초록 ▼

An electronic apparatus having a heat pipe that is thermally bonded to plates to internal and external enclosures. The electronic apparatus is located in a heat dissipative external enclosure. The electronic apparatus having at least one unit contained in a thermally conductive internal housing prov

An electronic apparatus having a heat pipe that is thermally bonded to plates to internal and external enclosures. The electronic apparatus is located in a heat dissipative external enclosure. The electronic apparatus having at least one unit contained in a thermally conductive internal housing providing RF isolation and mounted on a wall of the external enclosure in thermal contact therewith. The electronic apparatus also having a heat pipe having a first plate bonded to its evaporator and a second plate bonded to its condenser, both bonds being thermally conductive. The first plate being mounted by fixings in thermal contact with the internal housing, the second plate being mounted by fixings in thermal contact with the wall of the external enclosure at a position lower, in use, than the first plate. This allows the heat pipe to be easily removed. This also allows the inner housing to maintain RF isolation.

대표청구항 ▼

[ I claim:] [1.] Electronic apparatus contained in a heat dissipative external enclosure, the electronic apparatus comprising:at least one unit located in the external enclosure;a thermally conductive internal housing providing RF isolation and mounted on a wall of the external enclosure in thermal

[ I claim:] [1.] Electronic apparatus contained in a heat dissipative external enclosure, the electronic apparatus comprising:at least one unit located in the external enclosure;a thermally conductive internal housing providing RF isolation and mounted on a wall of the external enclosure in thermal contact therewith, the unit being located in the housing;a heat pipe having a first plate bonded to its evaporator and a second plate bonded to its condenser, both bonds being thermally conductive, the first plate being mounted by fixings in thermal contact with the internal housing, the first plate being mounted in a recess of the interior housing and being disposed between the external enclosure and the interior housing, the second plate being mounted by fixings in thermal contact with the wall of the external enclosure at a position lower, in use, than the first plate.