초록 ▼

A thermally-coupled heat-dissipation apparatus (10) surrounds a solid state electronic device mounted on an adapter circuit board (14) or a thermal transfer column (74) extending upwardly from a main board socketed device. The apparatus (10) includes at least two heat sinks (18 and 20) positioned in

A thermally-coupled heat-dissipation apparatus (10) surrounds a solid state electronic device mounted on an adapter circuit board (14) or a thermal transfer column (74) extending upwardly from a main board socketed device. The apparatus (10) includes at least two heat sinks (18 and 20) positioned in a spaced parallel relationship on front and back sides (22 and 28) of the adapter circuit board (14) or thermal transfer column (74). A bridge member (38) thermally couples the two heat sinks (18 and 20). A plurality of fans (42) are mounted along outer surfaces of the heat sinks (18 and 20). In a preferred embodiment, the bridge member (38) is an additional heat sink, but could be a metal plate in alternate embodiments. The preferred device to cool using the present invention is a computer processor (12).

대표청구항 ▼

[ Having thus described the invention what is claimed and desired to be secured by Letters Patent is:] [1.] A thermally-coupled heat dissipation apparatus for cooling a solid state electronic device electrically coupled to a first circuit board, the thermally-coupled heat dissipation apparatus compr

[ Having thus described the invention what is claimed and desired to be secured by Letters Patent is:] [1.] A thermally-coupled heat dissipation apparatus for cooling a solid state electronic device electrically coupled to a first circuit board, the thermally-coupled heat dissipation apparatus comprising:a) at least two passive cooling elements, each having a pair of channels formed therein,b) a plurality of spring-clips inserted within the pair of channels for positioning the at least two passive cooling elements in a spaced parallel relationship and for surrounding the first circuit board,c) a bridge member removable attached to top portions of the at least two passive cooling elements providing a thermally-coupled path therebetween,d) at least one active cooling element mounted on an outer surface of one of the at least two passive cooling elements, ande) means for attaching the bridge member.