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Method and apparatus for distinguishing particles from subsurface defects on a substrate using polarized light 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G01N-021/00
출원번호 US-0338251 (1999-06-22)
발명자 / 주소
  • Eremin Yuri A.,RUX
  • Stover John C.
  • Scheer Craig A.
출원인 / 주소
  • ADE Optical Systems
대리인 / 주소
    Alston & Bird LLP
인용정보 피인용 횟수 : 63  인용 특허 : 17

초록

Particles are distinguished from pits, voids, scratches, and other subsurface defects in a surface of a substrate by impinging the defect with polarized light and integrating light scattered by the defect over a wide angular range to produce a total integrated response. Using a P-polarized incident

대표청구항

[ What is claimed is:] [1.] A method for detecting a defect at a region on a surface of a substrate and for discriminating between particle defects and subsurface defects, the method comprising:directing a first beam of P-polarized light to impinge at said region on the surface at a first incident a

이 특허에 인용된 특허 (17)

  1. Hayano Fuminori (Fujisawa JPX) Imamura Kazunori (Tokyo JPX) Murata Sunao (Kawasaki JPX) Kato Kinya (Tokyo JPX), Apparatus with four light detectors for checking surface of mask with pellicle.
  2. Reich Frederich R. (Richland WA), Detecting irregularities in a coating on a substrate.
  3. Hayano Fuminori (Kamakura JPX) Imamura Kazunori (Tokyo JPX) Murata Sunao (Kawasaki JPX), Inspecting apparatus for determining presence and location of foreign particles on reticles or pellicles.
  4. Tsuji Toshihiko (Ayase JPX) Takeuchi Seiji (Kawasaki JPX) Miyazaki Kyoichi (Mitaka JPX) Yoshii Minoru (Tokyo JPX) Nose Noriyuki (Atsugi JPX) Mori Tetsuzo (Atsugi JPX), Inspection method and apparatus for inspecting a particle, if any, on a substrate having a pattern.
  5. Takeda Kazuo,JPX ; Ishida Hidetsugu,JPX ; Hiraiwa Atsushi,JPX, Inspection method, inspection apparatus and method of production of semiconductor device using them.
  6. Silva ; deceased Robert M. (late of Dayton OH by Ruby M. Silva ; executrix) Orazio ; Jr. Fred D. (Centerville OH) Sledge ; Jr. Robert B. (Dayton OH), Method and apparatus for nondestructively measuring subsurface defects in materials.
  7. Germer Thomas A. ; Asmail Clara C., Microroughness-blind optical scattering instrument.
  8. Broude Sergey V. (Newton Centre MA) Allen Nicholas (Bedford MA) Boudour Abdu (West Newton MA) Chase Eric (Carlisle MA) Johnson Carl (Tewksbury MA) Miller Pascal (North Chelmsford MA) Ormsby Jay (Sale, Optical inspection system and method for detecting flaws on a diffractive surface.
  9. Wells Keith B. (Santa Cruz CA) Nguyen Hung (Santa Clara CA) Johnson Ralph T. (Los Gatos CA) Leslie Brian C. (Cupertino CA), Process for inspecting patterned wafers.
  10. Nakashige Yukiko (Hyogo JPX) Nishioka Tadashi (Hyogo JPX), Semiconductor wafer inspection apparatus.
  11. Batchelder John S. (Tarrytown NY), Semiconductor wafer surface inspection apparatus and method.
  12. Moriya Kazuo (Ageo JPX), Substrate internal defect and external particle detecting apparatus using s-polarized and p-polarized light.
  13. Knollenberg Robert G. (Boulder CO), Surface analysis system and method.
  14. Quackenbos George S. (Newburyport MA) Ormsby Jay L. (Salem NH) Chase Eric T. (Andover MA) Broude Sergey V. (Acton MA) Nishine Koichi (Westford MA), Surface defect detection and confirmation system and method.
  15. Clementi Lee D. ; Fossey Michael E., Surface inspection system and method of inspecting surface of workpiece.
  16. Allen Nicholas C. (Bedford MA) Broude Sergey V. (Newton Centre MA) Chase Eric T. (Nashua NH) Miller Pascal (North Chelmsford MA) Ormsby Jay L. (Salem NH) Rostaing Bruno (Medford MA) Quackenbos Lloyd , Surface pit and mound detection and discrimination system and method.
  17. Quackenbos George S. (Newburyport MA) Ormsby Jay L. (Salem NH) Chase Eric T. (Andover MA) Broude Sergey V. (Acton MA) Nishine Koichi (Westford MA), Surface pit detection system and method.

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  1. Borden, Peter G.; Li, Ji Ping, Apparatus and method for measuring a property of a layer in a multilayered structure.
  2. Borden,Peter G.; Li,Ji Ping, Apparatus and method for measuring a property of a layer in a multilayered structure.
  3. Borden, Peter G.; Li, Jiping; Madsen, Jon, Calibration as well as measurement on the same workpiece during fabrication.
  4. Meeks, Steven W.; Kudinar, Rusmin, Combined high speed optical profilometer and ellipsometer.
  5. Meeks,Steven W; Kudinar,Rusmin, Combined high speed optical profilometer and ellipsometer.
  6. Meeks, Steven W., Detecting and classifying surface features or defects by controlling the angle of the illumination plane of incidence with respect to the feature or defect.
  7. Bechtler,Laurie; Velidandla,Vamsi; Meeks,Steven W., Detecting surface pits.
  8. Baer,Adam; Auerbach,Ditza, Determination of irradiation parameters for inspection of a surface.
  9. Leonard,Robert Tyler; Jenny,Jason Ronald, Double side polished wafer scratch inspection tool.
  10. Borden, Peter G.; Li, Jiping, Evaluating a geometric or material property of a multilayered structure.
  11. Borden,Peter G; Li,Jiping, Evaluating a geometric or material property of a multilayered structure.
  12. Borden, Peter G.; Li, Ji-Ping, Evaluating a multi-layered structure for voids.
  13. Borden,Peter G.; Li,Ji Ping, Evaluating a multi-layered structure for voids.
  14. Borden,Peter G.; Li,Ji Ping, Evaluating a multi-layered structure for voids.
  15. Borden,Peter G.; Li,Ji Ping, Evaluating a multi-layered structure for voids.
  16. Li, Jiping; Borden, Peter G., Evaluating sidewall coverage in a semiconductor wafer.
  17. Maeda, Kohei, Foreign particle inspection apparatus, exposure apparatus, and method of manufacturing device.
  18. Li,Jiping; Borden,Peter G.; Genio,Edgar B., High throughput measurement of via defects in interconnects.
  19. Borden, Peter G.; Li, Ji-Ping, Identifying defects in a conductive structure of a wafer, based on heat transfer therethrough.
  20. Meeks, Steven W., Material independent optical profilometer.
  21. Meeks,Steven W., Material independent optical profilometer.
  22. Meeks, Steven W., Material independent profiler.
  23. Krishnan, Shankar; Wang, Haiming, Measurement of critical dimension.
  24. Borden, Peter G., Measurement of lateral diffusion of diffused layers.
  25. Borden, Peter G.; Li, Jiping, Measuring a property of a layer in multilayered structure.
  26. Hyun,Pil Sik; Choi,Sun Yong; Lee,Sang Kil; Jun,Chung Sam; Kim,Sang Min, Method and apparatus for classifying defects of an object.
  27. Takezawa, Yoshitaka; Katagiri, Jun'ichi; Shoji, Hiroshi; Ootaka, Kenichi, Method and apparatus of diagnosing deterioration of an article.
  28. Lorusso, Gian Francesco; Grella, Luca; Masnaghetti, Douglas K.; Azordegan, Amir, Method and system for e-beam scanning.
  29. Chung-sam Jun KR; Sang-mun Chon KR; Sang-bong Choi KR; Hyung-suk Cho KR; Pil-sik Hyun KR; Kyu-hong Lim KR; Byung-am Lee KR, Method of and device for detecting micro-scratches.
  30. Jun, Chung-sam; Chon, Sang-mun; Choi, Sang-bong; Cho, Hyung-suk; Hyun, Pil-sik; Lim, Kyu-hong; Lee, Byung-am, Method of and device for detecting micro-scratches.
  31. Meeks,Steven W., Method of detecting and classifying scratches and particles on thin film disks or wafers.
  32. Meeks, Steven W., Method of detecting and classifying scratches, particles and pits on thin film disks or wafers.
  33. Stanke, Fred E., Method of detecting residue on a polished wafer.
  34. Moghaddam, Alireza Shahdoost; Nguyen, Hung Phi, Method of detecting the thickness of thin film disks or wafers.
  35. Meeks, Steven W., Multi-wavelength system and method for detecting epitaxial layer defects.
  36. Meeks, Steven W.; Nguyen, Hung P., Multiple spot size optical profilometer, ellipsometer, reflectometer and scatterometer.
  37. Marxer,Norbert; Gross,Kenneth P.; Altendorfer,Hubert; Kren,George, Process and assembly for non-destructive surface inspections.
  38. Standiford,Keith; Neil,Mark A., Region-of-interest based electron beam metrology.
  39. Vaez Iravani,Mehdi; Stokowski,Stanley; Zhao,Guoheng, Sample inspection system.
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  43. Vaez-Iravani, Mehdi; Stokowski, Stanley; Zhao, Guoheng, Sample inspection system.
  44. Vaez-Iravani, Mehdi; Stokowski, Stanley; Zhao, Guoheng, Sample inspection system.
  45. Mizuo, Mariko; Miyazaki, Yoko, Semiconductor inspection system, and method of manufacturing a semiconductor device.
  46. Lu, Tongxin; Wang, Xiaohan, Spectroscopic ellipsometers.
  47. Meeks, Steven W.; Sappey, Romain; Carr, Tom, Surface characteristic analysis.
  48. Oak, Dave S.; Do, Tri; Soetarman, Ronny; Meeks, Steven W.; Velidandla, Vamsi, Surface finish roughness measurement.
  49. Isozaki, Hisashi; Yoshikawa, Hiroshi, Surface inspecting apparatus and method.
  50. Isozaki, Hisashi; Yoshikawa, Hiroshi, Surface inspection apparatus and method.
  51. Xu,James J.; Lee,Ken K., Surface inspection system.
  52. Mehanian,Courosh; Meeks,Steven W.; Rosengaus,Eliezer, Surface scanning.
  53. Soetarman,Ronny; Velidandla,Vamsi M.; Leung,Jimmy; Meeks,Steven W., System and method for automatically determining magnetic eccentricity of a disk.
  54. Velidandla,Vamsi, System and method for classifying, detecting, and counting micropipes.
  55. Meeks,Steven W., System and method for double sided optical inspection of thin film disks or wafers.
  56. Meeks, Steven W.; Kudinar, Rusmin, System and method for measuring object characteristics using phase differences in polarized light reflections.
  57. Meeks, Steven W.; Kudinar, Rusmin, System and method for measuring properties of an object using a phase difference between two reflected light signals.
  58. Moghadam,Alireza Shahdoost; Velidandla,Vamsi Mohan, System and method for optimizing wafer flatness at high rotational speeds.
  59. Meeks, Steven W.; Kudinar, Rusmin, System for simultaneously measuring thin film layer thickness, reflectivity, roughness, surface profile and magnetic pattern.
  60. Biellak,Steve; Stokowski,Stanley E.; Vaez Iravani,Mehdi, Systems and methods for a wafer inspection system using multiple angles and multiple wavelength illumination.
  61. Zhao, Guoheng; Leong, J. K.; Kirk, Michael, Systems and methods for defect material classification.
  62. Bevis,Christopher F.; Kirk,Mike; Vaez Iravani,Mehdi, Systems for inspection of patterned or unpatterned wafers and other specimen.
  63. Meeks, Steven W.; Kudinar, Rusmin; Wheeler, William R.; Nguyen, Hung Phi; Velidandla, Vamsi; Somanchi, Anoop; Soetarman, Ronny, Wafer edge inspection.
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