초록 ▼

The present invention relates generally to a new apparatus and method for forming non-planar surfaces in substrates. More particularly, the invention encompasses an apparatus and a method for fabricating non-planar surfaces in semiconductor substrates wherein at least one zero compression set pad, s

The present invention relates generally to a new apparatus and method for forming non-planar surfaces in substrates. More particularly, the invention encompasses an apparatus and a method for fabricating non-planar surfaces in semiconductor substrates wherein at least one zero compression set pad, such as a closed cell porous pad in combination with at least one elastic pad is placed over the non-planar surface prior to lamination and is caused to conform to the contour of the non-planar surface, thus preventing collapse of, or damage to, the non-planar features, such as, shelves or corners during the lamination process. After the lamination process, the zero compression set pad are conveniently removed from the non-planar surface area without causing any damage to the non-planar surface features, such as, shelves or corners or having any paste pull-outs. These zero compression set pads can be reused multiple number of times to form these MLC cavity substrates or similar other structures or features.

대표청구항 ▼

[ What is claimed is:] [1.] A method of forming a substrate having at least one non-planar surface, said method comprising:(a) placing at least one sheet over at least one first plate, wherein at least one of said at least one sheet has at least one non-planar surface,(b) placing at least one substa

[ What is claimed is:] [1.] A method of forming a substrate having at least one non-planar surface, said method comprising:(a) placing at least one sheet over at least one first plate, wherein at least one of said at least one sheet has at least one non-planar surface,(b) placing at least one substantially planar first pad over said sheet such that at least a portion of said at least one first pad covers at least a portion of said at least one non-planar surface, and wherein said at least one first pad has a compression modulus of less than about 40 psi for about 60 percent compression, and an elongation characteristic of greater than about 75 percent at room temperature,(c) placing at least one substantially planar second pad over at least a portion of said first pad, and wherein said at least one second pad has a compression modulus of less than about 150 psi for about 30 percent compression, and an elongation characteristic of greater than about 350 percent at room temperature,(d) applying lamination pressure to said at least one first and second pad and said at least one sheet, such that said first pad conforms to the shape of said non-planar surface and prevents the deformation of said non-planar surface during said application of said lamination pressure, and thereby forms said substrate having at least one non-planar surface.