초록 ▼

A cooling apparatus for cooling a heating body such as a CPU by boiling and condensing refrigerant has a tank having a heating body mounting portion on which the CPU is mounted; a porous metallic sintered body arranged in the tank; and refrigerant contained in the tank. The tank has a pair of faced

A cooling apparatus for cooling a heating body such as a CPU by boiling and condensing refrigerant has a tank having a heating body mounting portion on which the CPU is mounted; a porous metallic sintered body arranged in the tank; and refrigerant contained in the tank. The tank has a pair of faced walls including a heat-receiving wall and a radiation wall. The porous metallic sintered body is arranged along the heat-receiving wall, and transports the refrigerant collected at the bottom of the tank to an adjacent portion of the heating body mounting portion by using a capillary action. Since the refrigerant is boiled at such a wide adjacent portion, a superheat degree of the heating body mounting portion can decrease. Furthermore, since the refrigerant collected at the bottom of the tank is transported to the adjacent portion by the capillary action, an area of the radiation wall soaked in the refrigerant becomes small. As a result, a condensation area for condensing the vapor refrigerant becomes large, and then the supercool degree of the radiation wall can decrease. In this way, a cooling capacity of the cooling apparatus can increase.

대표청구항 ▼

[ What is claimed is:] [1.]1. A cooling apparatus for boiling and condensing refrigerant, comprising:a tank for containing refrigerant therein, the tank having a heating body mounting portion to mount a heating body thereon, a heat-receiving wall, a radiation wall, and a vapor passage through which

[ What is claimed is:] [1.]1. A cooling apparatus for boiling and condensing refrigerant, comprising:a tank for containing refrigerant therein, the tank having a heating body mounting portion to mount a heating body thereon, a heat-receiving wall, a radiation wall, and a vapor passage through which a vapor refrigerant flows;a wick disposed in the tank for transporting the refrigerant to an adjacent portion adjacent to the heating body mounting portion by capillary action; andcondensation fins disposed in the tank that thermally connect to at least the radiation wall,wherein a fin pitch of the condensation fins is set to be equal or less than a maximum value that can secure a necessary condensation area and is set to be equal to or more than an average bubble radius of bubbles of the refrigerant released from an inner surface of the tank as a result of boiling, anda length of each of the condensation fin is set as shorter closer to the vapor passage.