초록 ▼

An automatic breadmaker with improved thermal sensing, wiring, and a simplified assembly procedure. The breadmaker preferably includes a high voltage circuit board coupled to an interior wall of the breadmaker, the interior wall separating the baking chamber of the breadmaker from a component compar

An automatic breadmaker with improved thermal sensing, wiring, and a simplified assembly procedure. The breadmaker preferably includes a high voltage circuit board coupled to an interior wall of the breadmaker, the interior wall separating the baking chamber of the breadmaker from a component compartment. One or more thermal control devices electrically connected to the high voltage circuit board are disposed in a heat transfer relationship with the interior wall, thereby improving device accuracy and avoiding the need for leads to the thermal control devices. In the most preferred embodiment of the present invention, the high voltage circuit board is coupled to the interior wall via a component mounting bracket which also holds the thermal control devices against the interior wall. Preferably, the breadmaker also has a low voltage circuit board connected to the high voltage circuit board via low voltage leads, thereby providing additional safety for users operating a control panel near the low voltage circuit board. In this case, the high voltage circuit board is a power board supplying power to the various breadmaker components, such as the motor, heater, and fan, and the low voltage circuit board is a logic circuit controlling breadmaker operations and being receptive to commands received from a user via the control panel. The high voltage circuit board and the thermal control devices can be pre-assembled in a single assembly for insertion into the breadmaker, thereby decreasing assembly time and cost.

대표청구항 ▼

[ We claim:] [1.]1. A method for mounting a circuit board assembly in a bread maker, the bread maker including an oven liner having a sidewall, the method comprising the steps of:mounting at least one thermal component on a circuit board to form the circuit board assembly;coupling a component mounti

[ We claim:] [1.]1. A method for mounting a circuit board assembly in a bread maker, the bread maker including an oven liner having a sidewall, the method comprising the steps of:mounting at least one thermal component on a circuit board to form the circuit board assembly;coupling a component mounting bracket to the circuit board assembly; andsecuring the component mounting bracket to the sidewall, wherein the at least one thermal component is disposed in thermal transfer relation with the sidewall via the component mounting bracket.