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Cooling apparatus and method of assembling same 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28D-009/00
  • F28F-003/08
출원번호 US-0033926 (1998-03-03)
발명자 / 주소
  • Downing Robert Scott
출원인 / 주소
  • Hamilton Sundstrand Corporation
대리인 / 주소
    Marshall, O'Toole, Gerstein, Murray & Borun
인용정보 피인용 횟수 : 41  인용 특허 : 29

초록

A cooling apparatus includes first and second laminations each having a plurality of openings wherein the openings of the first and second laminations are substantially coincident when the laminations are disposed in identical orientations and the first lamination is aligned with and overlies the se

대표청구항

[ What is claimed is:] [1.] Cooling apparatus, comprising:first and second identical laminations each having a plurality of openings wherein the openings of the first and second laminations are substantially coincident when the laminations are disposed in identical orientations and the first laminat

이 특허에 인용된 특허 (29)

  1. Bttcher Jrgen (Lauf DEX) Ganz Rudolf (Lauf DEX) Heinz Otto (Neu Isenburg DEX) Hnerlage Jrg (Kieselbronn DEX), Ceramic board utilized for the construction of heat exchanger plates.
  2. Nordin Ronald A. (Naperville IL), Circuit card assembly.
  3. Niggemann Richard E. (Rockford IL), Cold plane system for cooling electronic circuit components.
  4. Ciaccio Michael P. (Rockford IL), Cold plate for cooling electronics.
  5. Rojey Alexandre (Garches FRX) Cohen Georges (Le Pecq FRX), Compact heat exchanger.
  6. Sutrina Thomas A. (Rockford IL), Cooled stack of electrically isolated semiconductors.
  7. Edwards Steven F. (702 N. Oak Cliff Blvd. Dallas TX 75208) Maier Peter (Hugo Dietz Str. 19 8650 Lauf DEX) Shultz-Harder Jurgen (Hugo Dietz Str. 32 8650 Lauf DEX), Direct bonded heat spreader.
  8. Taverdet Jean C. (Orange FRX), Encapsulated housing for dissipating heat produced by electrical circuits.
  9. Crowe Lawrence E. (Lindenwood IL), Enhanced air fin cooling arrangement for a hermetically sealed modular electronic cold plate utilizing reflux cooling.
  10. Grehier Alain (Paris FRX) Rojey Alexandre (Garches FRX), Heat exchange device of the perforated plate exchanger type with improved sealing.
  11. Bartels Eugene L. (Kettering OH) Fleming Robert B. (Scotia NY), Heat exchanger core having expanded metal heat transfer surfaces.
  12. Julien Jean-Nol (Beaucaire FRX) Ouvrel Jean-Paul (Bollene FRX), Heat exchanger for electronic components and electro-technical equipment.
  13. Rjey Alexandre (Garches FRX), Heat exchanger with staggered perforated plates.
  14. Hesselgreaves John E. (Lanark GB6), Heat exchangers.
  15. Lee Yong N. (1010 W. Lonnquist Blvd. Mt. Prospect IL 60056), Heat sink apparatus.
  16. Chrysler Gregory M. (Poughkeepsie NY) Chu Richard Chao-Fan (Poughkeepsie NY) Simmons Robert E. (Poughkeepsie NY), Immersion cooled circuit module with improved fins.
  17. Bland Timothy J. (Rockford IL) Niggemann Richard E. (Rockford IL), Impingement cooling apparatus for heat liberating device.
  18. Swift Gregory W. (Los Alamos NM) Migliori Albert (Santa Fe NM) Wheatley John C. (Los Alamos NM), Microchannel crossflow fluid heat exchanger and method for its fabrication.
  19. Mundinger David C. ; Worland D. Philip, Modular microchannel heat exchanger.
  20. Skoog Malte (Stjrngatan 20 Lund S-223 57 SEX), Plate heat exchanger.
  21. Kusuda Hisao (Tosu JPX) Uehara Haruo (Saga JPX), Plate type evaporator.
  22. Johnston Anthony M. (Hazelbrook AUX), Plate type heat exchanger.
  23. Bosaeus Jan A. (Nykoping SE), Plate-type heat exchanger.
  24. Yamauchi Yoshiyuki (Aichi JPX) Ohara Toshio (Kariya JPX) Takahashi Toshio (Oobu JPX), Plate-type heat exchanger.
  25. Chisholm John (9337 SE. River Ter. Jupiter FL 33458), Process for making a high heat transfer surface composed of perforated or expanded metal.
  26. Akyrek Altan (Eichenhain 32/12 8560 Lauf DEX) Maier Peter (Hugo-Dietz-Str. 19 8560 Lauf DEX) Schulz-Harder Jrgen (Am Stadtwald 2 8489 Eschenbach DEX), Semiconductor module with multi-plane conductive path.
  27. Lutfy, Gary J., Semiconductor package with internal heat exchanger.
  28. Harada Shintaro (Aichi JPX), Stacked-plate type heat exchanger.
  29. Schulz-Harder Jrgen (AM Stadtwald 2 D-8489 Eschenbach DEX), Substrate, consisting of copper and ceramic layers, for printed circuit boards of electrical circuits.

이 특허를 인용한 특허 (41)

  1. Des Champs, Nicholas H., Apparatus and method for equalizing hot fluid exit plane plate temperatures in heat exchangers.
  2. Dede, Ercan Mehmet; Liu, Yan, Cold plate assemblies and power electronics modules.
  3. Goldman, Richard; Akselband, Boris; Gerbutavich, Charles; Carswell, Charles, Contact cooling device.
  4. Jurgen Schulz-Harder DE, Cooler.
  5. Dede, Ercan Mehmet; Liu, Yan, Cooling apparatuses and power electronics modules.
  6. Kaslusky, Scott F.; St. Rock, Brian, Electronics package with radial heat sink and integrated blower.
  7. Downing, Robert Scott, Evaporative compact high intensity cooler.
  8. Reinke,Michael J.; Valensa,Jeroen, Fuel vaporizer for a reformer type fuel cell system.
  9. Snyder, Daniel A.; Propheter-Hinckley, Tracy A.; Mongillo, Dominic J., Gas turbine engine component having engineered vascular structure.
  10. Mongillo, Dominic J.; Propheter-Hinckley, Tracy A.; Zelesky, Mark F.; Wagner, Joel H.; Slavens, Thomas N., Gas turbine engine component having vascular engineered lattice structure.
  11. Snyder, Daniel A., Gas turbine engine component having vascular engineered lattice structure.
  12. Zelesky, Mark F.; Wagner, Joel H.; Propheter-Hinckley, Tracy A.; Blair, Michael F.; Slavens, Thomas N.; Mongillo, Dominic J., Gas turbine engine component having vascular engineered lattice structure.
  13. Kostka, Jr., Stanislav; Cunha, Frank J., Gas turbine engine component with vascular cooling scheme.
  14. Bertolotti, Fabio P.; Sabatino, Daniel R., Heat exchanger.
  15. Valenzuela,Javier A.; Jasinski,Thomas J., Heat exchanger.
  16. Fetvedt, Jeremy Eron, Heat exchanger comprising one or more plate assemblies with a plurality of interconnected channels and related method.
  17. Johnston, Anthony Matthew, Heat exchanger core.
  18. Vanden Bussche, Kurt M.; Daly, Phillip F., Heat exchanger design for natural gas liquefaction.
  19. Martin, Michael A.; Storr, Cindy W.; Wu, Alan Ka-Ming; So, Allan K.; Miller, B. Timothy; Spirou, Christina, Heat exchanger, method of forming a sleeve which may be used in the heat exchanger, and a sleeve formed by the method.
  20. Pollard, Berwyn Owain; Scott, David Russell, Heat exhanger apparatus including heat transfer surfaces.
  21. Zaffetti, Mark A.; Taddey, Edmund P., Integral cold plate and structural member.
  22. Joshi, Shailesh N., Jet impingement cooling apparatuses having enhanced heat transfer assemblies.
  23. Reinke, Michael J.; Wattelet, Jonathan; Voss, Mark G.; Weisser, Marc; Motzet, Bruno; Thumm, Sven; Granetzke, Dennis C., Method and apparatus for vaporizing fuel for a reformer fuel cell system.
  24. Goldman, Richard; Akselband, Boris; Gerbutavich, Charles; Carswell, Charles, Method of manufacturing a contact cooling device.
  25. Zaffetti, Mark A.; Laurin, Michael B., Monolithic cold plate configuration.
  26. Mathias, James A.; Chadwell, G. Bradley; Qiu, Dongming; Tonkovich, Annalee Y.; Perry, Steven T.; Schmidt, Matthew B.; Fitzgerald, Sean P.; Hesse, David J.; Yuschak, Thomas D.; Yang, Bin, Multi-stream microchannel device.
  27. Mathias,James Allen; Chadwell,G. Bradley; Qiu,Dongming; Tonkovich,Anna Lee Y.; Perry,Steven T.; Schmidt,Matthew B., Multi-stream microchannel device.
  28. Mathias, James A.; Chadwell, G. Bradley; Qui, Dongming; Tonkovich, Anna Lee Y.; Perry, Steven T.; Schmidt, Matthew B.; Fitzgerald, Sean P.; Hesse, David J.; Yuschak, Thomas D.; Yang, Bin, Multi-stream multi-channel process and apparatus.
  29. St. Rock, Brian; Kaslusky, Scott F., Non-circular radial heat sink.
  30. Valenzuela, Javier A., Normal-flow heat exchanger.
  31. Valenzuela, Javier A., Normal-flow heat exchanger.
  32. Valenzuela,Javier A., Normal-flow heat exchanger.
  33. Dede, Ercan Mehmet, Power electronics modules and power electronics module assemblies.
  34. Tonkovich, Anna Lee; Simmons, Wayne W.; Jarosch, Kai Tod Paul; Mazanec, Terry; Daymo, Eric; Peng, Ying; Marco, Jennifer Lynne, Process for conducting an equilibrium limited chemical reaction in a single stage process channel.
  35. Tonkovich,Anna Lee; Simmons,Wayne W.; Jarosch,Kai Tod Paul; Mazanec,Terry; Daymo,Eric; Peng,Ying; Marco,Jennifer Lynne, Process for conducting an equilibrium limited chemical reaction in a single stage process channel.
  36. Tonkovich, Anna Lee; Jarosch, Kai Tod Paul; Mazanec, Terry; Daly, Francis P.; Taha, Rachid; Aceves de Alba, Enrique, Process for conducting an equilibrium limited chemical reaction using microchannel technology.
  37. Mathias,James A.; Arora,Ravi; Simmons,Wayne W.; McDaniel,Jeffrey S.; Tonkovich,Anna Lee; Krause,William A.; Silva,Laura J.; Qiu,Dongming, Process for cooling a product in a heat exchanger employing microchannels.
  38. Mathias, James A.; Arora, Ravi; Simmons, Wayne W.; McDaniel, Jeffrey S.; Tonkovich, Anna Lee; Krause, William A.; Silva, Laura J., Process for cooling a product in a heat exchanger employing microchannels for the flow of refrigerant and product.
  39. Martin,Michael A.; Vanderwees,Doug, Stacked plate heat exchangers and heat exchanger plates.
  40. Lewis,Guy H.; Pan,Chien Ping; Wright,Harold A.; Anderson,David H.; Minahan,David M.; Melquist,Vincent H.; Ercan,Cemal; Straguzzi,Gloria I.; Landis,Stephen R.; Ellison,Phillipp R., Utilization of micro-channel gas distributor to distribute unreacted feed gas into reactors.
  41. Rau, Matthew Joseph; Dede, Ercan Mehmet; Joshi, Shailesh N.; Garimella, Suresh V., Vehicles, power electronics modules and cooling apparatuses with single-phase and two-phase surface enhancement features.
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