초록 ▼

A peripherally encapsulated unit is manufactured by molding a peripheral encapsulation of a predetermined internal peripheral contour and internal peripheral size from hot polymeric material in a mold. The mold is opened and a member is positioned in internal relationship to the hot molded periphera

A peripherally encapsulated unit is manufactured by molding a peripheral encapsulation of a predetermined internal peripheral contour and internal peripheral size from hot polymeric material in a mold. The mold is opened and a member is positioned in internal relationship to the hot molded peripheral encapsulation. Thereafter, the hot molded peripheral encapsulation shrinks as it cools to reduce its internal peripheral size thereby unitizing the peripheral encapsulation with a peripheral edge portion of the member to form a peripherally encapsulated unit, such as a cook top, range door, "touch" control panel, or the like.

대표청구항 ▼

[What is claimed:] [1.](a) injection molding a peripheral encapsulation in a closed mold, with the peripheral encapsulation being of a predetermined internal peripheral contour and internal peripheral size, from hot polymeric material with the peripheral encapsulation including at least one inwardly

[What is claimed:] [1.](a) injection molding a peripheral encapsulation in a closed mold, with the peripheral encapsulation being of a predetermined internal peripheral contour and internal peripheral size, from hot polymeric material with the peripheral encapsulation including at least one inwardly opening channel;(b) after performing step (a), at least partially opening the mold and relatively positioning a member in internal relationship to the hot molded peripheral encapsulation,(c) shrinking the hot peripheral encapsulation sufficiently to bring the inwardly opening channel into embracing relationship with a peripheral edge portion of the member by cooling the encapsulation to reduce the internal peripheral size thereof to thereby unitize the member and peripheral encapsulation into a peripherally encapsulated unit, and(d) thereafter removing the encapsulated unit from the mold.