초록 ▼

A semiconductor substrate, a thin film semiconductor device, a manufacturing method thereof and an anodizing apparatus which can reduce the manufacturing cost and save the resources are provided. According to this invention, a semiconductor thin film is formed through a separation layer of a porous

A semiconductor substrate, a thin film semiconductor device, a manufacturing method thereof and an anodizing apparatus which can reduce the manufacturing cost and save the resources are provided. According to this invention, a semiconductor thin film is formed through a separation layer of a porous semiconductor on a substrate body of sapphire; the semiconductor thin film is separated from the porosity layer and used for a thin film semiconductor device; and the substrate body from which the semiconductor thin film is separated is used again after the separation layer attached thereto is removed by etching. Since sapphire has high strength, high rigidity, high resistance to wearing, high heat resistance, high abrasion resistance and high chemicals resistance, no deterioration and no damage occur even when the substrate body is repetitively used. Thus, the recycle frequency can be increased, and the reduction of the manufacturing cost and the saving of the resources can be promoted.

대표청구항 ▼

[ What is claimed is:] [1.]1. A method of separating a semiconductor film comprising the steps of:forming a first semiconductor layer on a sapphire substrate, the first semiconductor layer comprising a first layer having a first impurity concentration and a second layer having a second impurity conc

[ What is claimed is:] [1.]1. A method of separating a semiconductor film comprising the steps of:forming a first semiconductor layer on a sapphire substrate, the first semiconductor layer comprising a first layer having a first impurity concentration and a second layer having a second impurity concentration higher than said first impurity concentration;anodizing said first semiconductor layer so as to convert said first layer into a first porous layer having a first porosity and said second layer into a second porous layer having a second porosity higher than said first porosity;forming a second semiconductor layer on said first semiconductor layer; andseparating said second semiconductor layer from said sapphire substrate.