Method and apparatus for monitoring plasma processing operations
United States(US) Patent
Jr. Michael Lane
Stevenson Joel O'Don
Ward Pamela Peardon Denise
출원인 / 주소
대리인 / 주소
Marsh, Fischmann & Breyfogle LLP
피인용 횟수 :
8인용 특허 :
The invention generally relates to various aspects of a plasma process, and more specifically the monitoring of such plasma processes. One aspect relates in at least some manner to calibrating or initializing a plasma monitoring assembly. This type of calibration may be used to address wavelength sh
The invention generally relates to various aspects of a plasma process, and more specifically the monitoring of such plasma processes. One aspect relates in at least some manner to calibrating or initializing a plasma monitoring assembly. This type of calibration may be used to address wavelength shifts, intensity shifts, or both associated with optical emissions data obtained on a plasma process. A calibration light may be directed at a window through which optical emissions data is being obtained to determine the effect, if any, that the inner surface of the window is having on the optical emissions data being obtained therethrough, the operation of the optical emissions data gathering device, or both. Another aspect relates in at least some manner to various types of evaluations which may be undertaken of a plasma process which was run, and more typically one which is currently being run, within the processing chamber. Plasma health evaluations and process identification through optical emissions analysis are included in this aspect. Yet another aspect associated with the present invention relates in at least some manner to the endpoint of a plasma process (e.g., plasma recipe, plasma clean, conditioning wafer operation) or discrete/discernible portion thereof (e.g., a plasma step of a multiple step plasma recipe). A final aspect associated with the present invention relates to how one or more of the above-noted aspects may be implemented into a semiconductor fabrication facility, such as the distribution of wafers to a wafer production system.
[ What is claimed is:] [1.]1. A method for preparing a processing chamber for running a plasma recipe on product when loaded in said chamber, said method comprising the steps of:plasma cleaning an interior of said processing chamber with a plasma, wherein said plasma cleaning step is executed when s
[ What is claimed is:] [1.]1. A method for preparing a processing chamber for running a plasma recipe on product when loaded in said chamber, said method comprising the steps of:plasma cleaning an interior of said processing chamber with a plasma, wherein said plasma cleaning step is executed when said processing chamber is empty;obtaining optical emissions of said plasma within said processing chamber at least a plurality of times during said plasma cleaning step, wherein said obtaining step comprises obtaining an optical emissions segment of said plasma in said processing chamber at each of said plurality of times, wherein each said optical emissions segment comprises optical emissions which includes at least wavelengths from about 250 nanometers to about 1,000 nanometers, inclusive, which defines a first wavelength range, and at a first wavelength resolution throughout said first wavelength range, wherein said first wavelength resolution is defined as a wavelength spacing between each adjacent pair of wavelengths throughout said first wavelength range, and wherein said first wavelength resolution is no more than about 1 nanometer;comparing a pattern of each of a plurality of said optical emissions segments from said obtaining step with a first standard pattern which is stored on a computer-readable storage medium;monitoring said comparing step for a first condition, wherein said first condition is when said pattern of at least one of said optical emissions segments from said comparing step matches said first standard pattern and which is equated with an endpoint of said plasma cleaning step; andterminating said plasma cleaning step if said monitoring step identifies said first condition.
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