Sheet materials suitable for use as a floor, wall or ceiling covering material, and processes and intermediates for making the same
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
B32B-007/02
B32B-005/16
B32B-003/26
B32B-027/08
C08L-023/00
출원번호
US-0129580
(1998-08-05)
발명자
/ 주소
Kjellqvist Jerker B. I.,CHX
Wevers Ronald,CHX
Thoen Johan A.,NLX
Quack Wolfgang,DEX
출원인 / 주소
The Dow Chemical Company
인용정보
피인용 횟수 :
85인용 특허 :
37
초록▼
Sheet materials suitable for use as a floor, wall or ceiling covering material are described which comprise (1) a polymer mixture having (A) at least one homogeneously branched ethylene Polymer (A) having a molecular weight distribution, M.sub.w /M.sub.n, less than 3 and a short chain branching dist
Sheet materials suitable for use as a floor, wall or ceiling covering material are described which comprise (1) a polymer mixture having (A) at least one homogeneously branched ethylene Polymer (A) having a molecular weight distribution, M.sub.w /M.sub.n, less than 3 and a short chain branching distribution index (SCBDI) equal to or greater than 50 percent obtainable by polymerization of ethylene with at least one C.sub.3 -C.sub.20 .alpha.-olefin in the presence of a single site or constrained geometry catalyst; (B) at least one ethylene Polymer (B) having a density at least 0.005 g/cm.sup.3 greater than the density of ethylene Polymer (A) and a TREF elution temperature at least 5.degree. C. greater than the TREF elution temperature of ethylene Polymer (A) and, optionally, (C) at least one ethylene Polymer (C) having a density at least 0.005 g/cm.sup.3 greater than the density of ethylene Polymer (B) and a TREF elution temperature at least 5.degree. C. greater than the TREF elution temperature of ethylene Polymer (B), and (2) optionally a filler at least partially dispersed with a compatibilizer in the polymer mixture, and when less than 10 wt % filler is dispersed in the polymer mixture, then the melt index of Polymer (A) is preferably less than or equal to 1.5 g/10 min., the melt index ratio of Polymer (B) to Polymer (A) is preferably less than or equal to 5.0, and/or Polymer (B) is preferably a homogeneously branched ethylene polymer. Floor, wall and ceiling covering materials and processes for making them according to this invention are also described.
대표청구항▼
[ What is claimed is:] [1.] A sheet material suitable for use as a floor, wall or ceiling covering material comprising(1) a polymer mixture having:(A) at least one homogeneously branched ethylene Polymer (A) having a molecular weight distribution, M.sub.w /M.sub.n, less than about 3 and a short chai
[ What is claimed is:] [1.] A sheet material suitable for use as a floor, wall or ceiling covering material comprising(1) a polymer mixture having:(A) at least one homogeneously branched ethylene Polymer (A) having a molecular weight distribution, M.sub.w /M.sub.n, less than about 3 and a short chain branching distribution index SCBDI equal to or greater than about 50 percent obtainable by polymerization of ethylene with at least one C.sub.3 -C.sub.20 .alpha.-olefin in the presence of a single site or constrained geometry catalyst;(B) at least one ethylene Polymer (B) having a density at least 0.005 g/cm.sup.3 greater than the density of ethylene Polymer (A) and a TREF elution temperature at least 5.degree. C. greater than the TREF elution temperature of ethylene Polymer (A) and, optionally,(C) at least one ethylene Polymer (C) having a density at least 0.005 g/cm.sup.3 greater than the density of ethylene Polymer (B) and a TREF elution temperature at least 5.degree. C. greater than the TREF elution temperature of ethylene Polymer (B), and(2) optionally a filler at least partially dispersed with a compatibilizer in the polymer mixture, when less than 10 wt % filler is dispersed in the polymer mixture, then the melt index of Polymer (A) is less than or equal to about 1.5 g/10 min., the melt index ratio of Polymer (B) to Polymer (A) is less than or equal to about 5.0, and/or Polymer (B) is a homogeneously branched ethylene polymer.[ D-1894 Coefficient of Friction).ltoreq.200.]
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이 특허에 인용된 특허 (37)
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