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Apparatus for managing heat in a computer environment or the like 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
  • H01L-023/427
출원번호 US-0917914 (1997-08-27)
발명자 / 주소
  • Bhatia Rakesh
  • Padilla Robert D.
출원인 / 주소
  • Intel Corporation
대리인 / 주소
    Kenyon & Kenyon
인용정보 피인용 횟수 : 14  인용 특허 : 22

초록

To manage heat in a computer environment or the like, a base plate and/or a input/output (I/O) plate includes an integrated heat pipe. For example, the base plate, located between a bottom surface of a laptop computer chassis and a printed circuit board (PCB) or motherboard would include a heat-pipe

대표청구항

[What is claimed is:] [1.]an input/output plate for a computer system, wherein said input/output plate includes at least one opening, and wherein said input/output plate forms an integrated heat pipe.

이 특허에 인용된 특허 (22)

  1. Sato Youji (Yokohama JPX) Nakajima Yuji (Tokyo JPX) Taki Kinji (Tokyo JPX) Konno Toshikazu (Tokyo JPX), Compact electronic apparatus and method of assembling the same.
  2. Sato Youji (Yokohama JPX) Nakajima Yuji (Tokyo JPX) Taki Kinji (Tokyo JPX) Konno Toshikazu (Tokyo JPX), Compact electronic apparatus and method of assembling the same.
  3. Sato Youji (Yokohama JPX) Nakajima Yuji (Tokyo JPX) Taki Kinji (Tokyo JPX) Konno Toshikazu (Tokyo JPX), Compact electronic apparatus and method of assembling the same.
  4. Webb Matthew L., Computer having a heat sink structure incorporated therein.
  5. Penniman Mark B. ; Schlesener Carmen M. ; Kizer Jim J., Computer having a heat transfer system operably connected during assembly of a computer keyboard upon the computer.
  6. Conte Alfred S. (Hollister CA), Cooling multi-chip modules using embedded heat pipes.
  7. Xie Hong (Chandler AZ) Aghazadeh Mostafa (Chandler AZ) Turturro Gregory (Chandler AZ) Chiu Chia-Pin (Chandler AZ), Dissipation of heat through keyboard using a heat pipe.
  8. Meyer ; IV George A. (Conestoga PA) Garner Scott D. (Lititz PA), Electrically insulated envelope heat pipe.
  9. Oyamada Takashi,JPX, Electronic device having a plug-in unit with a heat sink structure.
  10. Honda Masami (Tokyo JPX) Takada Masaaki (Tokyo JPX) Miura Yousuke (Tokyo JPX), Electronic device having detachable keyboard clamped by a rotatable display when closed over the keyboard.
  11. Garner Scott D. ; Toth Jerome E., Heat dissipating computer case having oriented fibers and heat pipe.
  12. McCready Raymond George (South Bend IN) Eggers Philip Eugene (Worthington OH), Heat pipe cooling system for electronic devices.
  13. Garner Scott D. ; Meyer ; IV George A. ; Toth Jerome E. ; Longsderff Richard W., Heat pipes inserted into first and second parallel holes in a block for transferring heat between hinged devices.
  14. Furukawa Yuichi,JPX ; Sumitani Mitsugu,JPX ; Ito Tomio,JPX, Heat sink for portable electronic devices.
  15. Carlsten Ronald W. (Tucson AZ) Kim Sung J. (Tucson AZ) Murphy Alan L. (Tucson AZ), Integrated heat pipe and circuit board structure.
  16. Gutfeldt Theodor A. ; Clausen Bryan L. ; Patel Sarosh M., Liquid cooling apparatus for use with electronic equipment.
  17. Kimura Yuichi,JPX ; Yamamoto Masaaki,JPX ; Tanaka Suemi,JPX, Method for manufacturing cooling unit comprising heat pipes and cooling unit.
  18. Galyon George Tipton ; Kemink Randall Gail ; Schmidt Roger Ray, Method of cooling electronic devices using a tube in plate heat sink.
  19. Toedtman Thomas (Lake Forest CA) Welch Randall S. (Lake Forest CA), Rotable and slideble heat pipe apparatus for reducing heat build up in electronic devices.
  20. Nakamura Hiroshi (Tokyo JPX) Tomioka Kentaro (Sagamihara JPX) Ninomiya Kiyoumi (Tokyo JPX) Ogawa Hideki (Tokyo JPX) Nakajima Yuji (Tokyo JPX), Structure for cooling a circuit module having a circuit board and a heat-generating IC chip mounted on the board, and po.
  21. Larson Ralph I. (Bolton MA) Phillips Richard J. (Alachua FL) Beane Alan F. (Gilford NH), Two-phase cooling system for a laptop computer lid.
  22. Larson Ralph I. (Bolton MA) Phillips Richard L. (Alachua FL) Beane Alan F. (Gilford NH), Two-phase cooling system for laptop computers.

이 특허를 인용한 특허 (14)

  1. Craig G. Heim ; Wade Leslie Hooker ; Ajit Kumar Trivedi, Cooling method for electronic components.
  2. Lee, Sung-Ae, Display assembly for refrigerator.
  3. Willets,Julie A.; Meyers,Gerald D.; Johnson,Larry L., Fuel cell system with inverter and phase change material.
  4. Chandrakant D. Patel ; Marvin S. Keshner, Heat dissipating chassis member.
  5. Huang, Chiu-Mao; Huang, Chang-Moou, Heat dissipation arrangement for communication chassis.
  6. Merz, Nicholas G.; DiFonzo, John C.; Zadesky, Stephen P.; Prichard, Michael J., Heat dissipation in computing device.
  7. Merz, Nicholas G.; Difonzo, John C.; Zadesky, Stephen P.; Prichard, Michael J., Heat dissipation in computing device.
  8. Merz, Nick; DiFonzo, John; Zadesky, Stephen; Prichard, Michael, Heat dissipation in computing device.
  9. Yang, Sophia S.; Jacobsen, Alan J., Micro-truss materials having in-plane material property variations.
  10. Carter, William B.; Gross, Adam F.; Guinn, Keith V.; Jacobsen, Alan J.; Kisailus, David, Microtruss based thermal heat spreading structures.
  11. Carter, William B.; Brewer, Peter D.; Gross, Adam F.; Rogers, Jeffrey L.; Guinn, Keith V.; Jacobsen, Alan J., Microtruss based thermal plane structures and microelectronics and printed wiring board embodiments.
  12. Hasegawa, Tsuyoshi, Semiconductor package.
  13. Hasegawa, Tsuyoshi, Semiconductor package.
  14. Nguyen, Sean; Duncan, Gary L.; Drolen, Bruce L.; Bowden, David M., Thermal management device and method for making the same.
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