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Lead-free solders 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C22C-007/00
출원번호 US-0417169 (1999-10-12)
발명자 / 주소
  • Hwang Jennie S.
  • Guo Zhenfeng
출원인 / 주소
  • H-Technologies Group, Incorporated
대리인 / 주소
    Fay, Sharpe, Fagan, Minnich & McKee, LLP
인용정보 피인용 횟수 : 37  인용 특허 : 9

초록

Disclosed is a high strength, high fatigue resistance, and high wetting lead-free solder alloy comprising effective amounts of tin, copper, silver, bismuth, indium, and antimony and having a melting temperature between 175-215.degree. C.

대표청구항

[ We claim:] [9.] A lead-free solder alloy consisting essentially of 76% to 96% Sn, 0.2% to 2.5% Cu, 2.5% to 4.5% Ag, 6% to 12% In, 0.5% to 5.0% Bi and >0% to 2% Sb.

이 특허에 인용된 특허 (9)

  1. Chen Ho S. (Lebanon NJ) Jin Sungho (Millington NJ) McCormack Mark T. (Summit NJ), Article comprising a PB-free solder having improved mechanical properties.
    상세보기
  2. Lucey ; Jr. George K. (Burtonsville MD) Wasynczuk James A. (Bellflower CA) Clough Roger B. (Rockville MD) Hwang Jennie S. (Moreland Hills OH), Composite solders.
    상세보기
  3. Naton Paul E. (North Ridgeville OH), Lead- and antimony-free solder composition.
    상세보기
  4. Slattery James A. (Sauquoit NY) White Charles E. T. (Clinton NY), Lead-free alloy containing tin, silver and indium.
    상세보기
  5. Seelig Karl F. (32 Deck St. Jamestown RI 02835) Lockard Donald G. (85 Meadow St. North Providence RI 02904), Lead-free and bismuth-free tin alloy solder composition.
    상세보기
  6. Seelig Karl F. (32 Deck St. Jamestown RI 02835) Lockard Donald G. (85 Meadow North Providence RI 02904), Lead-free bismuth free tin alloy solder composition.
    상세보기
  7. Gonya Stephen G. (Endicott NY) Lake James K. (Endicott NY) Long Randy C. (Friendsville PA) Wild Roger N. (Owego NY), Lead-free, high temperature, tin based multi-component solder.
    상세보기
  8. Anderson Iver E. (Ames IA) Yost Frederick G. (Cedar Crest NM) Smith John F. (Ames IA) Miller Chad M. (Ames IA) Terpstra Robert L. (Ames IA), Pb-free Sn-Ag-Cu ternary eutectic solder.
    상세보기
  9. Ballentine Richard E. (Montevallo AL) Henson Robert M. (Cincinnati OH), Solder composition.
    상세보기

이 특허를 인용한 특허 (37)

  1. Miller, Steven A.; Gaydos, Mark; Shekhter, Leonid N.; Gulsoy, Gokce, Dynamic dehydriding of refractory metal powders.
    상세보기
  2. Miller, Steven A.; Gaydos, Mark; Shekhter, Leonid N.; Gulsoy, Gokce, Dynamic dehydriding of refractory metal powders.
    상세보기
  3. Miller, Steven A.; Kumar, Prabhat; Wu, Richard; Sun, Shuwei; Zimmermann, Stefan; Schmidt-Park, Olaf, Fine grained, non banded, refractory metal sputtering targets with a uniformly random crystallographic orientation, method for making such film, and thin film based devices and products made therefrom.
    상세보기
  4. Dary, Francois-Charles; Gaydos, Mark; Loewenthal, William; Miller, Steven A.; Rozak, Gary; Volchko, Scott Jeffrey; Zimmermann, Stefan; Stawovy, Michael Thomas, Large-area sputtering targets.
    상세보기
  5. Li, Jianxing; Albaugh, Kevin B., Lead frame construct for lead-free solder connections.
    상세보기
  6. Ohnishi, Tsukasa; Yoshikawa, Shunsaku; Tachibana, Ken; Yamanaka, Yoshie; Nomura, Hikaru; Lee, Kyu-oh, Lead-free solder alloy.
    상세보기
  7. Rothschild, Stanley R., Lead-free solder alloy.
    상세보기
  8. Kitajima, Masayuki; Takesue, Masakazu; Moriya, Yasuo; Nemoto, Yoshinori; Fukushima, Yumiko, Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy.
    상세보기
  9. Takesue,Masakazu; Moriya,Yasuo; Nemoto,Yoshinori; Fukushima,Yumiko, Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy.
    상세보기
  10. Li, Jianxing; Pinter, Michael R.; Johnson, Vikki L., Lead-free solder compositions.
    상세보기
  11. Key,Chung C.; Faizul,Mustapha Mohd.; Sang,Tan Siew, Method for solder crack deflection.
    상세보기
  12. Hwang, Jennie S.; Pereira, John; Mackin, Alexandra Mary; Gonsalves, Joseph C., Method of forming a lead-free solder composition.
    상세보기
  13. Miller, Steven A.; Shekhter, Leonid N.; Zimmerman, Stefan, Methods of joining metallic protective layers.
    상세보기
  14. Miller, Steven A.; Shekhter, Leonid N.; Zimmermann, Stefan, Methods of joining metallic protective layers.
    상세보기
  15. Miller, Steven A.; Shekhter, Leonid N.; Zimmermann, Stefan, Methods of joining metallic protective layers.
    상세보기
  16. Volchko, Scott Jeffrey; Zimmermann, Stefan; Miller, Steven A.; Stawovy, Michael Thomas, Methods of manufacturing high-strength large-area sputtering targets.
    상세보기
  17. Loewenthal, William; Miller, Steven Alfred, Methods of manufacturing large-area sputtering targets.
    상세보기
  18. Miller, Steven A.; Dary, Francois-Charles; Gaydos, Mark; Rozak, Gary, Methods of manufacturing large-area sputtering targets by cold spray.
    상세보기
  19. Volchko, Scott Jeffrey; Loewenthal, William; Zimmermann, Stefan; Gaydos, Mark; Miller, Steven Alfred, Methods of manufacturing large-area sputtering targets using interlocking joints.
    상세보기
  20. Volchko, Scott Jeffrey; Loewenthal, William; Zimmermann, Stefan; Gaydos, Mark; Miller, Steven Alfred, Methods of manufacturing large-area sputtering targets using interlocking joints.
    상세보기
  21. Miller, Steven A.; Kumar, Prabhat; Wu, Rong-chein Richard; Sun, Shuwei; Zimmermann, Stefan; Schmidt-Park, Olaf, Methods of rejuvenating sputtering targets.
    상세보기
  22. Shimokawa, Hanae; Soga, Tasao; Okudaira, Hiroaki; Ishida, Toshiharu; Nakatsuka, Tetsuya; Inaba, Yoshiharu; Nishimura, Asao, Pb-free solder-connected structure.
    상세보기
  23. Shimokawa, Hanae; Soga, Tasao; Okudaira, Hiroaki; Ishida, Toshiharu; Nakatsuka, Tetsuya; Inaba, Yoshiharu; Nishimura, Asao, Pb-free solder-connected structure and electronic device.
    상세보기
  24. Shimokawa, Hanae; Soga, Tasao; Okudaira, Hiroaki; Ishida, Toshiharu; Nakatsuka, Tetsuya; Inaba, Yoshiharu; Nishimura, Asao, Pb-free solder-connected structure and electronic device.
    상세보기
  25. Itou, Kazuhiro, Printed-wiring board.
    상세보기
  26. Shekhter, Leonid N.; Miller, Steven A.; Haywiser, Leah F.; Wu, Rong-Chein R., Process for preparing metal powders having low oxygen content, powders so-produced and uses thereof.
    상세보기
  27. Abbott, Donald C., Semiconductor leadframes plated with lead-free solder and minimum palladium.
    상세보기
  28. Ikeda, Kazuki; Inoue, Kosuke; Ichikawa, Kazuya; Takemoto, Tadashi, Solder alloy, solder composition, solder paste, and electronic circuit board.
    상세보기
  29. Ikeda, Kazuki; Inoue, Kosuke; Ichikawa, Kazuya; Takemoto, Tadashi, Solder alloy, solder paste, and electronic circuit board.
    상세보기
  30. Yeh, Shing; Brandenburg, Scott D.; Carter, Bradley H., Solder process and solder alloy therefor.
    상세보기
  31. Yeh, Shing; Brandenburg, Scott D.; Carter, Bradley H., Solder process and solder alloy therefor.
    상세보기
  32. Sakatani, Shigeaki; Furusawa, Akio; Suetsugu, Kenichiro; Nakamura, Taichi, Soldering material and electronic component assembly.
    상세보기
  33. Huang, Benlih; Hwang, Hong-Sik; Lee, Ning-Cheng, Technique for increasing the compliance of tin-indium solders.
    상세보기
  34. Sreeram, Attiganal N.; Lewis, Brian; Hozer, Leszek; Liberatore, Michael James; Minogue, Gerard, Thermal interface material and heat sink configuration.
    상세보기
  35. Lewis, Brian G.; Singh, Bawa; Laughlin, John P.; Kyaw, David V.; Ingham, Anthony E.; Sreeram, Attiganal N.; Hozer, Leszek; Liberatore, Michael J.; Minogue, Gerard R., Thermal interface material and solder preforms.
    상세보기
  36. Lewis,Brian G.; Singh,Bawa; Laughlin,John P.; Kyaw,David V.; Ingham,Anthony E.; Sreeram,Attiganal N.; Hozer,Leszek; Liberatore,Michael J.; Minogue,Gerard R., Thermal interface material and solder preforms.
    상세보기
  37. Luo, Jianguo; Lee, Ning-Cheng, Tin-indium based low temperature solder alloy.
    상세보기

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