초록 ▼

A multi-tile configured, two-dimensional phased array antenna architecture is configured of an gridwork of sub-array `tiles`, each of which contains a mechanically integrated and RF-integrated antenna elements and RF interface components therefor. Each tile is formed of a multilayer printed wiring b

A multi-tile configured, two-dimensional phased array antenna architecture is configured of an gridwork of sub-array `tiles`, each of which contains a mechanically integrated and RF-integrated antenna elements and RF interface components therefor. Each tile is formed of a multilayer printed wiring board and supports a sub-array of antenna elements and their associated RF circuits, so that the tile itself is effectively an operative phased-array antenna. The gridwork supports the sub-array tiles in sealed engagement with the framework, whereby associated RF networks components at rear sides of the tiles are protected against the free space environment to which the antenna elements on front faces of the tiles are exposed. Each RF interface network contains signal processing circuitry for controlling the operation of a respective one or a set of the antenna elements on the front side of the tile.

대표청구항 ▼

[ What is claimed:] [1.] A phased array antenna architecture comprising:a plurality of phased array antenna tiles, a respective phased array antenna tile includinga multilayer printed circuit wiring board containing a laminate of interconnect layers, including control signal and DC voltage distribut

[ What is claimed:] [1.] A phased array antenna architecture comprising:a plurality of phased array antenna tiles, a respective phased array antenna tile includinga multilayer printed circuit wiring board containing a laminate of interconnect layers, including control signal and DC voltage distribution conductors that provide control signal interconnectivity and DC power distribution for antenna and RF signal processing circuit devices of said respective phased array antenna tile, interposed between first and second opposite sides of said multilayer printed circuit wiring board,a plurality of signal processing interface networks including RF microstrip networks distributed on said first side of said multilayer printed circuit wiring board,a plurality of RF signal processing circuit devices mounted to and connected by said plurality of signal processing interface networks distributed on said first side of said multilayer printed circuit wiring board to said control signal and DC voltage distribution conductors of said laminate of interconnect layers, anda plurality of antenna elements distributed over said second side of said multilayer printed circuit wiring board, and being coupled through said multilayer printed circuit wiring board to associated ones of said plurality of RF signal processing circuit devices mounted to said signal processing interface networks distributed on said first side of said multilayer printed circuit wiring board; anda support structure for supporting said plurality of phased array antenna tiles.