초록 ▼

A process for providing a plurality free-standing resilient contact structures (spring elements) mounted to a surface of a carrier substrate. The carrier substrate is mounted to a surface of a semiconductor device, or one or more unsingulated semiconductor dies. Bond pads of the semiconductor device

A process for providing a plurality free-standing resilient contact structures (spring elements) mounted to a surface of a carrier substrate. The carrier substrate is mounted to a surface of a semiconductor device, or one or more unsingulated semiconductor dies. Bond pads of the semiconductor device are connected to the spring elements by bond wires extending between the bond pads and terminals associated with the spring elements. The carrier substrate is mounted to one or more semiconductor devices prior to the semiconductor devices being singulated from a semiconductor wafer upon which they are formed Resilience and compliance to effect pressure connections to the semiconductor device are provided by the spring elements extending from the carrier substrate, per se.

대표청구항 ▼

[ What is claimed is:] [1.] A method of mounting contact structures to semiconductor devices, comprising:fabricating a plurality of free-standing contact structures on a surface of a carrier substrate;disposing the carrier substrate on a surface of at least one semiconductor device; andconnecting se

[ What is claimed is:] [1.] A method of mounting contact structures to semiconductor devices, comprising:fabricating a plurality of free-standing contact structures on a surface of a carrier substrate;disposing the carrier substrate on a surface of at least one semiconductor device; andconnecting selected ones of the free-standing contact structures to selected ones of terminals of the at least one semiconductor device;wherein:selected ones of the free-standing contact structures comprise composite interconnection elements having a core comprising a first material overcoated with a second material which is harder than the first material.