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특허 상세정보

Cooling apparatus by boiling and cooling refrigerant

특허상세정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) F28D-015/00    H05K-007/20    H01L-023/34   
미국특허분류(USC) 165/080.4 ; 165/104.33 ; 165/104.26 ; 361/700 ; 257/715
출원번호 US-0317382 (1999-05-24)
우선권정보 JP0141388 (1999-05-21)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Harness, Dickey & Pierce, PLC
인용정보 피인용 횟수 : 55  인용 특허 : 10
초록

A cooling apparatus for cooling a heating body such as a CPU by boiling and condensing refrigerant has a tank having a heating body mounting portion on which the CPU is mounted; a porous metallic sintered body arranged in the tank; and refrigerant contained in the tank. The tank has a pair of faced walls including a heat-receiving wall and a radiation wall. The porous metallic sintered body is arranged along the heat-receiving wall, and transports the refrigerant collected at the bottom of the tank to an adjacent portion of the heating body mounting port...

대표
청구항

[ What is claimed is:] [1.]1. A cooling apparatus for boiling and condensing refrigerant, comprising:a tank for containing refrigerant therein, the tank having a heating body mounting portion to mount a heating body thereon, a heat-receiving wall, a radiation wall, and a vapor passage through which a vapor refrigerant flows;a wick disposed in the tank for transporting the refrigerant to an adjacent portion adjacent to the heating body mounting portion by capillary action; andcondensation fins disposed in the tank that thermally connect to at least the ra...

이 특허를 인용한 특허 피인용횟수: 55

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