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Carrier head with a flexible membrane for a chemical mechanical polishing system 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24B-005/00
  • B24B-029/00
출원번호 US-0861260 (1997-05-21)
발명자 / 주소
  • Zuniga Steven M.
  • Birang Manoocher
  • Chen Hung
  • Ko Sen-Hou
출원인 / 주소
  • Applied Materials, Inc.
대리인 / 주소
    Fish & Richardson
인용정보 피인용 횟수 : 129  인용 특허 : 19

초록 ▼

A carrier head for a chemical mechanical polishing apparatus. The carrier head includes a housing, a base, a loading mechanism, a gimbal mechanism, and a substrate backing assembly. The substrate backing assembly includes a support structure positioned below the base, a substantially horizontal, ann

대표청구항 ▼

[ What is claimed is:] [1.] A carrier head for a chemical mechanical polishing apparatus, comprising:a base;a retaining ring connected to the base;a support structure connected to the base by a flexure to be moveable independently of the base and the retaining ring; anda flexible membrane that defin

이 특허에 인용된 특허 (19)

  1. Nakashiba Masamichi,JPX ; Kimura Norio,JPX ; Watanabe Isamu,JPX ; Yoshida Kaori,JPX, Apparatus for and method for polishing workpiece.
    상세보기
  2. Zuniga Steven M. ; Blumenkranz Stephen J., Carrier head design for a chemical mechanical polishing apparatus.
    상세보기
  3. Shendon Norman (San Carlos CA), Chemical mechanical polishing apparatus with improved carrier and method of use.
    상세보기
  4. Shendon Norm (San Carlos CA), Chemical mechanical polishing apparatus with improved polishing control.
    상세보기
  5. Tolles Robert D. ; Shendon Norm ; Somekh Sasson ; Perlov Ilya ; Gantvarg Eugene ; Lee Harry Q., Continuous processing system for chemical mechanical polishing.
    상세보기
  6. Bukhman Yefim (Scottsdale AZ), Distributed polishing head.
    상세보기
  7. Kitta Satoru (Nagano JPX), Method for lapping a wafer material and an apparatus therefor.
    상세보기
  8. Banks Edward L. (Willingboro Township ; Burlington County NJ), Methods and apparatus for polishing a semiconductor wafer.
    상세보기
  9. Hirose Masayoshi (Tokyo JPX) Tsujimura Manabu (Tokyo JPX) Ishikawa Seiji (Tokyo JPX) Kimura Norio (Tokyo JPX) Ishii You (Tokyo JPX), Polishing apparatus.
    상세보기
  10. Tanaka Kouichi (Takasaki JPX) Uchiyama Isao (Nishigo JPX), Polishing apparatus.
    상세보기
  11. Nakajima Makoto (Nagano JPX), Polishing machine.
    상세보기
  12. Volodarsky Konstantine (San Francisco CA) Kajiwara Jiro (Foster City CA) Owens ; Jr. Herbert W. (San Jose CA) King Jan H. (Sunnyvale CA), Rotary union for coupling fluids in a wafer polishing apparatus.
    상세보기
  13. Koeth Joe E. (Mesa AZ) Hoffman Melvin J. (Scottsdale AZ) Jackson Paul D. (Scottsdale AZ), Semiconductor wafer carrier and method.
    상세보기
  14. Olmstead Dennis L. (Sherman TX), Semiconductor wafer polishing using a hydrostatic medium.
    상세보기
  15. Strasbaugh Alan (825 Buckley Rd. San Luis Obispo CA 93401), Wafer carrier for film planarization.
    상세보기
  16. Shendon Norm (San Carlos CA) Struven Kenneth C. (San Carlos CA) Kolenkow Robert J. (Berkeley CA), Wafer polisher head having floating retainer ring.
    상세보기
  17. Kobayashi Hiroyuki (Omiya JPX) Miyairi Hiroo (Omiya JPX) Endo Osamu (Omiya JPX), Wafer polishing apparatus.
    상세보기
  18. Karlsrud Chris E. (Chandler AZ) Van Woerkom Anthony G. (Chandler AZ) Odagiri Shigeru (Yokohama JPX) Nagahashi Isao (Fujisawa AZ JPX) Preston Spencer (Chandler AZ), Wafer polishing method and apparatus.
    상세보기
  19. Strasbaugh Alan (825 Buckley Rd. San Luis Obispo CA 93401), Wafer-handling apparatus having a resilient membrane which holds wafer when a vacuum is applied.
    상세보기

이 특허를 인용한 특허 (129)

  1. Johnson, Hale; George, Gregory; Brennen, Michael, Apparatus and method for aligning and centering wafers.
    상세보기
  2. Johnson, Hale; George, Gregory; Brennen, Michael, Apparatus and method for semiconductor wafer leveling, force balancing and contact sensing.
    상세보기
  3. Zuniga, Steven M., Apparatus and method of detecting a substrate in a carrier head.
    상세보기
  4. Manens, Antoine P.; Butterfield, Paul D., Apparatus for electrochemical processing.
    상세보기
  5. Tietz,James V.; Li,Shijian; Birang,Manoocher; White,John M.; Rosenberg, legal representative,Sandra L.; Scales,Marty; Emami,Ramin; Rosenberg, deceased,Lawrence M., Article for polishing semiconductor substrates.
    상세보기
  6. Li,Shijian; Chen,Llang Yuh; Duboust,Alain, Articles for polishing semiconductor substrates.
    상세보기
  7. Duescher, Wayne O., Bellows driven air floatation abrading workholder.
    상세보기
  8. Duescher, Wayne O., Bellows driven floatation-type abrading workholder.
    상세보기
  9. Lee,Songjae; Shin,Ho Seon; Olgado,Donald J. K., Bubble suppressing flow controller with ultrasonic flow meter.
    상세보기
  10. Chen,Hung Chih; Zuniga,Steven M., Carrier head for thermal drift compensation.
    상세보기
  11. Paik, Young J.; Bhatnagar, Ashish; Narendrnath, Kadthala Ramaya, Carrier head membrane.
    상세보기
  12. Paik, Young J.; Bhatnagar, Ashish; Narendrnath, Kadthala Ramaya, Carrier head membrane roughness to control polishing rate.
    상세보기
  13. Bennett,Doyle E.; Nagengast,Andrew J.; Chen,Hung Chih, Carrier head vibration damping.
    상세보기
  14. Zuniga,Steven M.; Birang,Manoocher; Chen,Hung; Ko,Sen Hou, Carrier head with a flexible membrane.
    상세보기
  15. Steven M. Zuniga, Carrier head with a flexible membrane and an edge load ring.
    상세보기
  16. Steven M. Zuniga ; Manoocher Birang ; Hung Chen ; Sen-Hou Ko, Carrier head with a flexible membrane for a chemical mechanical polishing system.
    상세보기
  17. Zuniga, Steven M.; Birang, Manoocher; Chen, Hung; Ko, Sen-Hou, Carrier head with a flexible membrane for a chemical mechanical polishing system.
    상세보기
  18. Tang, Jianshe; Brown, Brian J.; Garretson, Charles C.; Bonner, Benjamin A.; Osterheld, Thomas H.; Redeker, Fred C., Carrier head with a modified flexible membrane.
    상세보기
  19. Zuniga, Steven M.; Osterheld, Thomas H., Carrier head with a multilayer retaining ring for chemical mechanical polishing.
    상세보기
  20. Zuniga, Steven M.; Chen, Hung Chih, Carrier head with a non-stick membrane.
    상세보기
  21. Zuniga,Steven M.; Chen,Hung Chih, Carrier head with a non-stick membrane.
    상세보기
  22. Govzman, Boris; Zuniga, Steven M.; Chen, Hung; Somekh, Sasson, Carrier head with a substrate detection mechanism for a chemical mechanical polishing system.
    상세보기
  23. Somekh, Sasson, Carrier head with a substrate detection mechanism for a chemical mechanical polishing system.
    상세보기
  24. Steven M. Zuniga ; Ming-Kuei Tseng, Carrier head with a substrate sensor.
    상세보기
  25. Zuniga, Steven M.; Tseng, Ming-Kuei, Carrier head with a substrate sensor.
    상세보기
  26. Chao, Sandy Shih-Hsun; Nagengast, Andrew, Carrier head with a vibration reduction feature for a chemical mechanical polishing system.
    상세보기
  27. Gajendra, Manoj A.; Giriyapura, Kiran, Carrier head with composite plastic portions.
    상세보기
  28. Tseng,Ming Kuei; Zuniga,Steven M., Carrier head with gimbal mechanism.
    상세보기
  29. Zuniga, Steven M.; Chen, Hung Chih; Birang, Manoocher; Wijekoon, Kapila; Ko, Sen-Hou, Carrier head with local pressure control for a chemical mechanical polishing apparatus.
    상세보기
  30. Steven M. Zuniga ; Hung Chih Chen, Carrier head with pressure transfer mechanism.
    상세보기
  31. Zuniga, Steven M.; Nagengast, Andrew J.; Oh, Jeonghoon, Carrier head with retaining ring and carrier ring.
    상세보기
  32. Zuniga, Steven M.; Nagengast, Andrew J.; Oh, Jeonghoon, Carrier head with retaining ring and carrier ring.
    상세보기
  33. Zuniga, Steven M.; Nagengast, Andrew J.; Oh, Jeonghoon, Carrier ring for carrier head.
    상세보기
  34. Oh,Jeonghoon; Chen,Hung Chih; Brezoczky,Thomas B.; McAllister,Douglas R.; Huo,David Datong, Composite retaining ring.
    상세보기
  35. Mavliev,Rashid A.; Wadensweiler,Ralph M., Conductive pad.
    상세보기
  36. Mavliev, Rashid A.; Karuppiah, Lakshmanan, Conductive pad design modification for better wafer-pad contact.
    상세보기
  37. Chen,Liang Yun; Wang,Yuchun; Wang,Yan; Duboust,Alain; Carl,Daniel A.; Wadensweiler,Ralph; Birang,Manoocher; Butterfield,Paul D.; Mavliev,Rashid A.; Tsai,Stan D.; Wang,You; Diao,Jie; Jia,Renhe; Karuppiah,Lakshmanan; Ewald,Robert, Conductive pad with ion exchange membrane for electrochemical mechanical polishing.
    상세보기
  38. Butterfield,Paul D.; Chen,Liang Yuh; Hu,Yongqi; Manens,Antoine P.; Mavliev,Rashid; Tsai,Stan D.; Liu,Feng Q.; Wadensweiler,Ralph, Conductive polishing article for electrochemical mechanical polishing.
    상세보기
  39. Butterfield,Paul D.; Chen,Liang Yuh; Hu,Yonqi; Manens,Antoine P.; Mavliev,Rashid; Tsai,Stan D.; Liu,Feng Q.; Wadensweiler,Ralph; Sun,Lizhong; Neo,Siew S.; Duboust,Alain, Conductive polishing article for electrochemical mechanical polishing.
    상세보기
  40. Chen,Liang Yuh; Wang,Yuchun; Wang,Yan; Duboust,Alain; Carl,Daniel A.; Wadensweiler,Ralph; Birang,Manoocher; Butterfield,Paul D.; Mavliev,Rashid; Tsai,Stan D., Conductive polishing article for electrochemical mechanical polishing.
    상세보기
  41. Chen,Liang Yuh; Wang,Yuchun; Wang,Yan; Duboust,Alain; Carl,Daniel A.; Wadensweiler,Ralph; Birang,Manoocher; Butterfield,Paul D.; Mavliev,Rashid; Tsai,Stan D., Conductive polishing article for electrochemical mechanical polishing.
    상세보기
  42. Chen,Liang Yuh; Wang,Yuchun; Wang,Yan; Duboust,Alain; Carl,Daniel A.; Wadensweiler,Ralph; Birang,Manoocher; Butterfield,Paul D.; Mavliev,Rashid; Tsai,Stan D., Conductive polishing article for electrochemical mechanical polishing.
    상세보기
  43. Hu, Yongqi; Wang, Yan; Duboust, Alain; Liu, Feng Q.; Mavliev, Rashid; Chen, Liang-Yuh; Morad, Ratson; Somekh, Sasson, Conductive polishing article for electrochemical mechanical polishing.
    상세보기
  44. Hu,Yongqi; Wang,Yan; Duboust,Alain; Liu,Feng Q.; Manens,Antoine P.; Neo,Siew S.; Tsai,Stan D.; Chen,Liang Yuh; Butterfield,Paul D.; Tian,Yuan A.; Ko,Sen Hou, Conductive polishing article for electrochemical mechanical polishing.
    상세보기
  45. Hu,Yongqi; Wang,Yan; Duboust,Alain; Liu,Feng Q.; Manens,Antoine P.; Neo,Siew S.; Tsai,Stan D.; Chen,Liang Yuh; Butterfield,Paul D.; Tian,Yuan A.; Ko,Sen Hou, Conductive polishing article for electrochemical mechanical polishing.
    상세보기
  46. Liu, Feng Q.; Mavliev, Rashid, Contact assembly and method for electrochemical mechanical processing.
    상세보기
  47. Butterfield, Paul; Chen, Liang Yuh; Hu, Yongqi; Manens, Antoine; Mavliev, Rashid; Tsai, Stan, Contacts for electrochemical processing.
    상세보기
  48. Butterfield,Paul; Chen,Liang Yuh; Hu,Yongqi; Manens,Antoine; Mavliev,Rashid; Tsai,Stan, Contacts for electrochemical processing.
    상세보기
  49. Mavliev,Rashid; Tsai,Stan; Hu,Yongqi; Butterfield,Paul; Manens,Antoine; Chen,Liang Yuh, Contacts for electrochemical processing.
    상세보기
  50. Van Der Veen,Shaun; Chih Chen,Hung, Detachable retaining ring.
    상세보기
  51. Schauer, Ronald Vern, Detecting membrane breakage in a carrier head.
    상세보기
  52. Duboust,Alain; Manens,Antoine P.; Chen,Liang Yuh, Edge bead removal by an electro polishing process.
    상세보기
  53. Fukushima, Makoto; Yasuda, Hozumi; Nabeya, Osamu; Watanabe, Katsuhide; Namiki, Keisuke, Elastic membrane for semiconductor wafer polishing.
    상세보기
  54. Fukushima, Makoto; Yasuda, Hozumi; Nabeya, Osamu; Watanabe, Katsuhide; Namiki, Keisuke, Elastic membrane for semiconductor wafer polishing.
    상세보기
  55. Wang, Yuchun; Ewald, Robert A.; Hsu, Wei-Yung; Chen, Liang-Yuh, Extended pad life for ECMP and barrier removal.
    상세보기
  56. Oh, Jeonghoon; Nagengast, Andrew; Zuniga, Steven M.; Chen, Hung Chih, Fast substrate loading on polishing head without membrane inflation step.
    상세보기
  57. Duescher, Wayne O., Flexible diaphragm combination floating and rigid abrading workholder.
    상세보기
  58. Duescher, Wayne O.; Duescher, Cameron M., Flexible diaphragm post-type floating and rigid abrading workholder.
    상세보기
  59. Chen,Hung Chih; Oh,Jeonghoon; Zuniga,Steven M., Flexible membrane for multi-chamber carrier head.
    상세보기
  60. Liu,Feng Q.; Chen,Liang Yuh; Tsai,Stan D.; Hu,Yongqi, Full sequence metal and barrier layer electrochemical mechanical processing.
    상세보기
  61. Liu,Feng Q.; Chen,Liang Yuh; Tsai,Stan D.; Hu,Yongqi, Full sequence metal and barrier layer electrochemical mechanical processing.
    상세보기
  62. Redeker,Fred C.; Birang,Manoocher; Li,Shijian; Somekh,Sasson, Linear polishing sheet with window.
    상세보기
  63. Ko,Sen Hou; Song,Kevin H., Low cost and low dishing slurry for polysilicon CMP.
    상세보기
  64. Wang, Yan; Neo, Siew; Liu, Feng; Tsai, Stan D.; Hu, Yongqi; Duboust, Alain; Manens, Antoine; Wadensweiler, Ralph M.; Mavliev, Rashid; Chen, Liang-Yuh; Olgado, Donald J. K.; Butterfield, Paul D.; Tseng, Ming-Kuei; Chang, Shou-Sung; Sun, Lizhong, Method and apparatus for electrochemical mechanical processing.
    상세보기
  65. Tsai, Stan; Liu, Feng Q.; Wang, Yan; Mavliev, Rashid; Chen, Liang-Yuh; Duboust, Alain, Method and apparatus for local polishing control.
    상세보기
  66. Moon, Yongsik; Mai, David; Wijekoon, Kapila; Bajaj, Rajeev; Surana, Rahul; Hu, Yongqi; Kaushal, Tony S.; Li, Shijian; Li, Jui-Lung; Wang, Shi-Ping; Lam, Gary; Redeker, Fred C., Method and apparatus for polishing metal and dielectric substrates.
    상세보기
  67. Zuniga, Steven M.; Osterheld, Thomas H., Method of assembly of retaining ring for CMP.
    상세보기
  68. Li, Shijian; Li, Jui-Lung; Wang, Shi-Ping; Lam, Gary; Mai, David; Redeker, Fred C., Method of chemical mechanical polishing with high throughput and low dishing.
    상세보기
  69. Li,Shijian; Li,Jui Lung; Wang,Shi Ping; Lam,Gary; Mai,David; Redeker,Fred C., Method of chemical mechanical polishing with high throughput and low dishing.
    상세보기
  70. Chen, Hung Chih; Tseng, Ming Kuei; Zuniga, Steven, Method of detecting a substrate in a carrier head.
    상세보기
  71. Moon, Yongsik; Mai, David; Wijekoon, Kapila; Bajaj, Rajeev; Surana, Rahul; Hu, Yongqi; Kaushal, Tony S.; Li, Shijian; Li, Jui-Lung; Wang, Shi-Ping; Lam, Gary; Redeker, Fred C., Methods and apparatus for polishing substrates comprising conductive and dielectric materials with reduced topographical defects.
    상세보기
  72. Zuniga, Steven M.; Osterheld, Thomas H., Methods for a multilayer retaining ring.
    상세보기
  73. Adam, Paul, Modular block.
    상세보기
  74. Zuniga, Steven M.; Osterheld, Thomas H., Multilayer retaining ring for chemical mechanical polishing.
    상세보기
  75. Zuniga, Steven M.; Osterheld, Thomas H., Multilayer retaining ring for chemical mechanical polishing.
    상세보기
  76. Chang,Shou Sung; Tsai,Stan D.; Olgado,Donald J. K.; Chen,Liang Yuh; Duboust,Alain; Wadensweiler,Ralph M., Pad assembly for electrochemical mechanical polishing.
    상세보기
  77. Chang,Shou Sung; Tsai,Stan D.; Olgado,Donald J. K.; Chen,Liang Yuh; Duboust,Alain; Wadensweiler,Ralph M., Pad assembly for electrochemical mechanical processing.
    상세보기
  78. Chang,Shou Sung; Tsai,Stan D; Olgado,Donald J. K.; Chen,Liang Yuh; Duboust,Alain; Wadensweiler,Ralph M., Pad assembly for electrochemical mechanical processing.
    상세보기
  79. Hu,Yongqi; Tsai,Stan D.; Wang,Yan; Liu,Feng Q.; Chang,Shou Sung; Chen,Liang Yuh, Pad assembly for electrochemical mechanical processing.
    상세보기
  80. Hu,Yongqi; Tsai,Stan D.; Wang,Yan; Liu,Feng Q.; Chang,Shou Sung; Chen,Liang Yuh, Pad assembly for electrochemical mechanical processing.
    상세보기
  81. Duescher, Wayne O., Pin driven flexible chamber abrading workholder.
    상세보기
  82. Yeh, Yu-Hua; Hu, Liang-Yu; Chang, Tang-Tsai; Lai, Ming-Tsan, Planarization device and planarization method using the same.
    상세보기
  83. David,Jeffrey Drue, Platen and head rotation rates for monitoring chemical mechanical polishing.
    상세보기
  84. David,Jeffrey Drue, Platen and head rotation rates for monitoring chemical mechanical polishing.
    상세보기
  85. Schauer, Ronald Vern, Pneumatic connection to carrier head.
    상세보기
  86. Norio Kimura JP; Hozumi Yasuda JP, Polishing apparatus.
    상세보기
  87. Teruhiko Ichimura JP, Polishing apparatus.
    상세보기
  88. Albrecht, Peter; Hull, Ashley Samuel; Vadnais, David, Polishing apparatus, polishing head and method.
    상세보기
  89. Berkstresser,David E.; Berkstresser,Jerry J.; Park,Jino; Jeong,In Kwon, Polishing head for polishing semiconductor wafers.
    상세보기
  90. Koh,Meng Fei; Poh,Choon Siong; Goh,Inn Swee; Leong,Theng Wei; Neo,Teck Leong; Wang,Bing, Process for producing improved membranes.
    상세보기
  91. Manens,Antoine P., Processing pad assembly with zone control.
    상세보기
  92. Yavelberg, Simon, Recording measurements by sensors for a carrier head.
    상세보기
  93. Bennett, Doyle E.; Nagengast, Andrew J.; Chen, Hung Chih, Retaining ring and articles for carrier head.
    상세보기
  94. Bennett, Doyle E.; Nagengast, Andrew J.; Chen, Hung Chih, Retaining ring and articles for carrier head.
    상세보기
  95. Chen,Hung Chih; Zuniga,Steven M., Retaining ring deflection control.
    상세보기
  96. Zuniga, Steven M.; Osterheld, Thomas H., Retaining ring for chemical mechanical polishing.
    상세보기
  97. Donohue, Timothy J., Retaining ring for use in chemical mechanical polishing.
    상세보기
  98. Oh, Jeonghoon; Zuniga, Steven M.; Nagengast, Andrew J.; Hsu, Samuel Chu-Chiang; Dandavate, Gautam Shashank, Retaining ring having inner surfaces with facets.
    상세보기
  99. Chen, Hung Chih; Zuniga, Steven M.; Garretson, Charles C.; McAllister, Douglas R.; Lin, Jian; Meyer, Stacy; Huey, Sidney P.; Oh, Jeonghoon; Doan, Trung T.; Schmidt, Jeffrey P.; Wohlert, Martin S.; Hughes, Kerry F.; Wang, James C.; Lu, Danny Cam Toan; De Lamenie, Romain Beau; Balagani, Venkata R.; Allen, Aden Martin; Fong, Michael Jon, Retaining ring with Shaped Surface.
    상세보기
  100. Rahmathullah, Irfanulla Khuddus; Vansantha, Bopanna Ichettira; Gopalakrishnan, Padma; Palaty, Abraham; Ravi, Aswathnarayanaiah; Bhatnagar, Ashish; Paik, Young J.; Meyer, Stacy; Martin, Daniel, Retaining ring with attachable segments.
    상세보기
  101. Chen, Hung Chih; Zuniga, Steven M.; Garretson, Charles C.; McAllister, Douglas R.; Lin, Jian; Meyer, Stacy; Huey, Sidney P.; Oh, Jeonghoon; Doan, Trung T.; Schmidt, Jeffrey P.; Wohlert, Martin S.; Hughes, Kerry F.; Wang, James C.; Lu, Danny Cam Toan; De Lamenie, Romain Beau; Balagani, Venkata R.; Allen, Aden Martin; Fong, Michael Jon, Retaining ring with shaped surface.
    상세보기
  102. Chen, Hung Chih; Zuniga, Steven M.; Garretson, Charles C.; McAllister, Douglas R.; Lin, Jian; Meyer, Stacy; Huey, Sidney P.; Oh, Jeonghoon; Doan, Trung T.; Schmidt, Jeffrey; Wohlert, Martin S.; Hughes, Kerry F.; Wang, James C.; Lu, Danny Cam Toan; De Lamenie, Romain Beau; Balagani, Venkata R.; Allen, Aden Martin; Fong, Michael Jon, Retaining ring with shaped surface.
    상세보기
  103. Chen,Hung Chih; Zuniga,Steven M.; Garretson,Charles C.; McAllister,Douglas R.; Meyer,Stacy; Doan,Trung T.; Lu,Daniel Cam Toan; De Lamenie,Romain Beau; Balagani,Venkata R.; Allen,Aden Martin; Fong,Michael Jon, Retaining ring with shaped surface.
    상세보기
  104. Zuniga, Steven M.; Nagengast, Andrew J.; Oh, Jeonghoon, Retaining ring, flexible membrane for applying load to a retaining ring, and retaining ring assembly.
    상세보기
  105. Chen,Hung Chih, Six headed carousel.
    상세보기
  106. Chen,Hung Chih; Yavelberg,Simon, Six headed carousel.
    상세보기
  107. Duescher, Wayne O., Spider arm driven flexible chamber abrading workholder.
    상세보기
  108. Numoto, Minoru, Structure of polishing head of polishing apparatus.
    상세보기
  109. Chen,Hung Chih, Substrate carrier with a textured membrane.
    상세보기
  110. Togawa, Tetsuji; Noji, Ikutaro; Namiki, Keisuke; Yasuda, Hozumi; Kojima, Shunichiro; Sakurai, Kunihiko; Takada, Nobuyuki; Nabeya, Osamu; Fukushima, Makoto; Takayanagi, Hideki, Substrate holding apparatus.
    상세보기
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    상세보기
  112. Togawa,Tetsuji; Noji,Ikutaro; Namiki,Keisuke; Yasuda,Hozumi; Kojima,Shunichiro; Sakurai,Kunihiko; Takada,Nobuyuki; Nabeya,Osamu; Fukushima,Makoto; Takayanagi,Hideki, Substrate holding apparatus.
    상세보기
  113. Togawa,Tetsuji; Noji,Ikutaro; Namiki,Keisuke; Yasuda,Hozumi; Kojima,Shunichiro; Sakurai,Kunihiko; Takada,Nobuyuki; Nabeya,Osamu; Fukushima,Makoto; Takayanagi,Hideki, Substrate holding apparatus.
    상세보기
  114. Togawa, Tetsuji; Yoshida, Hiroshi; Nabeya, Osamu; Fukushima, Makoto; Fukaya, Koichi, Substrate holding apparatus and polishing apparatus.
    상세보기
  115. Togawa, Tetsuji; Yoshida, Hiroshi; Nabeya, Osamu; Fukushima, Makoto; Fukaya, Koichi, Substrate holding apparatus and polishing apparatus.
    상세보기
  116. Togawa, Tetsuji; Yoshida, Hiroshi; Nabeya, Osamu; Fukushima, Makoto; Fukaya, Koichi, Substrate holding device and polishing apparatus.
    상세보기
  117. Kondo,Fumio; Mishima,Koji; Tanaka,Akira; Suzuki,Yoko; Togawa,Tetsuji; Inoue,Hiroaki, Substrate processing method.
    상세보기
  118. Chen,Hung Chih; Zuniga,Steven M.; Siu,Tsz Sin, Substrate removal from polishing tool.
    상세보기
  119. Kajiwara, Jiro; Moloney, Gerard S.; Wang, Huey-Ming; Hansen, David A.; Reyes, Alejandro, System and method for CMP head having multi-pressure annular zone subcarrier material removal control.
    상세보기
  120. Rahmathullah, Irfanulla Khuddus; Vansantha, Bopanna Ichettira; Gopalakrishnan, Padma; Ravi, Aswathnarayanaiah; Palaty, Abraham; Paik, Young J.; Meyer, Stacy; Klingler, James; Bhatnagar, Ashish, Two-part retaining ring with interlock features.
    상세보기
  121. Duescher, Wayne O.; Duescher, Cameron M., Vacuum-grooved membrane abrasive polishing wafer workholder.
    상세보기
  122. Duescher, Wayne O.; Duescher, Cameron M., Vacuum-grooved membrane wafer polishing workholder.
    상세보기
  123. Chen,Hung Chih; Li,Shijian; White,John M.; Emami,Ramin; Redeker,Fred C.; Zuniga,Steven M.; Cheboli,Ramakrishna, Vibration damping during chemical mechanical polishing.
    상세보기
  124. Chen, Hung Chih; Zuniga, Steven M.; Cheboli, Ramakrishna, Vibration damping in a carrier head.
    상세보기
  125. Chen,Hung Chih; White,John M.; Li,Shijian; Redeker,Fred C.; Emami,Ramin, Vibration damping in a chemical mechanical polishing system.
    상세보기
  126. Chen,Hung Chih; White,John M.; Li,Shijian; Redeker,Fred C.; Emami,Ramin, Vibration damping in chemical mechanical polishing system.
    상세보기
  127. Blalock, Guy T.; Stroupe, Hugh E.; Gordon, Brian F., Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing.
    상세보기
  128. Blalock, Guy T.; Stroupe, Hugh E.; Gordon, Brian F., Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing.
    상세보기
  129. Guy T. Blalock ; Hugh E. Stroupe ; Brian F. Gordon, Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing.
    상세보기

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