초록 ▼

A d.c. motor together with a hot gas bypass valve is incorporated into a cooling system specifically designed for removing heat from a computer system. Unlike typical refrigeration systems, the cooling system herein runs continuously and responds to changes in thermal load. This allows the unit to o

A d.c. motor together with a hot gas bypass valve is incorporated into a cooling system specifically designed for removing heat from a computer system. Unlike typical refrigeration systems, the cooling system herein runs continuously and responds to changes in thermal load. This allows the unit to operate within a wide range of ambient conditions and at various thermal load levels unlike other systems which were capable of operation only at a single, pre-designed load level. The cooling system is modular and is easily added to or removed from a redundant system which includes a single evaporator with multiple refrigerant loops which provides yet another aspect of continuous operation due to the inherent redundancy thus provided. In one embodiment, the cooling system includes a refrigeration cooled cold plate thermally coupled to an electronic module of a computer system, and an auxiliary air cooled heat sink thermally coupled to the refrigeration cooled cold plate.

대표청구항 ▼

[ What is claimed is:] [1.]1. A cooling system for an electronic module of a computer system having at least one other component, said cooling system comprising:a refrigeration cooled cold plate thermally coupled to said electronic module for removing heat generated by the electronic module via circ

[ What is claimed is:] [1.]1. A cooling system for an electronic module of a computer system having at least one other component, said cooling system comprising:a refrigeration cooled cold plate thermally coupled to said electronic module for removing heat generated by the electronic module via circulation fluid passing through said refrigeration cooled cold plate;an auxiliary air flow heat sink thermally coupled to said electronic module, said auxiliary air flow heat sink comprising supplementary cooling for said electronic module upon failure of said refrigeration cooled cold plate thermally coupled to said electronic module; andwherein when said refrigeration cooled cold plate is operational, air flow across said auxiliary air flow heat sink is cooled by said refrigeration cooled cold plate thermally coupled to said electronic module, and wherein said cooled air flow operates to cool said at least one other component of said computer system.