초록 ▼

Improved adhesives useful for the manufacture of composite structures by lamination, extrusion and coextrusion processes are provided. The compositions of the invention utilize ethylene copolymers having a network structure and exhibiting unique melt elasticity characteristics in combination with mo

Improved adhesives useful for the manufacture of composite structures by lamination, extrusion and coextrusion processes are provided. The compositions of the invention utilize ethylene copolymers having a network structure and exhibiting unique melt elasticity characteristics in combination with modified polyolefins containing acid or acid derivative functionality and, optionally, elastomeric polymers. Composite structures wherein the adhesives are adhered to one or more substrates and, particularly composite structures comprising metal or barrier resin layers with one or a plurality of crosslinked or uncrosslinked polyethylene resin layers, are also described.

대표청구항 ▼

[ I claim:] [1.] An adhesive comprising:(a) 35 to 95 weight percent, based on the total weight of the adhesive, an ethylene copolymer resin of density 0.930 g/cc or below having hard and soft phases that form a network structure; and(b) 5 to 65 weight percent, based on the total weight of the adhesi

[ I claim:] [1.] An adhesive comprising:(a) 35 to 95 weight percent, based on the total weight of the adhesive, an ethylene copolymer resin of density 0.930 g/cc or below having hard and soft phases that form a network structure; and(b) 5 to 65 weight percent, based on the total weight of the adhesive, of a modified polyolefin containing acid or acid derivative functionality.