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Attachment of a micromechanical microphone 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H04R-025/00
출원번호 US-0335419 (1999-06-17)
우선권정보 FI0001413 (1998-06-18)
발명자 / 주소
  • Hietanen Jarmo,FIX
  • Rusanen Outi,FIX
출원인 / 주소
  • Nokia Mobile Phones Limited, FIX
대리인 / 주소
    Perrman & Green, LLP
인용정보 피인용 횟수 : 84  인용 특허 : 11

초록

The invention relates to a method for attaching a micromechanical microphone (1) to be used in connection with a mobile station to a substrate (2), in which a diaphragm (4) and back electrode (6) for the microphone (1) are placed within a distance of each other, wherein an air gap (7) is formed betw

대표청구항

[ What is claimed is:] [1.] A method for attaching a micromechanical microphone (1) used in connection with a mobile station to a substrate (2), in which a diaphragm (4) and a back electrode (6) for the microphone (1) are placed within a distance from each other, wherein an air gap (7) is formed bet

이 특허에 인용된 특허 (11)

  1. Bernstein Jonathan J. (Medfield MA), Acoustic transducer with improved low frequency response.
  2. Kuehnel Wolfgang (Darmstadt DEX), Capacitive sound transducer.
  3. Staat Raimund,DEX ; Hinke Claus-Peter,DEX, Capacitor microphone.
  4. Lewiner Jacques (5 ; rue Bory d\Arnex 92210 Saint-Cloud FRX) Hennion Claude (18 ; rue Flatters 75005 Paris FRX), Electroacoustic piezoelectric transducers.
  5. van Halteren Aart Z. (Hobrede NLX), Electroacoustic transducer of the electret type.
  6. Hill James A. (Moscow ID) Goodwin Anthony R. H. (Moscow ID), Electrostatic transducer and method for manufacturing same.
  7. Moret Jean-Marc (Cortaillod CHX) Bergqvist Johan Wilhelm (Bole CHX), Integrated capacitive transducer.
  8. Malmi Kalevi (Salo FIX) Lajunen Ari-Pekka (Salo FIX), Method and circuit arrangement for adjusting the volume in a mobile telephone.
  9. O'Boyle John, Micro-electronic assembly including a flip-chip mounted micro-device and method.
  10. Jarvinen Kari Juhani,FIX, Parametric speech coding.
  11. Barnett Ricky William,GB2, Radio telephone connector.

이 특허를 인용한 특허 (84)

  1. Minervini, Anthony D., Acoustic transducer module.
  2. Minervini,Anthony D., Acoustic transducer module.
  3. Collins, James Steven, Acoustical transducer with reduced parasitic capacitance.
  4. Rombach, Pirmin Herman Otto; Rehder, Jorg, Board mounting of microphone transducer.
  5. Minervini, Anthony D., Bottom port multi-part surface mount MEMS microphone.
  6. Minervini, Anthony D., Bottom port multi-part surface mount silicon condenser microphone package.
  7. Minervini, Anthony D., Bottom port surface mount MEMS microphone.
  8. Minervini, Anthony D., Bottom port surface mount MEMS microphone.
  9. Minervini, Anthony D., Bottom port surface mount silicon condenser microphone package.
  10. Minervini, Anthony D., Bottom port surface mount silicon condenser microphone package.
  11. Hsu, Wei-Chan; Wu, Li-Te, Chip-scaled MEMS microphone package.
  12. Krüger, Hans; Stelzl, Alois, Component arrangement provided with a carrier substrate.
  13. Collins,James Steven, Electret condenser microphone.
  14. Leidl, Anton; Pahl, Wolfgang; Wolff, Ulrich, Electrical module comprising a MEMS microphone.
  15. Yen, Kai-Hsiang; Chen, Jen-Yi; Sung, Po-Hsun, Electro-acoustic sensing device.
  16. Szczech, John B.; Van Kessel, Peter, Embedded dielectric as a barrier in an acoustic device and method of manufacture.
  17. Bauer, Christian; Krueger, Hans; Stelzl, Alois, Encapsulated electrical component and production method.
  18. Krueger,Hans; Portmann,J��rgen; Nicolaus,Karl; Feiertag,Gregor; Stelzl,Alois, Encapsulated electronic component and production method.
  19. Sjursen,Walter P.; Leedom,Marvin A.; Mahoney,Derek D.; Margicin,John M.; Fritz,Frederick J.; Aceti,John G.; Preves,David A.; Palanisamy,Ponnusamy, Hearing aid with large diaphragm microphone element including a printed circuit board.
  20. Pilgrim, Thomas; Puder, Henning, Hearing apparatus with a facility for reducing a microphone noise and method for reducing microphone noise.
  21. Niederdr채nk,Torsten; Weistenh철fer,Christian, Hearing device.
  22. Dehe, Alfons, Housed loudspeaker array.
  23. Watson, Joshua; Grosse, Daniel Todd; Jacobs, Michael Robert; Schimpf, William F.; Del Valle Figueroa, Ivelisse, Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package.
  24. Yeh, Chien-Nan; Wang, Chin-Hung; Lee, Hsin-Li; Chen, Jien-Ming; Ho, Tzong-Che; Pan, Li-Chi, MEMS acoustic transducer and method for fabricating the same.
  25. Leidl, Anton; Pahl, Wolfgang; Wolff, Ulrich, MEMS microphone.
  26. Hsiao, Wei-Min, MEMS microphone module and method thereof.
  27. Pahl, Wolfgang, MEMS microphone, production method and method for installing.
  28. Leidl, Anton; Krueger, Hans; Stelzl, Alois; Pahl, Wolfgang; Seitz, Stefan, MEMS package and method for the production thereof.
  29. Pahl, Wolfgang; Leidl, Anton; Seitz, Stefan; Krueger, Hans; Stelzl, Alois, MEMS package and method for the production thereof.
  30. Pahl, Wolfgang, Method for applying a structured coating to a component.
  31. Collins, James Steven, Method for manufacturing acoustical transducer with reduced parasitic capacitance.
  32. Minervini, Anthony D., Methods of manufacture of bottom port multi-part surface mount MEMS microphones.
  33. Minervini, Anthony D., Methods of manufacture of bottom port multi-part surface mount silicon condenser microphone packages.
  34. Minervini, Anthony D., Methods of manufacture of bottom port surface mount MEMS microphones.
  35. Minervini, Anthony D., Methods of manufacture of bottom port surface mount MEMS microphones.
  36. Minervini, Anthony D., Methods of manufacture of bottom port surface mount silicon condenser microphone packages.
  37. Minervini, Anthony D., Methods of manufacture of bottom port surface mount silicon condenser microphone packages.
  38. Minervini, Anthony D., Methods of manufacture of top port multi-part surface mount MEMS microphones.
  39. Minervini, Anthony D., Methods of manufacture of top port multi-part surface mount silicon condenser microphone packages.
  40. Minervini, Anthony D., Methods of manufacture of top port multi-part surface mount silicon condenser microphones.
  41. Minervini, Anthony D., Methods of manufacture of top port multipart surface mount silicon condenser microphone package.
  42. Minervini, Anthony D., Methods of manufacture of top port surface mount MEMS microphones.
  43. Minervini, Anthony D., Methods of manufacture of top port surface mount MEMS microphones.
  44. Minervini, Anthony D., Methods of manufacture of top port surface mount silicon condenser microphone packages.
  45. Minervini, Anthony D., Methods of manufacture of top port surface mount silicon condenser microphone packages.
  46. Schrank, Franz; Schrems, Martin, Micro electro mechanical system (MEMS) microphone having a thin-film construction.
  47. Scheeper, Patrick Richard; Storgaard-Larsen, Torben, Micromachined capacitive component with high stability.
  48. Scheeper, Patrick Richard; Storgaard-Larsen, Torben, Micromachined capacitive electrical component.
  49. Kasai, Masaaki, Microphone.
  50. Peter Madaffari ; Walter P. Sjursen ; Christopher Poux ; Richard Moroney ; Ponnusamy Palanisamy, Microphone assembly for hearing aid with JFET flip-chip buffer.
  51. Loeppert, Peter V.; McCall, Ryan M.; Giesecke, Daniel; Vos, Sandra F.; Szczech, John B.; Lee, Sung Bok; Van Kessel, Peter, Microphone assembly with barrier to prevent contaminant infiltration.
  52. Takeuchi, Takanobu; Araki, Toru, Microphone filter and microphone unit.
  53. Cornelius,Elrick Lennaert; Clemens,Paul Leonardus; van Hal,Paul C.; Geskus,Mike, Microphone for a hearing aid or listening device with improved internal damping and foreign material protection.
  54. Harney, Kieran P.; Sengupta, Dipak; Moss, Brian; Guery, Alain V., Microphone module with sound pipe.
  55. Gong, Shih-Chin; Hsu, Wei-Chan, Microphone package with minimum footprint size and thickness.
  56. M��gelin,Raymond; Dubbeldeman,Eddy; Appel,Ronald, Microphone with internal damping.
  57. Wang, Christian; Rehder, Jörg; Johansen, Leif Steen; Scheel, Peter Ulrik, Miniature microphone assembly with hydrophobic surface coating.
  58. Huang, Chao-Ta; Chien, Hsin-Tang, Package and packaging assembly of microelectromechanical system microphone.
  59. Nakabayashi, Masakazu, Pressure responsive device and method of manufacturing semiconductor substrate for use in pressure responsive device.
  60. Mullenborn, Matthias; Scheel, Peter; Rombach, Pirmin, Pressure transducer.
  61. Tucker, Timothy J.; Mann, David A.; Wilson, Willard W., Process of manufacturing of electrostatic speakers.
  62. Pakhomov,Alexander; Goldburt,Tim, Seismic sensor.
  63. Pakhomov,Alexander; Goldburt,Tim, Seismic sensor.
  64. Feiertag, Gregor; Krueger, Hans; Leidl, Anton; Stelzl, Alois, Semiconductor chip arrangement with sensor chip and manufacturing method.
  65. Minervini, Anthony D., Silicon condenser microphone and manufacturing method.
  66. Mullenborn, Matthias; Kuhmann, Jochen F.; Scheel, Peter, Silicon-based sensor system.
  67. Rombach, Pirmin; Arnoldus, Morten Berg; Ginnerup, Morten, Single die MEMS acoustic transducer and manufacturing method.
  68. Chien, Hsin-Tang; Hsiao, Chieh-Ling; Wang, Chin-Hung, Stacked package structure for reducing package volume of an acoustic micro-sensor.
  69. Patten, David Talmage; Hoekstra, Tsjerk Hans, Stress decoupling in MEMS transducers.
  70. Mullenborn, Matthias; Kuhmann, Jochen F.; Scheel, Peter, Surface mountable transducer system.
  71. Mullenborn,Matthias; Kuhmann,Jochen F.; Scheel,Peter, Surface mountable transducer system.
  72. Hung, Li-Wen; Knickerbocker, John U., System for continuous monitoring of body sounds.
  73. Hung, Li-Wen; Knickerbocker, John U., System for continuous monitoring of body sounds.
  74. Minervini, Anthony D., Top port multi-part surface mount MEMS microphone.
  75. Minervini, Anthony D., Top port multi-part surface mount silicon condenser microphone.
  76. Minervini, Anthony D., Top port multi-part surface mount silicon condenser microphone.
  77. Minervini, Anthony D., Top port multi-part surface mount silicon condenser microphone.
  78. Minervini, Anthony D., Top port multi-part surface mount silicon condenser microphone package.
  79. Minervini, Anthony D., Top port multi-part surface mount silicon condenser microphone package.
  80. Minervini, Anthony D., Top port surface mount MEMS microphone.
  81. Minervini, Anthony D., Top port surface mount MEMS microphone.
  82. Minervini, Anthony D., Top port surface mount silicon condenser microphone package.
  83. Minervini, Anthony D., Top port surface mount silicon condenser microphone package.
  84. Bolognia, David; Harney, Kieran P., Transducer with enlarged back volume.
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