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Laminated electroplating rack and connection system for optimized plating 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C25D-017/04
출원번호 US-0178084 (1998-10-23)
발명자 / 주소
  • Downes
  • Jr. Francis J.
  • Galasco Raymond Thomas
  • Japp Robert Maynard
  • Surowka John Frank
출원인 / 주소
  • International Business Machines Corporation
대리인 / 주소
    Pivnichny
인용정보 피인용 횟수 : 17  인용 특허 : 22

초록

An electroplating apparatus provides high current electrical connections in a small area to a workpiece. The contact area may use a dendrite surface to improve the connection. An insulative gasket prevents electroplating fluids from entering the region about the contact area. A heavy core laminated

대표청구항

[ What is claimed is:] [1.] An electroplating rack for holding a workpiece during plating, comprising:a supporting structure having an electrically insulative surface positioned about an electrically conductive core with at least two openings in said insulative surface exposing at least two areas of

이 특허에 인용된 특허 (22)

  1. Smith Mark L. (Harrisburg PA) Wagner Richard M. (Harrisburg PA), Anode assembly for selectively plating electrical terminals.
  2. Herzog Horst (Pfinztal DEX) Neese Hans J. (Eisingen DEX) Schaudt Gerd (Pforzheim DEX) Mder Wolfgang (Freudenstein DEX), Apparatus for a continuous selective electrodeposition on a strip.
  3. Murakami Shinjiro (Okayama JPX), Apparatus for continuous electrolytic treatment of metal strip and sealing structure for electrolytic cell therefor.
  4. Bongartz Roy C. (Indiana Township ; Allegheny County PA) Johnston Richard H. (Harrison Township ; Allegheny County PA) Odasso James J. (Allegheny Township ; Westmoreland County PA) Zaremski Donald R., Cathode for use in electrolytic processing solution.
  5. DuRocher ; Gideon A., Combination insulating sleeve and electrical contact member for electro-plating rack.
  6. Burns Francis C. (Apalachin NY) Kaufman John J. (Windsor NY) King David E. (Endicott NY) Knight Alan D. (Newark Valley NY), Cone electrical contact.
  7. Metzka Hans J. (Nrnberg DEX), Contacting arrangement for a circuit board support assembly.
  8. Murphy ; Jr. Robert J. (Bellaire TX) Jamison Dale E. (Humble TX), Electrode holder useful in a corrosion testing device.
  9. Eng Jeffrey D. (North Vancouver CA) Harke Cyril J. (Burnaby CA) Bosa Primo (Vancouver NY CA) Figueras Wilfredo E. (Amherst NY), Electrolytic cell seal.
  10. Fair David L. (Cheshire CT) Dean Robert A. (Guilford CT) Sangster Arlon G. (Sterling MA), Electrolytic halogenator device.
  11. Niksa Andrew J. (Concord OH) Pohto Gerald R. (Mentor OH), Electroplating cell anode.
  12. Collins Stephen M. (Trenton MI) Schweickart Albert J. (Southgate MI), End connector for filter press cell.
  13. Datta Madhav (Peekskill) King David E. (Endicott) Knight Alan D. (Newark Valley) Sambucetti Carlos J. (Croton-on-Hudson NY), High performance metal cone contact.
  14. Bindra Perminder S. (South Salem NY) Havens Ross D. (Endicott NY) Markovich Voya R. (Endwell NY) Molla Jaynal A. (Endicott NY), Interconnection method and structure for organic circuit boards.
  15. Bindra Perminder S. (South Salem NY) Havens Ross Downey (Endicott NY) Markovich Voya R. (Endwell NY) Molla Jaynal A. (Endicott NY), Interconnection method and structure for organic circuit boards.
  16. Gibson David Vincent (North Bayswater AU), Liquid thermosetting coating compositions.
  17. Chan Benson ; Chan Hong H. ; Singh Pratap, Method and system for testing an electronic module mounted on a printed circuit board.
  18. Bindra Perminder S. (South Salem NY) Cuomo Jerome J. (Lincolndale NY) Gall Thomas P. (Endwell NY) Ingraham Anthony P. (Endicott NY) Kang Sung K. (Chappaqua NY) Kim Jungihl (Chappaqua NY) Lauro Paul (, Method of fabricating nendritic materials.
  19. Burns Francis C. (Apalachin NY) Kaufman John J. (Windsor NY) King David E. (Endicott NY) Knight Alan D. (Newark Valley NY), Method of making cone electrical contact.
  20. Coombes ; Jr. Robert L. (La Canada Flintridge CA) Owen Merrill J. (La Canada CA) Colwell Terance C. (West Covina CA) Walker Donald E. (Upland CA), Molded framework for electroless and electrolytic plating racks.
  21. Ishii Masahito (Hino JPX) Kataoka Tatsuo (Kawaguchi JPX) Tanaka Yoshitaka (Urawa JPX), Mounting substrate and its production method, and printed wiring board having connector function and its connection meth.
  22. Smith Mark L. (Harrisburg PA), Selective plating apparatus for zone plating.

이 특허를 인용한 특허 (17)

  1. Mayer, Steven T.; Ponnuswamy, Thomas A.; Chua, Lee Peng; Rash, Robert, Automated cleaning of wafer plating assembly.
  2. Mayer, Steven T.; Ponnuswamy, Thomas A.; Chua, Lee Peng; Rash, Robert, Automated cleaning of wafer plating assembly.
  3. Patton,Evan E.; Reid,Jonathan D.; Hawkins,Jeffrey A.; Kalakkad,Dinesh S., Clamshell apparatus with crystal shielding and in-situ rinse-dry.
  4. Patton, Evan E.; Reid, Jonathan D.; Hawkins, Jeffrey A.; Kalakkad, Dinesh S.; Mayer, Steven T., Clamshell apparatus with dynamic uniformity control.
  5. Chua, Lee Peng; Mayer, Steven T.; Ponnuswamy, Thomas A.; Kumar, Santosh, Cleaning electroplating substrate holders using reverse current deplating.
  6. Rash, Robert; Ghongadi, Shantinath; Ganesan, Kousik; He, Zhian; Majid, Tariq; Hawkins, Jeff; Varadarajan, Seshasayee; Buckalew, Bryan, Closed contact electroplating cup assembly.
  7. Mayer, Steven T.; Fu, Haiying; Ponnuswamy, Thomas Anand; Buckalew, Bryan L., Detection of plating on wafer holding apparatus.
  8. Rash, Robert; Ghongadi, Shantinath; Ganesan, Kousik; He, Zhian; Majid, Tariq; Hawkins, Jeff; Varadarajan, Seshasayee; Buckalew, Bryan, Electroplating cup assembly.
  9. Berke, Aaron; Rash, Robert; Mayer, Steven T.; Kumar, Santosh; Chua, Lee Peng, Integrated elastomeric lipseal and cup bottom for reducing wafer sticking.
  10. Feng, Jingbin; Stowell, Marshall; Wilmot, Frederick D., Lipseals and contact elements for semiconductor electroplating apparatuses.
  11. Feng, Jingbin; Stowell, Robert Marshall; Ghongadi, Shantinath; Ramesh, Ashwin, Lipseals and contact elements for semiconductor electroplating apparatuses.
  12. Kumar, Santosh; Buckalew, Bryan L.; Mayer, Steven T.; Ponnuswamy, Thomas; Hosack, Chad Michael; Rash, Robert; Chua, Lee Peng; Porter, David, Methods and apparatuses for cleaning electroplating substrate holders.
  13. Ostrowski, John Floyd; Rash, Robert, Multi-contact lipseals and associated electroplating methods.
  14. He, Zhian; Feng, Jingbin; Ghongadi, Shantinath; Wilmot, Frederick D., Plating cup with contoured cup bottom.
  15. He, Zhian; Feng, Jingbin; Ghongadi, Shantinath; Wilmot, Frederick D., Plating cup with contoured cup bottom.
  16. Ghongadi, Shantinath; Rash, Robert; Hawkins, Jeff; Varadarajan, Seshasayee; Majid, Tariq; Ganesan, Kousik; Buckalew, Bryan; Evans, Brian, Rapidly cleanable electroplating cup seal.
  17. Prabhakar, Vinay; Buckalew, Bryan L.; Ganesan, Kousik; Ghongadi, Shantinath; He, Zhian; Mayer, Steven T.; Rash, Robert; Reid, Jonathan D.; Takada, Yuichi; Zibrida, James R., Wafer electroplating apparatus for reducing edge defects.
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