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Method and apparatus for monitoring plasma processing operations 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B08B-007/04
출원번호 US-0065195 (1998-04-23)
발명자 / 주소
  • Smith
  • Jr. Michael Lane
  • Stevenson Joel O'Don
  • Ward Pamela Peardon Denise
출원인 / 주소
  • Sandia Corporation
대리인 / 주소
    Marsh, Fischmann & Breyfogle LLP
인용정보 피인용 횟수 : 8  인용 특허 : 70

초록

The invention generally relates to various aspects of a plasma process, and more specifically the monitoring of such plasma processes. One aspect relates in at least some manner to calibrating or initializing a plasma monitoring assembly. This type of calibration may be used to address wavelength sh

대표청구항

[ What is claimed is:] [1.]1. A method for preparing a processing chamber for running a plasma recipe on product when loaded in said chamber, said method comprising the steps of:plasma cleaning an interior of said processing chamber with a plasma, wherein said plasma cleaning step is executed when s

이 특허에 인용된 특허 (70)

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  5. Mundt Randall S. (Pleasanton CA), Apparatus and method for mapping plasma characteristics.
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  10. Bellows James C. (Maitland FL) Barton Serge P. (Oviedo FL), Automated rotor welding processes using neural networks.
  11. Davis Cecil J. (Greenville TX) Spencer John E. (Plano TX) Hockersmith Dan T. (Garland TX) Hildenbrand Randall C. (Richardson TX) Brown Frederick W. (Colleyville TX) Kohan Stanford P. (Garland TX), Automated single slice powered load lock plasma reactor.
  12. Au Whitlow W. L. (Kailua HI) Martin Douglas W. (San Diego CA), Broadband sonar signal processor and target recognition system.
  13. Soiferman Jacob (Winnipeg CAX), Contactless test method and system for testing printed circuit boards.
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  15. Zeh Robert M. (East Berne NY), Electro-luminescent method and testing system for unpopulated printed circuit boards, ceramic substrates, and the like h.
  16. Hosaka Akio (Yokohama JPX), Electronic control system for internal combustion engine with stall preventive feature and method for performing stall p.
  17. Eichman Eric C. (Phoenix AZ) Sommer Bruce A. (Phoenix AZ) Churley Michael J. (Tempe AZ) Ramsey W. Chuck (Tempe AZ), Elimination of low temperature ammonia salt in TiCl4NH3 CVD reaction.
  18. Gelernt Barry (Bridgeport CT) Wang C. Wallace (Wilton CT), End-point detection in plasma etching or phosphosilicate glass.
  19. Isobe Toshiaki (Nagoya JPX) Yokoyama Tatsuo (Kakogawa JPX), Feedback type air fuel ratio controlling system.
  20. Fairbairn Kevin (Saratoga CA) Nowak Romuald (Cupertino CA), High density plasma CVD and etching reactor.
  21. Ishizaka Yuji (Tokyo JPX), High frequency electronic welding system.
  22. Gifford George G. (Bethel CT) O\Neill James A. (New City NY), Infrared thermographic method and apparatus for etch process monitoring and control.
  23. Barna Gabriel G. (Richardson TX), Measurement of gas leaks into gas lines of a plasma reactor.
  24. Tokuda Hiroastu (Katsuta JPX) Furuhashi Toshio (Mito JPX), Method and apparatus for controlling an internal combustion engine, particularly the starting up of the engine.
  25. Birang Manoocher (Los Gatos CA), Method and apparatus for displaying process endpoint signal based on emission concentration within a processing chamber.
  26. Geisel Donald J. (Clifton Park NY), Method and apparatus for electrical and optical inspection and testing of unpopulated printed circuit boards and other l.
  27. Nulty James E. (San Jose CA), Method and apparatus for end point detection.
  28. Ghanayem Steve G. (Sunnyvale CA), Method and apparatus for etchback endpoint detection.
  29. Mizutani Tatsumi (Kokubunji JPX) Ueki Kazuyoshi (Ohme JPX) Iida Shinya (Tama JPX) Komatsu Hideo (Tokyo JPX), Method and apparatus for monitoring etching.
  30. Ogawa Yoshifumi (Kudamatsu JPX) Nishiumi Masaharu (Kudamatsu JPX) Tanaka Yoshie (Kudamatsu JPX) Okudaira Sadayuki (Oume JPX) Nishimatsu Shigeru (Kokubunji JPX), Method and apparatus for monitoring etching.
  31. O\Neill James A. (New City NY) Passow Michael L. (Pleasant Valley NY) Singh Jyothi (Hopewell Junction NY), Method and apparatus for optical emission end point detection in plasma etching processes.
  32. Garst John M. (Blacklick OH), Method and apparatus for preparing intermediate polyester resin.
  33. Saito Susumu (Yamanashi-ken JPX) Koshimizu Chishio (Yamanashi-ken JPX) Eguchi Kazuo (Yamanashi-ken JPX), Method and device for detecting the end point of plasma process.
  34. Gifford George G. (Bethel CT) Osborn Brock E. (Hyde Park NY), Method and system employing optical emission spectroscopy for monitoring and controlling semiconductor fabrication.
  35. Gifford George G. (Poughkeepsie NY) Osborn Brock E. (Hyde Park NY), Method and system for analyzing plasma data.
  36. Aoki Kazutsugu (Kanagawa JPX), Method for controlling plasma surface-treatments with a plurality of photodetectors and optical filters.
  37. Tada Keiji (Kudamatsu JPX) Fujii Takashi (Kudamatsu JPX) Marumoto Gen (Kudamatsu JPX) Jyouo Kazuhiro (Kudamatsu JPX) Fujisawa Takahiro (Yanai JPX), Method of and apparatus for detecting an end point of plasma treatment.
  38. Mase Yasukazu (Tokyo JPX) Abe Masahiro (Yokohama JPX) Hirata Osamu (Kawasaki JPX), Method of determining end of cleaning of semiconductor manufacturing apparatus.
  39. Fong Gary ; Xia Li-Qun ; Nemani Srinivas ; Yieh Ellie, Methods and apparatus for cleaning surfaces in a substrate processing system.
  40. Angell David (Poughkeepsie NY) Chou Paul Bao-Luo (Montvale NJ) Lee Antonio Rogelio (White Plains NY) Sturzenbecker Martin Clarence (Carmel NY), Monitoring and controlling plasma processes via optical emission using principal component analysis.
  41. Cheng David (San Jose CA), Multi-channel plasma discharge endpoint detection method.
  42. Matossian Jesse N. (Canoga Park CA) Vajo John J. (Calabasas CA), Nondestructive determination of plasma processing treatment characteristics.
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  45. Williams Larry (Milpitas CA) Pirkle David R. (Soquel CA) Harshbarger William (San Jose CA) Ebel Timothy (San Jose CA), Plasma cleaning method for removing residues in a plasma process chamber.
  46. Chen Ching-Hwa (Milpitas CA) Arnett David (Fremont CA) Liu David (San Jose CA), Plasma cleaning method for removing residues in a plasma treatment chamber.
  47. Horioka, Keiji; Yoshida, Yukimasa; Koyama, Shiro, Plasma etching apparatus.
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  62. Maydan Dan (Los Altos Hills CA) Somekh Sasson R. (Redwood City CA) Ryan-Harris Charles (La Honda CA) Seilheimer Richard A. (Pleasanton CA) Cheng David (San Jose CA) Abolnikov Edward M. (San Francisco, Semiconductor processing system with robotic autoloader and load lock.
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  64. Mozumder Purnendu K. (Plano TX) Barna Gabe G. (Richardson both of TX), System and method for controlling semiconductor wafer processing.
  65. Dimitrelis Dimitrios (Palo Alto CA) Gabriel Calvin T. (Cupertino CA) Dunton Samuel V. (San Jose CA), System and method for plasma etching endpoint detection.
  66. Husseiny Abdo A. (LaPlace LA), System for prognosis and diagnostics of failure and wearout monitoring and for prediction of life expectancy of helicopt.
  67. Bennett Reid S. (Wappingers Falls NY) Ephrath Linda M. (LaGrange NY) Schwartz Geraldine C. (Poughkeepsie NY) Selwyn Gary S. (Hopewell Junction NY), Trench etch endpoint detection by LIF.
  68. Lowrance Robert B. (Los Gatos CA), Two-axis magnetically coupled robot.
  69. Haseley Robert K. (Mooresville NC) Kirkpatrick Paul A. (Charlotte NC), Vibration monitoring system.
  70. Nicholson Jamie (Foster City CA) McEachern Alexander (Oakland CA), Waveform library for characterizing an AC power line spectrum.

이 특허를 인용한 특허 (8)

  1. Hosch, Jimmy W.; Goeckner, Matthew J.; Whelan, Mike; Kueny, Andrew Weeks; Harvey, Kenneth C.; Thamban, P.L. Stephan, Electron beam exciter for use in chemical analysis in processing systems.
  2. Rulkens, Ron; Florin, Didier, Endpoint detection for high density plasma (HDP) processes.
  3. Smith, Jr., Michael Lane; Ward, Pamela Denise Peardon; Stevenson, Joel O'Don, Method & apparatus for monitoring plasma processing operations.
  4. Michael Lane Smith, Jr. ; Joel O'Don Stevenson ; Pamela Peardon Denise Ward, Method and apparatus for monitoring plasma processing operations.
  5. Michael Lane Smith, Jr. ; Pamela Denise Peardon Ward ; Joel O'Don Stevenson, Method and apparatus for monitoring plasma processing operations.
  6. Smith,Bradley C.; James,David, Method of removing PECVD residues of fluorinated plasma using in-situ Hplasma.
  7. Howald, Arthur M.; Valcore, Jr., John C., Systems and methods for using multiple inductive and capacitive fixtures for applying a variety of plasma conditions to determine a match network model.
  8. Paterson, Alexander; Todorov, Valentin N.; McChesney, Jon; Schneider, Gerhard M.; Palagashvili, David; Holland, John P.; Barnes, Michael S., Tandem etch chamber plasma processing system.

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