$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Wiring board and process for the production thereof 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-003/22
  • H05K-003/28
출원번호 US-0221124 (1998-12-28)
우선권정보 JP0368035 (1997-12-27)
발명자 / 주소
  • Gotoh Masashi,JPX
  • Kanazawa Jitsuo,JPX
  • Yamamoto Syuichiro,JPX
출원인 / 주소
  • TDK Corporation, JPX
대리인 / 주소
    Oblon, Spivak, McClelland, Maier & Neustadt, P.C
인용정보 피인용 횟수 : 51  인용 특허 : 8

초록 ▼

A wiring board having a conductor layer formed on a substrate and a connecting pad disposed in a connecting pad disposition portion provided in part of the conductor layer surface, the conductor layer having a resin inflow prevention portion which is provided adjacently to the said connecting pad di

대표청구항

[What is claimed is:] [1.]

이 특허에 인용된 특허 (8)

  1. Asai Motoo,JPX ; Onishi Chie,JPX, Adhesive for printed circuit board.
    상세보기
  2. Fukuda Makoto (Shibukawa JPX) Yonemura Naomi (Shibukawa JPX) Watanabe Chiharu (Shibukawa JPX), Circuit substrate for mounting a semiconductor element.
    상세보기
  3. Hayakawa Masao (Kyoto JPX) Maeda Takamichi (Nara JPX) Kumura Masao (Nara JPX), Lead electrode structure for a semiconductor chip carried on a flexible carrier.
    상세보기
  4. Taylor Edward (Agoura Hills CA), Mechanical locking between multi-layer printed wiring board conductors and through-hole plating.
    상세보기
  5. Tomura Yoshihiro (Hirakata JPX) Bessho Yoshihiro (Higashiosaka JPX), Method of forming a bump having a rugged side, a semiconductor device having the bump, and a method of mounting a semico.
    상세보기
  6. Sechi Franco N. (Lawrenceville NJ), Microwave power circuit with an active device mounted on a heat dissipating substrate.
    상세보기
  7. Glenn Thomas P., Mounting having an aperture cover with adhesive locking feature for flip chip optical integrated circuit device.
    상세보기
  8. Takenaka Takeshi (Kawasaki JPX) Hamano Toshio (Kawasaki JPX) Saito Takekiyo (Yokohama JPX), Semiconductor device having improved adhesive structure and method of producing same.
    상세보기

이 특허를 인용한 특허 (51)

  1. Yu,Hsiu Mei; Huang,Gil; Yu,Chien Tung; Chen,Owen, Cavity structure for semiconductor structures.
    상세보기
  2. Yoshioka, Shingo; Fujiwara, Hiroaki; Takashita, Hiromitsu; Takeda, Tsuyoshi, Circuit board.
    상세보기
  3. Kohara, Yasuhiro; Shibata, Kiyoshi; Nagamatsu, Masayuki; Usui, Ryosuke; Shimizu, Toshiya, Circuit board and circuit device.
    상세보기
  4. Yoshioka, Shingo; Fujiwara, Hiroaki; Takashita, Hiromitsu; Takeda, Tsuyoshi, Circuit board, and semiconductor device having component mounted on circuit board.
    상세보기
  5. Kazuyoshi Amami JP; Hiroaki Takezawa JP; Tsukasa Shiraishi JP; Yoshihiro Bessho JP, Electrical mounting structure having an elution preventive film.
    상세보기
  6. Kozuki, Atsushi, Electronic device and method for manufacturing electronic device.
    상세보기
  7. Watanabe, Hirohito, Flexible printed circuit and method of manufacturing same.
    상세보기
  8. Tanabe, Nobuo; Okada, Kenichi; Kurosawa, Yukihiko; Imai, Takayuki; Jumonji, Sadamitsu; Arai, Masahiko; Kaizu, Masahiro, Flexible printed circuit board.
    상세보기
  9. Kai,Kenzo; Nakamura,Kaoru; Morikawa,Kazunori, Foil seal lamp.
    상세보기
  10. Chiu, Wen-Wen, IC chip package.
    상세보기
  11. Chiu, Wen-Wen, IC chip package.
    상세보기
  12. Knickerbocker,John U.; Markovich,Voya R.; Miller,Thomas R.; Rudik,William J., Method and structure for an organic package with improved BGA life.
    상세보기
  13. Asai, Motoo; Hiramatsu, Yasuji, Method for manufacturing printed wiring board.
    상세보기
  14. Uchikoba, Fumio, Method for manufacturing radio frequency module components with surface acoustic wave element.
    상세보기
  15. Knickerbocker, John U.; Markovich, Voya R.; Miller, Thomas R.; Rudik, William J., Method of fabricating a BGA package having decreased adhesion.
    상세보기
  16. Park, Ji-hyun; Kwon, Heungkyu; Na, Min-Ok; Kim, Taehwan, Method of forming a semiconductor package.
    상세보기
  17. Yoshioka, Shingo; Fujiwara, Hiroaki, Method of producing multilayer circuit board.
    상세보기
  18. Roy V. Buck, Jr., Microelectronic-device assemblies and methods that exclude extraneous elements from sensitive areas.
    상세보기
  19. Katou, Masahiro; Koshikawa, Yasuyuki; Wada, Hiroshi, Multilayer wiring board.
    상세보기
  20. Ito, Sotaro; Takahashi, Michimasa; Mikado, Yukinobu, Multilayer wiring board with concave portion for accomodating electronic component.
    상세보기
  21. Minamio, Masanori; Nishio, Tetsushi, Optical device.
    상세보기
  22. Ogura, Seiichiro; Kikuchi, Takayuki, Package and vibrating device using the same.
    상세보기
  23. Bang, Ick Jong; Kwag, Jung Young, Printed circuit board, and board block for vehicles using the same.
    상세보기
  24. Wakihara, Yoshinori; Yamada, Kazuhito, Printed circuit boards and method of producing the same.
    상세보기
  25. Wakihara,Yoshinori; Yamada,Kazuhito, Printed circuit boards and method of producing the same.
    상세보기
  26. Kawamura, Yoichiro; Sawa, Shigeki; Tanno, Katsuhiko; Tanaka, Hironori; Fujii, Naoaki, Printed wiring board.
    상세보기
  27. Tsukada,Kiyotaka; Iwata,Toshimasa; Ninomaru,Terumasa; Sugiura,Takamichi, Printed wiring board.
    상세보기
  28. Asai, Motoo; Hiramatsu, Yasuji, Printed wiring board and method for manufacturing the same.
    상세보기
  29. Asai, Motoo; Hiramatsu, Yasuji; Wakihara, Yoshinori; Yamada, Kazuhito, Printed wiring board and method for manufacturing the same.
    상세보기
  30. Asai, Motoo; Hiramatsu, Yasuji; Wakihara, Yoshinori; Yamada, Kazuhito, Printed wiring board and method for manufacturing the same.
    상세보기
  31. Asai,Motoo, Printed wiring board and method for manufacturing the same.
    상세보기
  32. Asai,Motoo; Hiramatsu,Yasuji, Printed wiring board and method for manufacturing the same.
    상세보기
  33. Asai,Motoo; Hiramatsu,Yasuji, Printed wiring board and method for manufacturing the same.
    상세보기
  34. Wakihara, Yoshinori; Yamada, Kazuhito, Printed wiring board and method for manufacturing the same.
    상세보기
  35. Wakihara,Yoshinori; Yamada,Kazuhito, Printed wiring board and method for manufacturing the same.
    상세보기
  36. Yukio Yamada JP, Process for mounting semiconductor device and mounting apparatus.
    상세보기
  37. Higashi, Mitsutoshi, Production methods of electronic devices.
    상세보기
  38. Day, Richard Allen; Knadle, Kevin Taylor; Stauffer, Kristen Ann, Selectively roughening conductors for high frequency printed wiring boards.
    상세보기
  39. Day,Richard Allen; Knadle,Kevin Taylor; Stauffer,Kristen Ann, Selectively roughening conductors for high frequency printed wiring boards.
    상세보기
  40. Iijima, Makoto; Ueno, Seiji; Igawa, Osamu, Semiconductor device.
    상세보기
  41. Kim, Shin; Chung, Tae-Gyeong; Kim, Nam-Seog; Lee, Woo-Dong; Lee, Jin-Hyuk, Semiconductor device bonding pad resistant to stress and method of fabricating the same.
    상세보기
  42. Kumatani, Yoshiro, Semiconductor device having adhesive inflow preventing means.
    상세보기
  43. Liu, Hao-Juin; Chuang, Chita; Kuo, Chen-Cheng; Chen, Chen-Shien, Semiconductor device package and method.
    상세보기
  44. Ihara, Takumi, Semiconductor device, electronic device and method for fabricating the semiconductor device.
    상세보기
  45. Tomura, Yoshihiro; Shimizu, Kazumichi; Kumazawa, Kentaro, Semiconductor device, flip-chip mounting method and flip-chip mounting apparatus.
    상세보기
  46. Park, Ji-hyun; Kwon, Heungkyu; Na, Min-Ok; Kim, Taehwan, Semiconductor package and method of manufacturing the same.
    상세보기
  47. Ono, Koji, Solid-state image pickup device.
    상세보기
  48. Bregante, Raymond S.; Shaffer, Tony; Mellen, K. Scott; Ross, Richard J., Use of diverse materials in air-cavity packaging of electronic devices.
    상세보기
  49. Chang, Chi-Heng; Cheng, Chan-Yi; Wu, Chen-Tun, Waterproof structure for implanted electronic device.
    상세보기
  50. Chang, Chi-Heng; Cheng, Chan-Yi; Wu, Chen-Tun, Waterproof structure for implanted electronic device.
    상세보기
  51. Takeuchi, Hiroki; Kojima, Toshifumi; Obayashi, Kazushige, Wiring circuit board and method for producing same.
    상세보기

관련 콘텐츠

섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로