초록 ▼

An arrangement for cooling an electronic assembly includes a circuit board having a primary circuit board portion and a secondary circuit board portion integrally secured to the primary circuit board portion. The arrangement also includes an enclosure member secured to the circuit board so as to cre

An arrangement for cooling an electronic assembly includes a circuit board having a primary circuit board portion and a secondary circuit board portion integrally secured to the primary circuit board portion. The arrangement also includes an enclosure member secured to the circuit board so as to create a fluid tight barrier of a compartment defined at least in part by the enclosure member. The arrangement further includes a first electronic component secured to the primary circuit board portion such that the first electronic component is located within the compartment. The arrangement also includes a second electronic component secured to the secondary circuit board portion such that the second electronic component is located outside of the compartment. The arrangement also includes a liquid disposed within the compartment such that the liquid is in a heat exchange relationship with the first electronic component. The arrangement also includes a gas in contact with the second electronic component such that the gas is in a heat exchange relationship with the second electronic component.

대표청구항 ▼

[ We claim:] [1.] An arrangement for cooling an electronic assembly, the arrangement comprising:a rigid circuit board having a primary circuit board portion and a secondary circuit board portion integrally secured to said primary circuit board portion;an enclosure member secured to said circuit boar

[ We claim:] [1.] An arrangement for cooling an electronic assembly, the arrangement comprising:a rigid circuit board having a primary circuit board portion and a secondary circuit board portion integrally secured to said primary circuit board portion;an enclosure member secured to said circuit board so as to form a fluid tight barrier of a compartment defined at least in part by said enclosure member, said secondary circuit board portion being disposed outside of said compartment;a first electronic component secured to said primary circuit board portion such that said first electronic component is located within said compartment;a second electronic component secured to said secondary circuit board portion such that said second electronic component is located outside of said compartment;a liquid disposed within said compartment such that said liquid is in a heat exchange relationship with said first electronic component; anda gas in contact with said second electronic component such that said gas is in a heat exchange relationship with said second electronic component.