio, Albert; Parat, Krishna; Wada, Glen; Mielke, Neal; Stone, Rex, Integrated memory cell and method of fabrication.
  9. Drynan,John M., Interconnect line selectively isolated from an underlying contact plug.
  10. Deppe, Joachim; Olligs, Dominik; Kleint, Christoph; Ruttkowski, Eike; Mikalo, Ricardo, Memory device, a non-volatile semiconductor memory device and a method of forming a memory device.
  11. Higashitani, Masaaki, Method of forming low resistance void-free contacts.
  12. Lee,Wook Hyoung, Methods of fabricating flash memory devices including word lines with parallel sidewalls.
  13. Cina, Giuseppe; Todaro, Lorenzo, Non-volatile memory device.
  14. Li, Chi Nan Brian; Chang, Kuo-Tung, Non-volatile memory with a serial transistor structure with isolated well and method of operation.
  15. Sakakibara, Kiyohiko; Kuriyama, Hirotada, Non-volatile semiconductor memory device and method for producing the same.
  16. Shimizu, Kazuhiro; Arai, Fumitaka, Non-volatile semiconductor memory device having memory cell array suitable for high density and high integration.
  17. Shimizu, Kazuhiro; Arai, Fumitaka, Non-volatile semiconductor memory device having memory cell array suitable for high density and high integration.
  18. Shimizu,Kazuhiro; Arai,Fumitaka, Non-volatile semiconductor memory device having memory cell array suitable for high density and high integration.
  19. Shimizu,Kazuhiro; Arai,Fumitaka, Non-volatile semiconductor memory device having memory cell array suitable for high density and high integration.
  20. Hishida, Tomoo; Iwata, Yoshihisa; Itagaki, Kiyotaro; Maeda, Takashi, Non-volatile semiconductor storage device.
  21. Ki Jik Lee KR; Jae Min Yu KR, Nonvolatile memory and method for fabricating the same.
  22. Kajimoto, Minori; Noguchi, Mitsuhiro; Maejima, Hiroshi; Hara, Takahiko, Nonvolatile semiconductor memory.
  23. Kajimoto, Minori; Noguchi, Mitsuhiro; Maejima, Hiroshi; Hara, Takahiko, Nonvolatile semiconductor memory.
  24. Kajimoto,Minori; Noguchi,Mitsuhiro; Maejima,Hiroshi; Hara,Takahiko, Nonvolatile semiconductor memory.
  25. Kajimoto,Minori; Noguchi,Mitsuhiro; Maejima,Hiroshi; Hara,Takahiko, Nonvolatile semiconductor memory.
  26. Aritome, Seiichi, Nonvolatile semiconductor memory and manufacturing method thereof.
  27. Aritome, Seiichi, Nonvolatile semiconductor memory and manufacturing method thereof.
  28. Aritome,Seiichi, Nonvolatile semiconductor memory and manufacturing method thereof.
  29. Aritome,Seiichi, Nonvolatile semiconductor memory and manufacturing method thereof.
  30. Aritome,Seiichi, Nonvolatile semiconductor memory and manufacturing method thereof.
  31. Fujiwara, Ichiro; Kobayashi, Toshio, Nonvolatile semiconductor memory device and method for operating the same.
  32. Goda, Akira; Shimizu, Kazuhiro; Takeuchi, Yuji; Shirota, Riichiro; Aritome, Seiichi, Semiconductor device.
  33. Takeuchi, Yuji; Ichige, Masayuki; Goda, Akira, Semiconductor device.
  34. Takeuchi, Yuji; Ichige, Masayuki; Goda, Akira, Semiconductor device and method of manufacturing the same.
  35. Hoshino, Yutaka; Ikeda, Shuji; Yoshida, Isao; Kamohara, Shiro; Kawakami, Megumi; Miyake, Tomoyuki; Morikawa, Masatoshi, Semiconductor device having a plurality of misfets formed on a main surface of a semiconductor substrate.
  36. Goda, Akira; Shimizu, Kazuhiro; Shirota, Riichiro; Arai, Norihisa; Koido, Naoki; Aritome, Seiichi; Maruyama, Tohru; Hazama, Hiroaki; Iizuka, Hirohisa, Semiconductor device having serially connected memory cell transistors provided between two current terminals.
  37. Hoshino, Yutaka; Ikeda, Shuji; Yoshida, Isao; Kamohara, Shiro; Kawakami, Megumi; Miyake, Tomoyuki; Morikawa, Masatoshi, Semiconductor device including a power MISFET.
  38. Hoshino, Yutaka; Ikeda, Shuji; Yoshida, Isao; Kamohara, Shiro; Kawakami, Megumi; Miyake, Tomoyuki; Morikawa, Masatoshi, Semiconductor device including a power MISFET and method of manufacturing the same.
  39. Lee, Wook-Hyoung, Semiconductor device including source strapping line.
  40. Goda, Akira; Noguchi, Mitsuhiro, Semiconductor device with source line and fabrication method thereof.
  41. Noguchi, Mitsuhiro; Goda, Akira; Matsunaga, Yasuhiko, Semiconductor memory.
  42. Noguchi, Mitsuhiro; Goda, Akira; Matsunaga, Yasuhiko, Semiconductor memory.
  43. Noguchi,Mitsuhiro; Goda,Akira; Matsunaga,Yasuhiko, Semiconductor memory.
  44. Goda, Akira; Noguchi, Mitsuhiro; Takeuchi, Yuji; Hazama, Hiroaki, Superconductor device and method of manufacturing the same.
  45. Goda,Akira; Noguchi,Mitsuhiro; Takeuchi,Yuji; Hazama,Hiroaki, Superconductor device and method of manufacturing the same.
  46. Lin, Mou-Shiung, Top layers of metal for high performance IC's.
  47. Lin, Mou-Shiung, Top layers of metal for high performance IC's.
  48. Lin, Mou-Shiung, Top layers of metal for high performance IC's.
  49. Lin, Mou-Shiung, Top layers of metal for high performance IC's.
  50. Lin, Mou-Shiung, Top layers of metal for high performance IC's.
  51. Lin, Mou-Shiung, Top layers of metal for high performance IC's.
  52. Lin, Mou-Shiung, Top layers of metal for high performance IC's.
  53. Lin,Mou Shiung, Top layers of metal for high performance IC's.
  54. Lin,Mou Shiung, Top layers of metal for high performance IC's.
  55. Lin,Mou Shiung, Top layers of metal for high performance IC's.
  56. Lin,Mou Shiung, Top layers of metal for high performance IC's.
  57. Lin,Mou Shiung, Top layers of metal for high performance IC's.
  58. Lin,Mou Shiung, Top layers of metal for high performance IC's.
  59. Lin,Mou Shiung, Top layers of metal for high performance IC's.
  60. Lin,Mou Shiung, Top layers of metal for high performance IC's.
  61. Lin,Mou Shiung, Top layers of metal for high performance IC's.
  62. Lin,Mou Shiung, Top layers of metal for high performance IC's.
  63. Lin,Mou Shiung, Top layers of metal for high performance IC's.
  64. Lin,Mou Shiung, Top layers of metal for high performance IC's.
  65. Lin,Mou Shiung, Top layers of metal for high performance IC's.
  66. Haspeslagh, Luc, Two bit non-volatile electrically erasable and programmable memory structure, a process for producing said memory structure and methods for programming, reading and erasing said memory structure.
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