초록 ▼

A thermoelectric cooling assembly is provided having at least a first thermoelectric stage thermally coupled to a heat source, such as an electronic device, and a second thermoelectric stage thermally coupled to the first thermoelectric stage across a "thermal space transformer". The first thermoele

A thermoelectric cooling assembly is provided having at least a first thermoelectric stage thermally coupled to a heat source, such as an electronic device, and a second thermoelectric stage thermally coupled to the first thermoelectric stage across a "thermal space transformer". The first thermoelectric stage has a first surface area for thermal dissipation and the second thermoelectric stage has a second surface area for thermal absorption wherein the second surface area is greater than the first surface area. The thermal space transformer has a first thermal conductivity in a plane transverse to a direction of primary heat flow through the first thermoelectric stage and the second thermoelectric stage, and a second thermal conductivity in a direction parallel to the direction of primary heat flow, wherein the first thermal conductivity is greater than the second thermal conductivity. In one embodiment, the thermal space transformer can comprise a graphite composite material with diamond coating on both main surfaces thereof. The thermoelectric cooling assembly can further comprise: a cold plate; a refrigeration unit coupled to the cold plate; a dc power controller for controlling dc power through the first and second thermoelectric stages; and a temperature sensor for providing feedback information to the dc power controller on temperature of the electronic device being cooled.

대표청구항 ▼

[ What is claimed is:] [1.] Apparatus for cooling an electronic device, said apparatus comprising:a first thermoelectric stage thermally coupled to said electronic device, said first thermoelectric stage having a first surface area for thermal dissipation;a second thermoelectric stage, said second t

[ What is claimed is:] [1.] Apparatus for cooling an electronic device, said apparatus comprising:a first thermoelectric stage thermally coupled to said electronic device, said first thermoelectric stage having a first surface area for thermal dissipation;a second thermoelectric stage, said second thermoelectric stage having a second surface area for thermal absorption, wherein said second surface area is greater than said first surface area; anda thermal space transformer disposed between said first thermoelectric stage and said second thermoelectric stage, and thermally coupling said first thermoelectric stage to said second thermoelectric stage, wherein said thermal space transformer has a first thermal conductivity in an x-y axis plane transverse to a direction of primary heat flow through said first thermoelectric stage and said second thermoelectric stage, and a second thermal conductivity in a z axis direction parallel to said direction of primary heat flow through said first thermoelectric stage and said second thermoelectric stage, and wherein said first thermal conductivity is greater than said second thermal conductivity.