초록 ▼

The present invention provides an apparatus (200) that includes a heat-generating component (202) and a heat-dissipating apparatus (120). The heat-generating component (202) is mounted on a substrate (204). The heat-dissipating apparatus (120) includes a housing piece (100) that includes a sealed ch

The present invention provides an apparatus (200) that includes a heat-generating component (202) and a heat-dissipating apparatus (120). The heat-generating component (202) is mounted on a substrate (204). The heat-dissipating apparatus (120) includes a housing piece (100) that includes a sealed chamber (102) and a phase change material (106) disposed within the sealed chamber (102). The heat-dissipating apparatus (120) is thermally coupled to the heat-generating component (202) and provides for heat dissipation by an endothermic process of changing phase from solid to liquid, thereby lowering the operating temperature of the heat-generating component (202).

대표청구항 ▼

[We claim:] [1.]providing a housing piece with a cavity therein;dispensing a phase change material into the cavity;placing a lid piece on the housing piece, the lid piece formed of a conformable material and enclosing the phase change material within the cavity;sealing the cavity by attaching the li

[We claim:] [1.]providing a housing piece with a cavity therein;dispensing a phase change material into the cavity;placing a lid piece on the housing piece, the lid piece formed of a conformable material and enclosing the phase change material within the cavity;sealing the cavity by attaching the lid piece to the housing piece; andimpressing a heat-generating electronic component in a recess of the lid piece such that the heat-generating electronic component is at least partial surrounded by the phase change material and is thermally-coupled to the phase change material by the lid piece.