$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Molded polishing pad having integral window 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24D-011/00
출원번호 US-0375962 (1999-08-17)
발명자 / 주소
  • Roberts John V. H.
  • Pinheiro Barry Scott
  • James David B.
출원인 / 주소
  • Rodel Holdings, Inc.
대리인 / 주소
    Kaeding
인용정보 피인용 횟수 : 84  인용 특허 : 4

초록

A polishing pad is formed as a one-piece article having a region which is transparent and an adjacent region which is opaque. The article is formed by solidifying a flowable polymeric material which at least initially has a uniform composition. The flowable polymeric material is processed during a m

대표청구항

[ We claim:] [1.] A polishing pad comprising:said polishing pad having at least one, optically transmissive region each having the same chemical formulation as a remainder of said polishing pad;said material formulation being of optically transmissive phase in each optically transmissive region;said

이 특허에 인용된 특허 (4)

  1. Birang Manoocher ; Gleason Allan ; Guthrie William L., Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus.
  2. Koos Daniel A. (Boise ID) Meikle Scott (Boise ID), Optical end point detection methods in semiconductor planarizing polishing processes.
  3. Roberts John V. H. (Newark DE), Polishing pads.
  4. Miyaji Akira,JPX ; Arai Takashi,JPX ; Yagi Takeshi,JPX, Semiconductor wafer polishing apparatus.

이 특허를 인용한 특허 (84)

  1. Roberts, John V. H., Anti-scattering layer for polishing pad windows.
  2. Birang, Manoocher; Johansson, Nils; Gleason, Allan, Apparatus and method for in-situ endpoint detection for semiconductor processing operations.
  3. Manning, Monis J., CMP pad with composite transparent window.
  4. Prasad, Abaneshwar, CMP pad with composite transparent window.
  5. Allison, William; Huang, Ping; Scott, Diane; Frentzel, Richard; Kerprich, Robert, CMP pad with local area transparency.
  6. Repper, Angus; James, David B.; Leugers, Mary A., Chemical mechanical polishing pad with broad spectrum, endpoint detection window and method of polishing therewith.
  7. Qian, Bainian; DeGroot, Marty W., Chemical mechanical polishing pad with clear endpoint detection window.
  8. Qian, Bainian; DeGroot, Marty W., Chemical mechanical polishing pad with endpoint detection window.
  9. Qian, Bainian; DeGroot, Marty W., Chemical mechanical polishing pad with endpoint detection window.
  10. Qian, Bainian; DeGroot, Marty W.; Murnane, James; Repper, Angus; Jensen, Michelle; Hendron, Jeffrey J.; Nowland, John G.; James, David B.; Yeh, Fengji, Chemical mechanical polishing pad with polishing layer and window.
  11. Misra, Sudhanshu; Roy, Pradip K., Customized polish pads for chemical mechanical planarization.
  12. Roy, Pradip K.; Deopura, Manish; Misra, Sudhanshu, Customized polishing pads for CMP and methods of fabrication and use thereof.
  13. Roy, Pradip K.; Deopura, Manish; Misra, Sudhanshu, Customized polishing pads for CMP and methods of fabrication and use thereof.
  14. Roy, Pradip K.; Deopura, Manish; Misra, Sudhanshu, Customized polishing pads for CMP and methods of fabrication and use thereof.
  15. Roy, Pradip K; Deopura, Manish; Misra, Sudhanshu, Customized polishing pads for CMP and methods of fabrication and use thereof.
  16. Birang,Manoocher; Gleason,Allan; Guthrie,William L., Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus.
  17. Hussaini, Saied; Iacovelli, Marc, Game controller.
  18. Huh,Hyun; Lee,Sang Mok; Song,Kee Cheon; Kim,Seung geun; Son,Do Kwon, Integral polishing pad and manufacturing method thereof.
  19. Redeker,Fred C.; Birang,Manoocher; Li,Shijian; Somekh,Sasson, Linear polishing sheet with window.
  20. West, Thomas; Quigley, Gary; Galvez, Pepito; McKeever, Peter; Holani, Suli, Method and systems to control optical transmissivity of a polish pad material.
  21. Jones, Jeremy; Sevilla, Roland K., Method for manufacturing a polishing pad having a compressed translucent region.
  22. Prasad,Abaneshwar, Method for manufacturing microporous CMP materials having controlled pore size.
  23. Boldizar,Mark J.; Gamble,Robert T.; Hedrick,Vincent Matthew; Lawhorn,Jason M.; Saikin,Alan H.; Tome,Katherine L., Method of forming a layered polishing pad.
  24. Birang, Manoocher; Gleason, Allan; Guthrie, William L., Method of forming a transparent window in a polishing pad.
  25. Hu, Yongqi; Narendrnath, Kadthala Ramaya; Terry, Thomas Lawrence, Method of placing window in thin polishing pad.
  26. Lehman,Kurt; Chen,Charles; Allen,Ronald L.; Shinagawa,Robert; Sethuraman,Anantha; Bevis,Christopher F.; Trikas,Thanassis; Chen,Haiguang; Meng,Ching Ling, Methods and systems for detecting a presence of blobs on a specimen during a polishing process.
  27. Lehman,Kurt; Chen,Charles; Allen,Ronald L.; Shinagawa,Robert; Sethuraman,Anantha; Bevis,Christopher F.; Trikas,Thanassis; Chen,Haiguang; Meng,Ching Ling, Methods and systems for determining a characteristic of polishing within a zone on a specimen from combined output signals of an eddy current device.
  28. Lehman, Kurt; Chen, Charles; Allen, Ronald L.; Shinagawa, Robert; Sethuraman, Anantha; Bevis, Christopher F.; Trikas, Thanassis; Chen, Haiguang; Meng, Ching Ling, Methods and systems for generating a two-dimensional map of a characteristic at relative or absolute locations of measurement spots on a specimen during polishing.
  29. Lehman, Kurt; Chen, Charles; Allen, Ronald L.; Shinagawa, Robert; Sethuraman, Anantha; Bevis, Christopher F.; Trikas, Thanassis; Chen, Haiguang; Meng, Ching Ling, Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool.
  30. Lehman, Kurt; Chen, Charles; Allen, Ronald L.; Shinagawa, Robert; Sethuraman, Anantha; Bevis, Christopher F.; Trikas, Thanassis; Chen, Haiguang; Meng, Ching Ling, Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool.
  31. Lehman,Kurt; Chen,Charles; Allen,Ronald L.; Shinagawa,Robert; Sethuraman,Anantha; Bevis,Christopher F.; Trikas,Thanassis; Chen,Haiguang; Meng,Ching Ling, Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool.
  32. Lehman,Kurt; Chen,Charles; Allen,Ronald L.; Shinagawa,Robert; Sethuraman,Anantha; Bevis,Christopher F.; Trikas,Thanassis; Chen,Haiguang; Meng,Ching Ling, Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool.
  33. Prasad, Abaneshwar, Microporous polishing pads.
  34. Prasad, Abaneshwar, Microporous polishing pads.
  35. Prasad, Abaneshwar, Microporous polishing pads.
  36. Prasad, Abaneshwar, Microporous polishing pads.
  37. Prasad, Abaneshwar; Sevilla, Roland K.; Lacy, Michael S., Multi-layer polishing pad material for CMP.
  38. Prasad,Abaneshwar; Lacy,Michael S., Multi-layer polishing pad material for CMP.
  39. Tolles, Robert D., Multilayer polishing pad and method of making.
  40. Meloni,Mark A.; Kueny,Andrew W., Optical closed-loop control system for a CMP apparatus and method of manufacture thereof.
  41. Takahashi, Shogo; Shimizu, Hajime, Perforated-transparent polishing pad.
  42. Bunyan,Michael H.; Clement,Thomas A.; Hannafin,John J.; LaRosee,Marc E.; Young,Kent M., Polishing article for electro-chemical mechanical polishing.
  43. Menk, Gregory E.; McReynolds, Peter; Rondum, Erik S.; Iyer, Anand N.; Prabhu, Gopalakrishna B.; Leung, Garlen C., Polishing article with integrated window stripe.
  44. Menk, Gregory E.; McReynolds, Peter; Rondum, Erik S.; Iyer, Anand N.; Prabhu, Gopalakrishna B.; Leung, Garlen C., Polishing article with integrated window stripe.
  45. Birang,Manoocher; Gleason,Allan; Guthrie,William L., Polishing assembly with a window.
  46. Hishiki, Seigo, Polishing pad.
  47. Vangsness, Jean; Hsu, Oscar Kai Chi; Potnis, Alaka, Polishing pad.
  48. Vangsness,Jean; Hsu,Oscar Kai Chi; Potnis,Alaka, Polishing pad.
  49. Vangsness,Jean; Hsu,Oscar Kai Chi; Potnis,Alaka, Polishing pad.
  50. Nakamori, Masahiko; Shimomura, Tetsuo; Yamada, Takatoshi; Ogawa, Kazuyuki; Kazuno, Atsushi; Watanabe, Masahiro, Polishing pad and method of producing semiconductor device.
  51. Newell, Kelly J., Polishing pad comprising a filled translucent region.
  52. Prasad,Abaneshwar, Polishing pad comprising hydrophobic region and endpoint detection port.
  53. Huh, Hyun; Lee, Sang Mok; Song, Kee Cheon; Kim, Seung geun; Son, Do Kwon, Polishing pad containing embedded liquid microelements and method of manufacturing the same.
  54. Huh, Hyun; Lee, Sang-Mok; Song, Kee-Cheon; Kim, Seung-geun; Son, Do-Kwon, Polishing pad containing embedded liquid microelements and method of manufacturing the same.
  55. Swedek, Boguslaw A.; Birang, Manoocher, Polishing pad for endpoint detection and related methods.
  56. Petroski, Angela; Copper, Richard D.; Fathauer, Paul; Perry, David, Polishing pad for use in chemical/mechanical planarization of semiconductor wafers having a transparent window for end-point determination and method of making.
  57. Shih,Wen Chang; Chang,Yung Chung; Chu,Min Kuei, Polishing pad having grooved window therein and method of forming the same.
  58. Doura, Masato; Hirose, Junji; Nakamura, Kenji; Fukuda, Takeshi; Sato, Akinori, Polishing pad manufacturing method.
  59. Budinger, William D.; Roberts, John V. H., Polishing pad with a transparent portion.
  60. Prasad, Abaneshwar, Polishing pad with light-stable light-transmitting region.
  61. Prasad, Abaneshwar, Polishing pad with microporous regions.
  62. Turner,Kyle A.; Beeler,Jeffrey L.; Newell,Kelly J., Polishing pad with recessed window.
  63. Wiswesser, Andreas Norbert; Swedek, Boguslaw A., Polishing pad with transparent window.
  64. Tolles, Robert D., Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus.
  65. Tolles, Robert D., Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus.
  66. Tolles,Robert D., Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus.
  67. Birang,Manoocher; Gleason,Allan; Guthrie,William L., Polishing pad with window and method of fabricating a window in a polishing pad.
  68. Swisher,Robert G.; Wang,Alan E.; Allison,William C., Polyurethane urea polishing pad.
  69. Qian, Bainian; DeGroot, Marty W.; Jensen, Michelle; Murnane, James; Hendron, Jeffrey J.; Nowland, John G.; James, David B.; Yeh, Fengji, Soft and conditionable chemical mechanical polishing pad with window.
  70. Allison, William; Scott, Diane; Kerprich, Robert; Huang, Ping; Frentzel, Richard, Soft polishing pad for polishing a semiconductor substrate.
  71. Yokley, Edward M.; Obeng, Yaw S., Substrate polishing device and method.
  72. Birang, Manoocher; Pyatigorsky, Grigory, Substrate polishing metrology using interference signals.
  73. Birang, Manoocher; Pyatigorsky, Grigory, Substrate polishing metrology using interference signals.
  74. Birang, Manoocher; Pyatigorsky, Grigory, Substrate polishing metrology using interference signals.
  75. Birang, Manoocher; Pyatigorsky, Grigory, Substrate polishing metrology using interference signals.
  76. Patterson, Joseph Martin, System and method for in-situ inspection during metallurgical cross-sectioning.
  77. Lehman, Kurt; Chen, Charles; Allen, Ronald L.; Shinagawa, Robert; Sethuraman, Anantha; Bevis, Christopher F.; Trikas, Thanassis; Chen, Haiguang; Meng, Ching Ling, Systems and methods for characterizing a polishing process.
  78. Benvegnu, Dominic J.; Zhang, Jimin; Osterheld, Thomas H.; Swedek, Boguslaw A., Thin polishing pad with window and molding process.
  79. Benvegnu, Dominic J.; Zhang, Jimin; Osterheld, Thomas H.; Swedek, Boguslaw A., Thin polishing pad with window and molding process.
  80. Prasad,Abaneshwar, Transparent microporous materials for CMP.
  81. Prasad,Abaneshwar, Transparent microporous materials for CMP.
  82. Newell,Kelly J., Ultrasonic welding method for the manufacture of a polishing pad comprising an optically transmissive region.
  83. Budinger, William D.; Kubo, Naoto, Window portion with an adjusted rate of wear.
  84. Lehman, Kurt; Chen, Charles; Allen, Ronald L.; Shinagawa, Robert; Sethuraman, Anantha; Bevis, Christopher F.; Trikas, Thanassis; Chen, Haiguang; Meng, Ching Ling, Windows configurable to be coupled to a process tool or to be disposed within an opening in a polishing pad.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로