초록 ▼

An overmolded electronic assembly (10) and method for forming the assembly (1) that entails enclosing a circuit board (12) having one or more circuit devices (16) mounted to its surface. The assembly (10) includes a heat-conductive member (18) in thermal contact with one or more of the circuit devic

An overmolded electronic assembly (10) and method for forming the assembly (1) that entails enclosing a circuit board (12) having one or more circuit devices (16) mounted to its surface. The assembly (10) includes a heat-conductive member (18) in thermal contact with one or more of the circuit devices (16) mounted to the circuit board (12). An overmolded body (22) encloses the circuit board (12) and the circuit devices (16) with the heat-conductive member (18), such that the overmolded body (22) and heat-conductive member (18) form a moisture-impermeable seal around the circuit board (12) and circuit devices (16). The overmolded body (22) also includes a connector housing (28) integrally-formed in its outer surface. The method for manufacturing the overmolded electronic assembly (10) generally entails supporting the circuit board (12) with the heat-conductive member (18) such that the heat-conductive member (18) thermally contacts the circuit devices (16). An overmolded enclosure is then formed by molding a material over the surface of the circuit board (12) to form the overmolded body (22) that, with the heat-conductive member (18), encases the circuit board (12) and its circuit devices (16).

대표청구항 ▼

[ What is claimed is:] [1.] An assembly method comprising the steps of:providing a circuit board having a first surface, an oppositely-disposed second surface, a circuit device mounted to the second surface, and input/output pins that extend through the circuit board and are electrically connected t

[ What is claimed is:] [1.] An assembly method comprising the steps of:providing a circuit board having a first surface, an oppositely-disposed second surface, a circuit device mounted to the second surface, and input/output pins that extend through the circuit board and are electrically connected to the circuit device;supporting the circuit board on a heat-conductive member such that the heat-conductive member thermally contacts the circuit device; andforming an overmolded enclosure by molding a material over the first surface of the circuit board and around the input/output pins to form an overmolded body with a connector housing integrally formed therewith, the input/output pins extending through the overmolded body and into a recess defined by the connector housing, the circuit board and the circuit device being between the overmolded body and the heat-conductive member so as to be enclosed within the overmolded enclosure formed thereby, the overmolded body and the heat-conductive member providing a moisture-impermeable seal around the circuit board and the circuit device.