초록 ▼

A process for drying semiconductor wafers includes loading a wafer wetted with rinsing fluid into a rotor and orientating the wafer along a substantially vertical plane. A gas saturated with a solvent vapor is passed over the wafer surfaces until condensation forms on the wafer and displaces residua

A process for drying semiconductor wafers includes loading a wafer wetted with rinsing fluid into a rotor and orientating the wafer along a substantially vertical plane. A gas saturated with a solvent vapor is passed over the wafer surfaces until condensation forms on the wafer and displaces residual fluid. The rotation of the wafer by the rotor at a first rotation speed to aids the flushing and displacement of residual fluid. The passage of a dry gas over the wafer combined with the rotation of the wafer at a second rotation speed promotes drying of solvent condensed on the wafer. The first rotation speed is limited to a rate that does not cause the condensed solvent film to evaporate as quickly as it forms. The second rotation speed may exceed that of the first rotation speed to complete the drying of the wafer. The rotor and process chamber are optionally pre-saturated with condensed solvent vapor prior to the introduction of a wafer to hasten the drying process. The process is suitable for quickly and cleanly drying patterned wafers having both hydrophobic and hydrophilic surfaces.

대표청구항 ▼

[What is claimed is:] [1.]placing the wafer in a rotor and orienting the at least one surface in a substantially vertical plane;rotating the wafer with the rotor at a first rotation speed;passing a saturated vapor over the wafer to condense the vapor into condensate on the surfaces of the wafer;rota

[What is claimed is:] [1.]placing the wafer in a rotor and orienting the at least one surface in a substantially vertical plane;rotating the wafer with the rotor at a first rotation speed;passing a saturated vapor over the wafer to condense the vapor into condensate on the surfaces of the wafer;rotating the wafer affixed to the rotor at a second rotation speed to remove the bulk of the condensate from the surfaces of the wafer; andpassing a dry gas over the wafer.