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Apparatus for cooling a heat generating component in a computer 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
  • F28D-015/00
  • G06F-001/20
출원번호 US-0416688 (1999-10-12)
발명자 / 주소
  • Broder Damon
  • Hood
  • III Charles D.
출원인 / 주소
  • Dell USA, L.P.
대리인 / 주소
    Haynes and Boone, L.L.P.
인용정보 피인용 횟수 : 90  인용 특허 : 24

초록

A computer including a microprocessor, an input coupled to provide input to the microprocessor, a mass storage coupled to the microprocessor and a memory coupled to the microprocessor to provide storage to facilitate execution of computer programs by the microprocessor. A heat pipe including spaced

대표청구항

[ What is claimed is:] [1.]1. A cooling system for a computer, comprising:a heat pipe including spaced apart condenser regions with an evaporator region disposed therebetween;a first heat dissipating device attached to the heat pipe adjacent to a first one of the condenser regions; anda second heat

이 특허에 인용된 특허 (24)

  1. Bhatia Rakesh, Airflow heat exchanger for a portable computing device and docking station.
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  14. Bhatia Rakesh, Flat fan heat exchanger and use thereof in a computing device.
  15. Wada Kouji (Fuji JPX), Heat exchanger having in fins flow passageways constituted by heat exchange pipes and U-bend portions.
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  24. Kobayashi Takashi,JPX, Thermo-siphon and manufacturing method of thermo-siphon and information processing apparatus.

이 특허를 인용한 특허 (90)

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