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Method and system in a data processing system for efficiently cooling a portable computer system 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
  • F28D-015/02
출원번호 US-0282299 (1999-03-31)
발명자 / 주소
  • Holung Joseph Anthony
  • Kamath Vinod
  • Mansuria Mohanlal Savji
  • Wong Tin-Lup
출원인 / 주소
  • International Business Machines Corporation
대리인 / 주소
    Bogdon
인용정보 피인용 횟수 : 27  인용 특허 : 39

초록

A portable data processing system and method are disclosed for improving cooling of a microprocessor included within the system. The portable data processing system includes a base housing for housing a CPU and a display housing for housing a display. A heat sink is established within the base housi

대표청구항

[ What is claimed is:] [1.] A portable data processing system for improving cooling of a microprocessor included within said system, said portable data processing system including a base housing for housing a CPU and a display housing coupled to said base housing utilizing a hinge means, comprising:

이 특허에 인용된 특허 (39)

  1. Erler William F. ; O'Hagan Timothy P. ; Grzelak Keith D., Active cooling system for cradle of portable electronic devices.
  2. Bhatia Rakesh, Airflow heat exchanger for a portable computing device and docking station.
  3. Chao Shun-Lung (Westboro MA), Arrangement for mounting and cooling high density tab IC chips.
  4. Ma Hsi-Kuang,TWX, CPU heat dissipating device.
  5. Jackson Robert T. ; Nachtsheim Stephen P. ; Ma Taufik T., Circuit and method for controlling power and performance based on operating environment.
  6. Yokono Hitoshi (Toride JPX) Terabayashi Takao (Tokohama JPX) Kayaba Nobuo (Yokohama JPX) Daikoku Takahiro (Ushiku JPX) Kieda Shigekazu (Ishioka JPX) Kobayashi Fumiyuki (Sagamihara JPX) Zushi Shizuo (, Cooling arrangement for semiconductor devices and method of making the same.
  7. Hsieh Hsin M. (No. 6 ; E. Sec. ; Chiao Nan Li ; Industrial 6th Rd. Pingtung City ; Pingtung Hsien TWX), Cooling device for central processing unit.
  8. O'Connor Michael ; Haley Kevin ; Bhatia Rakesh ; Adams Daniel Thomas ; Kast Michael Andrew, Cooling system for thin profile electronic and computer devices.
  9. Ohashi Shigeo,JPX ; Hatada Toshio,JPX ; Tanaka Shinji,JPX, Cooling unit for electronic equipment.
  10. Xie Hong (Chandler AZ) Aghazadeh Mostafa (Chandler AZ) Turturro Gregory (Chandler AZ) Chiu Chia-Pin (Chandler AZ), Dissipation of heat through keyboard using a heat pipe.
  11. Nakajima Yuji (Tokyo JPX), Electronic apparatus having heat sink for cooling circuit component.
  12. Clemens Donald (The Colony TX), Fan attachment clip for heat sink.
  13. Baucom Allan S. (Townsend MA) Foster Mark J. (Acton MA) Bovio Michele (Boston MA), Heat dissipating arrangement in a portable computer.
  14. Mecredy ; III Henry E., Heat dissipating lid hinge structure with laterally offset heat pipe end portions.
  15. Moore David A., Heat dissipating pad structure for an electronic component.
  16. Penniman Mark B. (Austin TX) Schlesener Carmen M. (Pflugerville TX) Kizer Jim J. (Austin TX), Heat pipe device and method for attaching same to a computer keyboard.
  17. Bhatia Rakesh (Sunnyvale CA) Haley Kevin (San Jose CA), Heat pipe exchanger system for cooling a hinged computing device.
  18. Garner Scott D. ; Meyer ; IV George A. ; Toth Jerome E. ; Longsderff Richard W., Heat pipes inserted into first and second parallel holes in a block for transferring heat between hinged devices.
  19. Swindler Dan (Austin TX), Heat sink/component access door for portable computers.
  20. Arnold Judson V. (Bedford TX) Peoples James R. (Burleson TX) McKague Elbert L. (Fort Worth TX), High heat density transfer device.
  21. Aguilera Rafael E. (Simpsonville SC), Honeycomb celled-sheet layer composite panel for monitoring an LCD to a laptop computer.
  22. Atkinson Lee W., Increased processor performance comparable to a desktop computer from a docked portable computer.
  23. Meyer ; IV George A. ; Toth Jerome E. ; Tran Mai-Loan ; Taylor Attalee S., Integrated circuit heat seat.
  24. Meyer ; IV George A. ; Toth Jerome E., Integrated circuit with taped heat pipe.
  25. Kikinis Dan (20264 Ljepava Dr. Satatoga CA 95070), Microprocessor cooling in a portable computer.
  26. Kikinis Dan (Saratoga CA), Modular portable computer.
  27. Nelson Daryl (Beaverton OR), Multiple-fan microprocessor cooling through a finned heat pipe.
  28. Aguilera Rafael E. (Simpsonville SC), Passive CPU cooling and LCD heating for a laptop computer.
  29. Paulsel Jason Q. (Conroe TX) Smith Kelly K. (Spring TX) Ruch Mark H. (The Woodlands TX), Portable computer docking station with removable support shelf apparatus.
  30. Spalding Tom J. (Gloucester MA) Kowal Keith E. (Marblehead MA) Bleck James H. (Chelmsford MA) Wakefield Scott H. (Andover MA) Thrailkill John E. (Lowell MA), Portable computer with docking connector for peripheral devices.
  31. Ohgami Keizo,JPX ; Shibasaki Kazuya,JPX ; Itoh Hironori,JPX, Portable electronic apparatus having the heat radiation device for circuit module.
  32. Bhatia Rakesh, Power cable heat exchanger for a computing device.
  33. Arnold Judson V. ; Peoples James R. ; McKague Elbert L., Process for manufacturing a high heat density transfer device.
  34. Toedtman Thomas (Lake Forest CA) Welch Randall S. (Lake Forest CA), Rotable and slideble heat pipe apparatus for reducing heat build up in electronic devices.
  35. Mok Lawrence Shungwei, Rotational joint for hinged heat pipe cooling of a computer.
  36. Smith Darryl K. ; Faust Alfred, Shielded electrical component heat sink apparatus.
  37. Progl Curtis L. ; Tracy Mark S. ; Moore David A., System and method for transferring heat between movable portions of a computer.
  38. Korinsky George K. (Woodlands TX), Thermal packaging for natural convection cooled electronics.
  39. Larson Ralph I. (Bolton MA) Phillips Richard J. (Alachua FL) Beane Alan F. (Gilford NH), Two-phase cooling system for a laptop computer lid.

이 특허를 인용한 특허 (27)

  1. Oross, Glen A; Bliven, Robert P; Derocher, Michael D; Muranami, Masahiko, Alignment mechanism for a computer system having a portable computer and a docking station.
  2. Oross, Glen A; Bliven, Robert P; Derocher, Michael D; Muranami, Masahiko, Alignment mechanism for a computer system having a portable computer and a docking station.
  3. Hironori Tanaka JP, Apparatus and system for cooling a portable device.
  4. Zimmermann, Augusto Jose Pereira; Possamai, Fabricio Caldeira; Santini, Jr., Otavio, Computer docking station.
  5. Karr, Ben, Device bay heat exchanger for a portable computing device.
  6. Bibl, David; Rohrbach, Matthew; Russell-Clarke, Peter, Electronic device accessories formed from intertwined fibers.
  7. Chang, Yao-Ting; Chan, Hung-Chou, Electronic device with heat dissipation apparatus.
  8. Bibl, David; Rohrbach, Matthew; Russell-Clarke, Peter, Fiber-based electronic device structures.
  9. Xu, Shuang, Flat panel electronic device, auxiliary heat-dissipating means thereof and assembly of both.
  10. Nagasawa, Hideo, Heat pipe docking system.
  11. Pokharna, Himanshu; Distefano, Eric, Increased thermal capability of portable electronic device in stationary or docked mode.
  12. Pokharna,Himanshu; Distefano,Eric, Increased thermal capability of portable electronic device in stationary or docked mode.
  13. Himanshu Pokharna ; Eric DiStefano, Method and apparatus for external cooling an electronic component of a mobile hardware product, particularly a notebook computer, at a docking station having a thermoelectric cooler.
  14. Igarashi, Takeshi, Method of cooling system for a personal computer and personal computer.
  15. Winkler, David A.; Bowers, Morris B.; Sehmbey, Maninder S., Mobile computing device dock station with headset jack heat pipe interface.
  16. Son, Hyun Wung, Mobile terminal holder.
  17. Kelty, Matthew James, Optical module blind mating heat relay system.
  18. Park,Jea woo, Portable computer with docking station.
  19. Becker, Craig Henry; Hsu, Jimmy Ming-Der; Vicknair, Wayne Elmo, Portable device for cooling a laptop computer.
  20. Huang,Yi Chang; Lin,Yao Chung, Portable electronic device and heat-dissipation method and battery charger thereof.
  21. Couto, Paulo Rogerio Carrara; Ribeiro, Guilherme Borges, Refrigeration system for compact equipment.
  22. Merlet,Herve, System and apparatus for heat dissipation in an electronic device.
  23. Hara,Chikashi; Hayakawa,Kazuyo; Kumai,Satoru; Nomura,Taichiroh; Sakurai,Toshio; Takenoshita,Hiroyuki, System for cooling interior and external housing surfaces of an electronic apparatus.
  24. Senatori, Mark David, Thermal distribution systems and methods.
  25. Makley, Albert V.; Cipolla, Thomas M.; Hildner, Thomas R.; Kamath, Vinod; Kiyooka, Fumitoshi; Mok, Lawrence S.; Nakamura, Fusanobu, Thermal docking fansink.
  26. Urban, Bradley David; Hulick, Troy; Doblack, Shelomon Patrick; Olson, Robert; Chua, Albert John Yu Sam; Jones, Daniel; Cybart, Adam Kenneth; Soni, Gaurav; Carter-Giannini, William James; Seflic, Matthew Michael, Unibody thermal enclosure.
  27. Ford, Daniel A.; Kaufman, James H.; Melroy, Owen R.; Miner, Cameron S.; Roche, Kevin P., Visual heat sink for computers and method of use.
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