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Heat sink with arc shaped fins 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0346931 (1999-07-02)
발명자 / 주소
  • Azar Kaveh
대리인 / 주소
    Lieberman & Brandsdorfer, LLC
인용정보 피인용 횟수 : 19  인용 특허 : 32

초록

A heat exchanger and a method of manufacturing the heat exchanger is disclosed for dissipating heat from a heat generating component. The heat exchanger comprises a thermally conductive base in thermal communication with the component, a plurality of thermally conductive plate fins affixed to the ba

대표청구항

[ What is claimed is:] [1.] A heat exchanger for dissipating heat from a heat generating component, said heat exchanger comprising:a thermally conductive base in thermal communication with said component;a plurality of thermally conductive plate fins whereineach individual plate fin further comprisi

이 특허에 인용된 특허 (32)

  1. Mansingh Vivek (Santa Clara CA), Air-cooled heat exchanger for electronic circuit modules.
  2. Lindquist Stephen E. (Boylston MA) Bailey Douglas A. (Concord MA), Apparatus for an air impingement heat sink using secondary flow generators.
  3. Ito Eiji (Nagoya JPX), Cooling apparatus and assembling method thereof.
  4. Hatada Toshio (Tsuchiura JPX) Atarashi Takayuki (Tsuchiura JPX) Daikoku Takahiro (Ushiku NY JPX) Kobayashi Satomi (New York NY) Zushi Shizuo (Hadano JPX) Kobayashi Fumiyuki (Sagamihara JPX) Iwai Susu, Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system.
  5. Gotwald Charles A. (Poughkeepsie NY) Oktay Sevgin (Poughkeepsie NY) Sharma Ajay (Pleasant Valley NY) Sonnad Vijay (Kingston NY) Zingher Arthur R. (White Plains NY), Cooling system for semiconductor modules.
  6. Jacoby John H. (Jackson Pond Rd. New Hampton NH 03256), Dimpled heat transfer surface and method of making same.
  7. Anderson Timothy M. (Poughkeepsie NY) Chrysler Gregory M. (Poughkeepsie NY) Simons Robert E. (Poughkeepsie NY), Enhanced flow distributor for integrated circuit spot coolers.
  8. Wilens Seymour (Wantagh NY), Heat dissipating retainer for electronic package.
  9. Jeffries John ; Wang Ray, Heat dissipator with multiple thermal cooling paths.
  10. Terasaki Kazuo (Machida JPX) Takemura Hiroshi (Chofu JPX), Heat exchanger core.
  11. Minakami Ko (Kawasaki JPX) Terashima Toshinori (Yokohama JPX) Maeda Toshio (Yokohama JPX) Sasaki Tomiya (Kawasaki JPX) Hisano Katsumi (Yokohama JPX) Iwasaki Hideo (Kawasaki JPX) Kawano Koichiro (Yoko, Heat sink and the producing method thereof.
  12. Lee Yong N. (1010 W. Lonnquist Blvd. Mt. Prospect IL 60056), Heat sink apparatus.
  13. Wakabayashi Tetsushi (Kawasaki JPX) Honda Norio (Aizuwakamatsu JPX) Sakuma Osamu (Yokohama JPX), Heat sink for a semiconductor device.
  14. Jones Jack E. (Casselberry FL) Bulmahn David J. (Winter Springs FL), Heat sink for an electronic device.
  15. Goiffon John J. (Grapevine TX) Thawley S. Tom (Dallas TX), Heat sink/retainer clip for a downhole electronics package of a measurements-while-drilling telemetry system.
  16. Kent Kevin L. (Woodstock IL) Glomski Jacqueline D. (Arlington Heights IL), Heat sinking apparatus for surface mountable power devices.
  17. Mira Ali, High performance sinusoidal heat sink for heat removal from electronic equipment.
  18. Chrysler Gregory M. (Poughkeepsie NY) Chu Richard Chao-Fan (Poughkeepsie NY) Simmons Robert E. (Poughkeepsie NY), Immersion cooled circuit module with improved fins.
  19. Chu Richard C. (Poughkeepsie NY) Ellsworth ; Jr. Michael J. (Poughkeepsie NY) Vader David T. (New Paltz NY), Impingment cooled compliant heat sink.
  20. Nelson Richard D. (Austin TX) Herrell Dennis J. (Austin TX), Low pressure high heat transfer fluid heat exchanger.
  21. Jordan William D. (Dallas TX) Hinshaw Howard G. (Dallas TX), Method and apparatus for dissipating thermal energy.
  22. Chrysler Gregory Martin ; Chu Richard Chao-Fan, Method of making an ultra high-density, high-performance heat sink.
  23. Simons Robert E. (Poughkeepsie NY), Multi-stage heat sink.
  24. Hanlon Alfred G. (Poway CA), Multiple component circuit board cooling device.
  25. Azar Kaveh (Westwood MA) Caron Richard E. (Salem NH), Narrow channel finned heat sinking for cooling high power electronic components.
  26. Kitajo Sakae (Tokyo JPX), Package with heat sink.
  27. Ozeki Tamio (Tokyo JPX), Process for manufacturing a pin type radiating fin.
  28. Serizawa Hideaki (3-12 ; Ookubo 4-chome Kisarazu-shi ; Chiba-ken JPX) Hayami Masayoshi (Tokyo JPX) Yokozuka Kunimoto (Gunma-ken JPX), Radiation plate and method of producing the same.
  29. Griffis Patrick D. (Indianapolis IN), Semiconductor apparatus with integral heat sink tab.
  30. Fujisaki Akihiko,JPX ; Ishimine Junichi,JPX ; Suzuki Masumi,JPX ; Miyo Masahiro,JPX ; Kikuchi Shunichi,JPX ; Hirano Minoru,JPX ; Nori Hitoshi,JPX, Semiconductor element cooling apparatus.
  31. Leaycraft Edgar C. (Woodstock NY) Oktay Sevgin (Poughkeepsie NY) Ostergren Carl D. (Montgomery NY), Slotted heat sinks for high powered air cooled modules.
  32. Jordan William D. (Dallas TX) Smithers Matthew C. (Lewisville TX), Stamped and formed heat sink.

이 특허를 인용한 특허 (19)

  1. Langenfeld,Christopher C.; Newell,Scott W.; Schnellinger,Thomas S., Compression release valve.
  2. Tsai, Stephen; Lai, Li-Li, Display with a fluid balance structure.
  3. Hwang, Jer-Sheng; Chang, Teng-Kai, Finned cooling heat exchanger module with concave circular vortex generating area.
  4. Liang, Ting Wei; Wu, Min Jui, Heat dissipating structure and method of forming the same.
  5. Ankireddi, Seshasayee S.; Copeland, David W., Heat dissipation structure for an integrated circuit (IC) chip.
  6. Ankireddi, Seshasayee S.; Copeland, David W., Heat dissipation structure for an integrated circuit (IC) chip.
  7. Hanin,Leonid; Campo,Antonio, Heat exchange device.
  8. Malone,Christopher G.; Simon,Glenn C., Heat exchanger including flow straightening fins.
  9. Kubo, Hidehito; Kimbara, Masahiko; Toh, Keiji; Otoshi, Kota; Kono, Eiji; Tanaka, Katsufumi; Wakabayashi, Nobuhiro; Nakagawa, Shintaro; Furukawa, Yuichi; Yamauchi, Shinobu, Heat sink for power module.
  10. Seow, Thoong Hung; Saha, Sanjoy Kumar, Heat sink including extended surfaces.
  11. North, Mark T.; Koffs, Steven E., Heat sink with converging device.
  12. Kaslusky, Scott F.; St. Rock, Brian; Whiton, John H.; Nardone, Vincent C., Heat transfer device with fins defining air flow channels.
  13. Demers, Jason A.; Leonard, Scott A.; Owens, Kingston, Liquid pumps with hermetically sealed motor rotors.
  14. Jensen, Eric; Langenfeld, Christopher C.; Newell, Scott; Norris, Michael; Renk, Jeffrey D.; Schnellinger, Andrew, Metering fuel pump.
  15. LaRocque,Ryan K.; Langenfeld,Christopher C.; Norris,Michael G.; Smith, III,Stanley B.; Strimling,Jonathan M., Thermal improvements for an external combustion engine.
  16. Kamen, Dean; Langenfeld, Christopher C.; Smith, III, Stanley B.; Bhat, Prashant; LaRocque, Ryan; Schnellinger, Andrew A.; Clapp, Otis L., Water vapor distillation apparatus, method and system.
  17. Kamen, Dean; Langenfeld, Christopher C.; LaRocque, Ryan K.; Schnellinger, Andrew A.; Bhat, Prashant; Smith, III, Stanley B.; Clapp, Otis L.; Swerdlow, Jeremy M., Water vending apparatus.
  18. Kamen, Dean; Langenfeld, Christopher C.; LaRocque, Ryan K.; Schnellinger, Andrew A.; Bhat, Prashant; Smith, III, Stanley B.; Clapp, Otis L.; Swerdlow, Jeremy M., Water vending apparatus.
  19. Gurski,Thomas Q.; Langenfeld,Christopher C.; Smith, III,Stanley B., Work-space pressure regulator.
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