초록 ▼

An integrated circuit (IC) die carrier assembly includes a thinned IC die mounted to a substrate or carrier. The IC die is mounted to the carrier via a thin layer of glass. The carrier facilitates fixturing and provides support during the lapping process used to thin the die. Ball bonding, wire bond

An integrated circuit (IC) die carrier assembly includes a thinned IC die mounted to a substrate or carrier. The IC die is mounted to the carrier via a thin layer of glass. The carrier facilitates fixturing and provides support during the lapping process used to thin the die. Ball bonding, wire bonding, thin film or thick film conductors can be used to interconnect the pads on the IC die to the pads on the carrier. The coefficients of the thermal expansion of the IC die and the carrier are closely matched to avoid damage to the IC die due to uneven expansion of the thinned IC die relative to the carrier. The IC die carrier assembly is better suited for ultrahigh vacuum and high temperature environments than conventional IC die carrier assemblies.

대표청구항 ▼

[What is claimed is:] [1.]A) attaching ball bonding balls to conductive pads on a first side of said integrated circuit die;B) applying a electrical non-conductive a mounting material to said first side of said integrated circuit die, said mounting material being substantially unsusceptible to outga

[What is claimed is:] [1.]A) attaching ball bonding balls to conductive pads on a first side of said integrated circuit die;B) applying a electrical non-conductive a mounting material to said first side of said integrated circuit die, said mounting material being substantially unsusceptible to outgassing in ultrahigh vacuum environments at temperatures at least up to about 900 degrees C.;C) registering said bonding balls attached to said first side of said integrated circuit die with conductive pads on a first side of said carrier; andD) under controlled temperature conditions, applying pressure to join said integrated circuit die and said carrier.