$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Cold plate arrangement for cooling processor and companion voltage regulator 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0240266 (1999-01-29)
발명자 / 주소
  • Belady Christian L.
  • Cromwell S. Daniel
출원인 / 주소
  • Hewlett-Packard Company
대리인 / 주소
    Lenell
인용정보 피인용 횟수 : 35  인용 특허 : 32

초록

A compact cooling method and apparatus arranged for simultaneously drawing heat from both a processor and from the voltage regulator. The invention provides for advantageous arrangement of the voltage regulator and memory proximate to the processor for high speed operation. The invention includes a

대표청구항

[ What is claimed is:] [1.] An apparatus comprising:a processor requiring at least one bias voltage;a voltage regulator for providing the bias voltage; electrical coupling between the voltage regulator and the processor for conducting the bias voltages thereto; andat least one cold plate sandwiched

이 특허에 인용된 특허 (32)

  1. Arii ; Hiroshi ; Kawada ; Hirohito ; Yoshida ; Takashi ; Nonaka ; Chiaki, Apparatus for cooling electrical components.
  2. Hershberger Marc (Rochester NY) Stevens Carl (Rochester NY) Ozug Peter (Rochester NY), Apparatus for shielding an electrical circuit from electromagnetic interference.
  3. Peterson George P. (College Station TX) Oktay Sevgin (Poughkeepsie NY), Bellows heat pipe for thermal control of electronic components.
  4. Ciaccio Michael P. (Rockford IL), Cold plate for cooling electronics.
  5. Muyshondt Jorge E. (Austin TX) Parker Gary A. (Round Rock TX) Wilkie Bruce J. (Georgetown TX), Computer including a Faraday cage on printed circuit board.
  6. Harshberger Martin J. (Collierville TN) Reader Arthur R. (Bartlett TN) Giambrone Michael S. (Schaumburg IL), Computer with modules readily replaceable by unskilled personnel.
  7. Xie Hong (Chandler AZ) Aghazadeh Mostafa (Chandler AZ) Turturro Gregory (Chandler AZ) Chiu Chia-Pin (Chandler AZ), Dissipation of heat through keyboard using a heat pipe.
  8. Kaplo Joseph J. (Pittsford NY) Mertinooke Peter E. (Amesbury MA) DeMello Alan J. (Newmarket NH), EMI-shielding gasket.
  9. Mims William D. (Roanoke VA) Griffin ; Jr. Raymond F. (Roanoke VA), Electromagnetic interference shielding device for image intensifiers.
  10. Go Hiroshi (Zama JPX) Zushi Shizuo (Hadano JPX) Miyamoto Mitsuo (Hadano JPX), Electronic apparatus cooling system.
  11. Wentland ; Jr. William A. (Bristol CT) Hansen Alan M. (Higganum CT) Rosati Ramon W. (Simsbury CT), Enclosure for an electronic circuit module.
  12. McCarthy William F. (Marblehead MA) Brench Colin E. (Stow MA) Snow Daniel M. (Maynard MA), Enclosure for electronic modules.
  13. Muyshondt Jorge E. (Austin TX) Parker Gary A. (Round Rock TX) Wilkie Bruce J. (Georgetown TX), Faraday cage for a printed circuit card.
  14. Muyshondt Jorge E. (Austin TX) Parker Gary A. (Round Rock TX) Wilkie Bruce J. (Georgetown TX), Faraday cage for a printed circuit card.
  15. Noren Don W. (846 Blandford Blvd. Redwood City CA 94062), Heat pipe assembly.
  16. Murase Takashi (Yokohama JPX) Koizumi Tatsuya (Tokyo JPX), Heat pipe heat sink for semiconductor devices.
  17. Chung Hao S. (Monterey Park CA), Heat sink arrangement for central processing unit.
  18. Currie Thomas P. (St. Paul MN), Heat sink assembly for cooling electronic components.
  19. Tata Peter D. (Johnston RI) Rife William B. (Greenville RI), Heat sink assembly for solid state devices.
  20. Katsui Tadashi (Kawasaki JPX) Nakata Katsuhiko (Kawasaki JPX) Koga Takeshi (Kawasaki JPX) Matsumura Tadanobu (Kawasaki JPX) Tanaka Yoshimi (Kawasaki JPX) Sugimoto Yasuaki (Kawasaki JPX) Kitahara Taka, Heat sink for cooling a heat producing element and application.
  21. Takiar Hem (Fremont CA), Integrated circuit packaged power supply.
  22. Sturgeon Clayton L. (Watauga TX), Integrated magnetic power converter.
  23. Leyland Walter E. (Riverside CA), Lightweight portable EMI shielding container.
  24. Clark William E. (401 Hyder St. ; N.E. Palm Bay FL 32907), Liquid-cooled, flat plate heat exchanger.
  25. Salmonson Richard B., Method and apparatus for cooling daughter card modules.
  26. Kazama Tsutomu (Aichi JPX) Kondo Satoshi (Aichi JPX), Motor control unit with thermal structure.
  27. Nelson Daryl (Beaverton OR), Multiple-fan microprocessor cooling through a finned heat pipe.
  28. Arcella ; Frank G., Novel heat pipe combination.
  29. Bowen Stephen A. (Chippewa Falls WI) August Melvin C. (Chippewa Falls WI) Cermak ; III Stephen (Elk Mound WI) Collins David R. (Eau Claire WI) Dean Steven J. (Chippewa Falls WI) Franz Perry D. (Elk M, Quick disconnect system for circuit board modules.
  30. Toedtman Thomas (Lake Forest CA) Welch Randall S. (Lake Forest CA), Rotable and slideble heat pipe apparatus for reducing heat build up in electronic devices.
  31. Huss John (Rockford IL) Hoppe Richard J. (Rockford IL) Crowe Lawrence E. (Lindenwood IL) Sutrina Thomas (Rockford IL) Lakin Eric D. (Rockford IL), Stacked power converter.
  32. Lyle ; Jr. Robert L. (Knoxville TN), Voltage regulator with reduced semiconductor power dissipation.

이 특허를 인용한 특허 (35)

  1. Hurlbert, Kathryn M.; Ruemmele, Warren; Nguyen, Hai D.; Andish, Kambiz K.; McCalley, Sean M., Apparatus and method for extracting heat from a device.
  2. Goodson,Kenneth E.; Chen,Chuan Hua; Huber,David E.; Jiang,Linan; Kenny,Thomas W.; Koo,Jae Mo; Laser,Daniel J.; Mikkelsen,James C.; Santiago,Juan G.; Wang,Evelyn Ning Yi; Zeng,Shulin; Zhang,Lian, Closed-loop microchannel cooling system.
  3. Zaffetti, Mark A., Compact two sided cold plate with threaded inserts.
  4. Zaffetti, Mark A.; Laurin, Michael B., Compact two sided cold plate with transfer tubes.
  5. Santiago,Juan G.; Zeng,Shulin, Control of electrolysis gases in electroosmotic pump systems.
  6. Boudreaux, Brent A.; Zeighami, Roy M.; Belady, Christian L., Cooling apparatus for stacked components.
  7. Aoki, Russell S.; Kulkarni, Devdatta P.; Tate, Alan W.; Steinbrecher, Robin A.; Jensen, Ralph W., Cooling using adjustable thermal coupling.
  8. Goodson, Kenneth E.; Chen, Chuan-Hua; Huber, David E.; Jiang, Linan; Kenny, Thomas W.; Koo, Jae-Mo; Laser, Daniel J.; Mikkelsen, James C.; Santiago, Juan G.; Wang, Evelyn Ning-Yi; Zeng, Shulin; Zhang, Electroosmotic microchannel cooling system.
  9. Goodson,Kenneth E.; Chen,Chuan Hua; Huber,David E.; Jiang,Linan; Kenny,Thomas W.; Koo,Jae Mo; Laser,Daniel J.; Mikkelsen,James C.; Santiago,Juan G.; Wang,Evelyn Ning Yi; Zeng,Shulin; Zhang,Lian, Electroosmotic microchannel cooling system.
  10. Goodson,Kenneth E.; Chen,Chuan Hua; Huber,David E.; Jiang,Linan; Kenny,Thomas W.; Koo,Jae Mo; Laser,Daniel J.; Mikkelsen,James C.; Santiago,Juan G.; Wang,Evelyn Ning Yi; Zeng,Shulin; Zhang,Lian, Electroosmotic microchannel cooling system.
  11. Yamaguchi,Kouji; Sato,Ryoichi; Ozawa,Hideki, Flexible heat exchanger.
  12. Peterson, Eric C.; Belady, Christian L., Flexible midplane and architecture for a multi-processor computer system.
  13. Shi, Weimin; Ball, Zane A., High performance microprocessor power delivery solution using flex connections.
  14. Zaffetti, Mark A.; Taddey, Edmund P., Integral cold plate and structural member.
  15. Hartke, David J; Dibene, II, Joseph T.; Derian, Edward J.; Broder, James M., Integrated power delivery and cooling system for high power microprocessors.
  16. Pal, Debabrata, Integrated thermal packaging of high power motor controller.
  17. Dede, Ercan Mehmet; Lee, Jaewook; Nomura, Tsuyoshi, Magnetic fluid cooling devices and power electronics assemblies.
  18. DiBene, II, Joseph Ted; Hartke, David H., Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management.
  19. DiBene, II,Joseph T.; Derian,Edward J., Micro-spring interconnect systems for low impedance high power applications.
  20. Gilliland,Don A.; Wurth,Dennis J., Modular heat sink fin modules for CPU.
  21. Pfahnl,Andreas C., Modular liquid cooling of electronic assemblies.
  22. Pfahnl,Andreas C., Modular rackmount chiller.
  23. Klein,David A.; Belady,Christian L.; Harris,Shaun L.; Day,Michael C.; Christenson,Jeffrey P.; Boudreaux,Brent A.; Haden,Stuart C.; Peterson,Eric; Metcalf,Jeffrey N.; Wells,James S.; Williams,Gary W.; Wirtzberger,Paul A.; Zeighami,Roy M.; Huff,Greg, Multi-processor module.
  24. Kenny, Jr., Thomas William; Goodson, Kenneth E.; Santiago, Juan G.; Everett, Jr., George Carl, Power conditioning module.
  25. Belady, Christian L.; Harris, Shaun L.; Williams, Gary Wayne; Boudreaux, Brent A., Power module for multi-chip printed circuit boards.
  26. Hartke, David H.; DiBene, II, J. Ted, Right-angle power interconnect electronic packaging assembly.
  27. Chen, Chin-Ping, Semi-closed air cooling type radiator.
  28. Dibene, II, Joseph Ted; Hartke, David H.; Hoge, Carl E.; Derian, Edward J., System and method for processor power delivery and thermal management.
  29. Kenny, Jr., Thomas William; Goodson, Kenneth E.; Santiago, Juan G.; Kim, John J.; Chaplinsky, Robert C.; Everett, Jr., George Carl, System including power conditioning modules.
  30. Schuetze,Karl T.; Weaver,Matthew D., Systems and methods for controlling pressure of fluids.
  31. Schuetze, Karl T.; Hudson, Robert S., Systems and methods for controlling temperature and pressure of fluids.
  32. Crocker, Michael T.; Carter, Daniel P.; Kozyra, Kazimierz L., Systems for integrated pump and reservoir.
  33. Faneuf,Barrett; Aldridge,Tomm, Systems to cool multiple electrical components.
  34. Pfahnl,Andreas C.; Griffith,Peter, Thermally enhanced pressure regulation of electronics cooling system.
  35. Dibene, II, Joseph Ted; Hartke, David H.; Hoge, Carl E.; Derian, Edward J., Ultra-low impedance power interconnection system for electronic packages.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로