$\require{mediawiki-texvc}$
  • 검색어에 아래의 연산자를 사용하시면 더 정확한 검색결과를 얻을 수 있습니다.
  • 검색연산자
검색도움말
검색연산자 기능 검색시 예
() 우선순위가 가장 높은 연산자 예1) (나노 (기계 | machine))
공백 두 개의 검색어(식)을 모두 포함하고 있는 문서 검색 예1) (나노 기계)
예2) 나노 장영실
| 두 개의 검색어(식) 중 하나 이상 포함하고 있는 문서 검색 예1) (줄기세포 | 면역)
예2) 줄기세포 | 장영실
! NOT 이후에 있는 검색어가 포함된 문서는 제외 예1) (황금 !백금)
예2) !image
* 검색어의 *란에 0개 이상의 임의의 문자가 포함된 문서 검색 예) semi*
"" 따옴표 내의 구문과 완전히 일치하는 문서만 검색 예) "Transform and Quantization"

통합검색

도움말도움말
상세검색 다국어 입력

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

특허 상세정보

MyON담기
내보내기 페이스북 공유 카카오톡 공유

Advanced RF electronics package

특허상세정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H01L-023/34   
미국특허분류(USC) 257/728 ; 257/703 ; 257/704 ; 257/724
출원번호 US-0057041 (1998-04-08)
발명자 / 주소
  • Hathaway James A.
  • Brunone David J.
  • Reyes Michelle M.
출원인 / 주소
  • TRW Inc.
대리인 / 주소
    Yatsko
인용정보 피인용 횟수 : 19  인용 특허 : 35
초록
▼

An advanced electronics package for integrating electronic components of an electronic circuit, such as RF circuits. An important aspect of the invention relates to the simplicity in forming and integrating the electronic components in the package relative to known electronics packages. In one embodiment of the invention, various ceramic preforms are utilized which may be cast with temperature durable electronic components or formed as interconnect channels or feedthroughs. The preforms, in turn, are adapted to be cast into a composite housing, for examp...

대표
청구항
▼

[ We claim:] [1.]1. An electronics package for housing one or more electronics components forming a circuit, the electronics package comprising:one or more first electronic components, said first electronic components cast in ceramic forming one or more first modular ceramic preforms;one or more interconnect channels, cast in ceramic forming second modular preforms for connecting to said one or more first electronic components in said first modular ceramic preform; anda cast housing, said cast housing cast with first and second modular ceramic preforms a...

인용문헌 (35)

  1. Howard James R. (Santa Clara CA) Lucas Gregory L. (Newark CA) Bryan Scott K. (San Jose CA) Choe Jin S. (San Jose CA), Annular resistor coupled with printed circuit board through-hole.
  2. Kennerknecht Steven (629 Les Esables Laval sur la Lac ; Quebec CAX), Casting method for metal matrix composite castings.
  3. Malbe Serge (Gif sur Yvette FRX) Da Silva Evelyne (Massy FRX) Fouch Alain (Paris FRX), Device for interconnection and protection of a bare microwave component chip.
  4. Nelson Stephen R. (Richardson TX) Carter ; Jr. Buford H. (Richardson TX) Lahutsky Tammy J. (Plano TX) Haas Glen R. (Plano TX) Davis Dennis D. (Garland TX) Suckling Charles W. (Rushden GB2) Collinson , Device packaging.
  5. Stein Adolph J. (Santa Barbara CA), Electronic hardware package.
  6. Mosher Mark D. (Scottsdale AZ) Fraser Robert (Tempe AZ) Fuller Ronald D. (Mesa AZ), Electrostatic RF absorbant circuit carrier assembly and method for making the same.
  7. Yun David I. (Murrysville PA) Sawtell Ralph R. (Monroeville PA) Hunt Warren H. (Export PA) Baumgartner H. Robert (Monroeville PA) Streicher Eric T. (New Kensington PA) Ehman Michael F. (Franklin Park, Fabrication of metal matrix composites by vacuum die casting.
  8. Taylor William J. (Anoka MN) Lessar Joseph F. (Coon Rapids MN), Feed through.
  9. Pollock John A. (c/o Product Engineering Associates Inc. ; P.O. Box 269 Wilton NH 03086), Hermetically sealed feedthroughs and methods of making same.
  10. Eda Kazuo (Nara JPX) Taguchi Yutaka (Settsu JPX) Miyauchi Katsuyuki (Neyagawa JPX), High frequency ceramic multi-layer substrate.
  11. Shibagaki Nobuhiko (Hachioji JPX) Hikita Mitsutaka (Hachioji JPX) Tabuchi Toyoji (Yokohama JPX) Akagi Takatoshi (Kokubunji JPX) Wakamori Satoshi (Yokohama JPX) Matsumoto Tomomi (Hiratsuka JPX), High frequency circuit device.
  12. Anthony Thomas R. (Schenectady NY), Insulating glass body with electrical feedthroughs and method of preparation.
  13. Anthony, Thomas R., Insulating glass body with electrical feedthroughs and method of preparation.
  14. Koepf Gerhard A. (Boulder CO), Interconnect package having means for waveguide transmission of RF signals.
  15. Pavio Jeanne S. (Phoenix AZ), Leadframe having metal impregnated silicon carbide mounting area.
  16. Polinski ; Sr. Paul W. (Dana Point CA), Low temperature cofired ceramic packages for microwave and millimeter wave gallium arsenide integrated circuits.
  17. Lehman George R. (Port Jones CA) Bilski Stacey M. (Santa Barbara CA) Miller Steven W. (Santa Barbara CA), MMIC package and connector.
  18. Anderson W. Kyle (Rockford IL) Hoppe Richard J. (Rockford IL) Durako ; Jr. William J. (Rockford IL) Metzler Mark (Davis IL) Hughes Lawrence (Rockford IL) Jackson Stephen E. (Rockford IL), Metal matrix composite semiconductor power switch assembly.
  19. Smith Charles (Ramona CA) Akhtar Masyood (San Diego CA) Chau Michael M. (San Diego CA) Savage David (San Diego CA), Metal-ceramic composite lid.
  20. Yarahmadi Mohamed (Fulda DEX), Method for producing a ceramic-coated metallic component.
  21. Cook Arnold J. (372 N. Craig St. Pittsburgh PA 15213), Method of forming a metal matrix component with internal and external structures.
  22. Newkirk Marc S. (Newark DE) White Danny R. (Elkton MD) Kennedy Christopher R. (Newark DE) Nagelberg Alan S. (Wilmington DE) Aghajanian Michael K. (Bel Air MD) Wiener Robert J. (Newark DE) Keck Steven, Method of forming electronic packages.
  23. Goetz Martin (San Diego CA) Babiarz Joseph (San Diego CA), Method of making ceramic microwave electronic package.
  24. Mitoff Stephan P. (Clifton Park NY) Charles Richard J. (Schenectady NY) Pasco Wayne D. (Scotia NY), Method of making hermetic feedthrough in ceramic substrate.
  25. Saffari Akbar (Freeport IL), Method of producing a hermetic glass to metal seal without metal oxidation.
  26. Keck Steven D. (Hockessin DE) Rocazella Michael A. (Newark DE) Engelgau Peter M. (Dover DE) Hannon Gregory E. (Newark DE) White Danny R. (Elkton MD) Nagelberg Alan S. (Wilmington DE), Methods of forming electronic packages.
  27. Baird Phillips C. (Lakeville MA) Greenspan Jay S. (South Dartmouth MA), Microwave chip carrier.
  28. Nishioka Yasuhiko (Kanagawa JPX) Kawano Hazime (Kanagawa JPX) Inami Kazuyoshi (Kanagawa JPX), Microwave integrated circuit mountings.
  29. Li Kuo-Hsin (Irvine CA), Microwave monolithic integrated circuit package with improved RF ports.
  30. Mandai Harufumi (Kyoto JPX) Sugo Kimihide (Kyoto JPX), Multilayer ceramic circuit board.
  31. Cook Arnold J. (Mt. Pleasant PA), Plating for metal matrix composites.
  32. Azzaro Thomas Peter (Burlington NJ) Thaler Barry Jay (Mercer NJ) Conlon Edward James (Mercer NJ) Kumar Ananda Hosakere (Plainsboro NJ), Process for making electrical feedthroughs for ceramic circuit board support substrates.
  33. Kaneko Tsugio (Kitakyushu JPX) Kimura Tsuneo (Kitakyushu JPX) Ikeda Michihiro (Kitakyushu JPX) Utsunomiya Akira (Kitakyushu JPX) Ohno Yuka (Kitakyushu JPX), Process for producing a ceramic preform.
  34. Bier Larry J. (San Jose CA), Radio frequency feedthrough seal and method.
  35. Smith Hal D. (Rancho Palos Verdes CA) McClanahan Robert F. (Valencia CA) Shapiro Andrew A. (Orange CA) Pelzman George (Segundo CA), Via capacitors within multi-layer, 3 dimensional structures/substrates.

이 특허를 인용한 특허 (19)

  1. Goren, Yehuda G.; Chen, Tong, Asymmetrical slow wave structures to eliminate backward wave oscillations in wideband traveling wave tubes.
  2. Hool,Vincent, Bypass capacitor embedded flip chip package lid and stiffener.
  3. Lor, Jason; Nangia, Siddharth, Electronic devices with housing-based interconnects and coupling structures.
  4. White, George E.; Dalmia, Sidharth; Sundaram, Venkatesh; Swaminathan, Madhavan, Heterogeneous organic laminate stack ups for high frequency applications.
  5. White, George E.; Swaminathan, Madhavan; Sundaram, Venkatesh; Dalmia, Sidharth, Integrated passive devices fabricated utilizing multi-layer, organic laminates.
  6. White, George E.; Dalmia, Sidharth, Integration using package stacking with multi-layer organic substrates.
  7. Ables, Billy D.; Ehmke, John C.; Gooch, Roland W., Method and apparatus for packaging circuit devices.
  8. Ables, Billy D.; Ehmke, John C.; Gooch, Roland W., Method and apparatus for packaging circuit devices.
  9. Ables, Billy D.; Ehmke, John C.; Gooch, Roland W., Method and apparatus for packaging circuit devices.
  10. White, George E.; Swaminathan, Madhavan; Sundaram, Venkatesh; Dalmia, Sidharth, Method for fabricating three-dimensional all organic interconnect structures.
  11. Carastro,Lawrence A.; Lapushin,Semyon; Dalmia,Sidharth; Czakon,Winston; White,George, Methods and apparatuses for high-performing multi-layer inductors.
  12. White,George E.; Swaminathan,Madhavan; Sundaram,Venkatesh; Dalmia,Sidharth, Methods for fabricating three-dimensional all organic interconnect structures.
  13. Chen, Tong; Chai, Suchet P., Microwave device and method for making same.
  14. Govind,Vinu; Dalmia,Sidharth; Bavisi,Amit; Sundraram,Venkatesh; Swaminathan,Madhavan; White,George, Multi-band RF transceiver with passive reuse in organic substrates.
  15. Williams, Anthony David, Noise canceling technique for frequency synthesizer.
  16. Goren, Yehuda G.; Lally, Philip M., Slow wave structure having offset projections comprised of a metal-dielectric composite stack.
  17. White,George E.; Swaminathan,Madhavan; Sundaram,Venkatesh; Dalmia,Sidharth, Stand-alone organic-based passive devices.
  18. Sharma, Vikas, Switchable die seal connection.
  19. White, George E.; Dalmia, Sidharth, Systems and methods for integrated antennae structures in multilayer organic-based printed circuit devices.

IPC 상위 출원인