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특허 상세정보

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내보내기 페이스북 공유 카카오톡 공유

Seepage system for an injection molding apparatus

특허상세정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) B29C-045/22   
미국특허분류(USC) 425/215 ; 425/564 ; 425/566 ; 425/572
출원번호 US-0322573 (1999-05-28)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    McDonnell Boehnen Hulbert & BerghoffSullivan
인용정보 피인용 횟수 : 3  인용 특허 : 100
초록
▼

A seepage system for an injection molding apparatus includes a manifold plate with a first portion and a second portion abutting the first portion, and a seepage passage positioned between the first and second portions. The second portion may have at least a portion of a melt passage, and the seepage passage may have an outlet. The seepage system also has one or more seepage channels, with each seepage channel being connected to and in communication with the seepage passage. Moreover, the seepage system includes one or more seepage bores for receiving th...

대표
청구항

[What is claimed is:] [1.]a manifold plate having at least a first portion and a second portion adjacent the first portion;a seepage passage positioned between the first and second portions;a plurality of seepage channels, each seepage channel being connected to and in communication with the seepage passage; anda plurality of seepage bores for receiving flow of excess material, each seepage bore being connected to and in communication with one of the seepage channels.

이 특허에 인용된 특허 (100)

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이 특허를 인용한 특허 피인용횟수: 3

  1. Serniuck,Nicholas; Knapp,John; Bouti,Abdeslam; Jenko,Edward J.. Hot runner manifold system. USP2007107287977.
  2. Zoppas, Matteo; Rossi, Massimo; Pilat, Loris; Bazzo, Andrea. Injection system having a closing rod provided with a cleaning device. USP2010117841856.
  3. Tabassi,Payman. Valve pin bushing with vent channels for an injection molding apparatus. USP2008087407380.

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