초록 ▼

A method for producing a back-illuminated CMOS image sensor including a matrix of pixels (e.g., CMOS APS cells) that are fabricated on a semiconductor substrate. The semiconductor substrate is secured to a protective substrate by an adhesive such that the processed (frontside) surface of the semicon

A method for producing a back-illuminated CMOS image sensor including a matrix of pixels (e.g., CMOS APS cells) that are fabricated on a semiconductor substrate. The semiconductor substrate is secured to a protective substrate by an adhesive such that the processed (frontside) surface of the semiconductor substrate faces the protective substrate. With the protective substrate providing structural support, the exposed backside surface of the semiconductor substrate is then subjected to grinding and/or chemical etching, followed by optional chemical/mechanical processing, to thin the semiconductor substrate to a range of 10 to 15 microns. A transparent substrate (e.g., glass) is then secured to the backside surface of the semiconductor substrate, thereby sandwiching the semiconductor substrate between the transparent substrate and the protective substrate.

대표청구항 ▼

[ What is claimed is:] [1.] A method of producing backside illuminated image sensors comprising the steps of:producing a plurality of image sensor circuits on a wafer having first and second surfaces each of the image sensor circuits being formed on the first surface and including a matrix of light-

[ What is claimed is:] [1.] A method of producing backside illuminated image sensors comprising the steps of:producing a plurality of image sensor circuits on a wafer having first and second surfaces each of the image sensor circuits being formed on the first surface and including a matrix of light-sensitive pixel regions extending into the wafer from the first surface;securing the wafer onto a protective substrate such that the first surface faces the protective substrate;removing material from the second surface of the wafer until the light-sensitive pixel regions of each image sensor circuit are effectively exposed through the second surface;securing a transparent substrate onto the second surface of the wafer, thereby producing a waferwise sandwich; andslicing the waferwise sandwich, thereby defining a plurality of backside illuminated image sensors.