초록 ▼

The present disclosure pertains to a method for making a hermetically sealed package which includes a housing, a lid and a feedthrough for at least one stripped fiber. The method includes the following steps: 1) placing at least one optical fiber and at least one solder preform between the sealing s

The present disclosure pertains to a method for making a hermetically sealed package which includes a housing, a lid and a feedthrough for at least one stripped fiber. The method includes the following steps: 1) placing at least one optical fiber and at least one solder preform between the sealing surface of the lid and the sealing surface of the housing; and 2) sealing the assembly by applying pressure and heat so as to press the fiber (or fibers) into the solder.

대표청구항 ▼

[ What is claimed is:] [1.]1. A method for making a hermetically sealed package, which package comprises a housing, a lid, and a feedthrough for at least one stripped optical (fiber) fiber, wherein the method comprises the steps of:placing at least one optical fiber between a sealing surface of the

[ What is claimed is:] [1.]1. A method for making a hermetically sealed package, which package comprises a housing, a lid, and a feedthrough for at least one stripped optical (fiber) fiber, wherein the method comprises the steps of:placing at least one optical fiber between a sealing surface of the lid and a sealing surface of the housing along with a first solder preform between the at least one fiber and the sealing surface of the housing and a second solder preform between the at least one fiber and the sealing surface of the lid; andsealing the assembly and forming the hermetically sealed fiber feedthrough by applying pressure and heat so as to press the at least one fiber into the solder; and wherein said solder preforms provide solder which forms a hermetic seal completely surrounding the at least one fiber and filling an adjacent space between the housing and the lid.