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Direct metallization process

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C25D-005/02
  • C25D-005/54
  • B05D-005/12
  • B05D-001/18
출원번호 US-0975613 (1997-11-21)
발명자 / 주소
  • Thorn Charles Edwin
  • Polakovic Frank
  • Mosolf Charles A.
출원인 / 주소
  • Electrochemicals Inc.
대리인 / 주소
    McAndrews, Held & Malloy, Ltd.
인용정보 피인용 횟수 : 5  인용 특허 : 97

초록

A method of applying a conductive carbon coating to a non-conductive surface, conductive carbon compositions for that purpose, and a printed wiring board having through holes or other nonconductive surfaces treated with such carbon compositions are disclosed. A liquid dispersion of electrically cond

대표청구항

[ What is claimed is:] [1.] A method of applying an electrically conductive carbon coating to a non-conductive surface, comprising the steps of:A. providing a substrate having a least one non-conductive surface;B. providing a liquid dispersion of electrically conductive carbon having a mean particle

이 특허에 인용된 특허 (97)

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이 특허를 인용한 특허 (5)

  1. Shintate, Tsuyoshi, Method for manufacturing electronic substrate.
  2. Bowers, Jr., Joseph S.; Bernards, Roger F., Method to improve the stability of dispersions of carbon.
  3. Gundlach,Harald; Muller Hipper,Andreas; Simmerlein Erlbacher,Ewald, Process for producing a metal layer on a substrate body, and substrate body having a metal layer.
  4. Ishii, Jun; Ooyabu, Yasunari; Kurai, Hiroyuki, Producing method of wired circuit board.
  5. Hidemitsu Aoki JP, Substrate-cleaning method and substrate-cleaning solution.
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