초록 ▼

A robust optoelectronic transceiver module which provides for static discharge and is quick, easy, and inexpensive to manufacture. The transceiver module has a main housing which consists of a potting box with potting material inserted therein. In addition, a circuit board is encased by the potting

A robust optoelectronic transceiver module which provides for static discharge and is quick, easy, and inexpensive to manufacture. The transceiver module has a main housing which consists of a potting box with potting material inserted therein. In addition, a circuit board is encased by the potting material. The circuit board has an optical subassembly mounted thereon. The optical subassembly extends outside of the potting box through a recess. Correspondingly, a recess cover is provided for forming a liquid tight seal between the recess cover, the potting box, and the optical subassembly. Furthermore, the module provides electrically conductive latches which are conductively connected, via tabs for forming an electrical connection, to a grounded structure, such as a computer chassis.

대표청구항 ▼

[ We claim:] [1.]1. An electromagnetically shielded host system comprising:a grounded chassis including a metallic faceplate having a rectangular connector port; andan optoelectronic module mounted in said at least one connector port so that a gap is provided between the module and the faceplate, th

[ We claim:] [1.]1. An electromagnetically shielded host system comprising:a grounded chassis including a metallic faceplate having a rectangular connector port; andan optoelectronic module mounted in said at least one connector port so that a gap is provided between the module and the faceplate, the module including a first end having at least one rectangular duplex metallic optical connector, the module including a second end having electrical contacts protruding therefrom to connect the module to a motherboard and wherein a compliant grounding member is adapted to resiliently occupy the gap and provide mechanical and electrical connection to the faceplate of the chassis so that a portion of the module can achieve a ground potential approximately equal to that of the faceplate in order to enhance electromagnetic shielding and to reduce electromagnetic radiation from leaking from the host system.